JPS5237971B1 - - Google Patents

Info

Publication number
JPS5237971B1
JPS5237971B1 JP8458070A JP8458070A JPS5237971B1 JP S5237971 B1 JPS5237971 B1 JP S5237971B1 JP 8458070 A JP8458070 A JP 8458070A JP 8458070 A JP8458070 A JP 8458070A JP S5237971 B1 JPS5237971 B1 JP S5237971B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8458070A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5237971B1 publication Critical patent/JPS5237971B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
JP8458070A 1970-02-05 1970-09-25 Pending JPS5237971B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US906070A 1970-02-05 1970-02-05

Publications (1)

Publication Number Publication Date
JPS5237971B1 true JPS5237971B1 (en) 1977-09-26

Family

ID=21735359

Family Applications (3)

Application Number Title Priority Date Filing Date
JP8458070A Pending JPS5237971B1 (en) 1970-02-05 1970-09-25
JP696174A Pending JPS5373429A (en) 1970-02-05 1974-01-11 Method of sensitizing nonnelectric plating base material
JP696074A Pending JPS5426495B1 (en) 1970-02-05 1974-01-11

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP696174A Pending JPS5373429A (en) 1970-02-05 1974-01-11 Method of sensitizing nonnelectric plating base material
JP696074A Pending JPS5426495B1 (en) 1970-02-05 1974-01-11

Country Status (12)

Country Link
US (1) US3682671A (en)
JP (3) JPS5237971B1 (en)
AT (1) AT308487B (en)
CA (1) CA931301A (en)
CH (1) CH564094A5 (en)
DE (1) DE2105898C3 (en)
DK (1) DK144919C (en)
ES (1) ES387979A1 (en)
FR (1) FR2078132A5 (en)
GB (1) GB1306201A (en)
NL (1) NL165790C (en)
SE (1) SE427189B (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4662944A (en) * 1972-07-11 1987-05-05 Kollmorgen Technologies Corporation Process and composition for sensitizing articles for metallization
US3960573A (en) * 1972-08-07 1976-06-01 Photocircuits Division Of Kollmorgan Corporation Novel precious metal sensitizing solutions
CA1005808A (en) * 1973-06-27 1977-02-22 Shipley Company Inc. Catalyst solution for electroless metal deposition on a substrate
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
CA1021761A (en) * 1973-08-01 1977-11-29 Kollmorgen Corporation Sensitizers for electroless metal deposition
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
US3963841A (en) * 1975-01-06 1976-06-15 International Business Machines Corporation Catalytic surface preparation for electroless plating
US4239538A (en) * 1976-03-30 1980-12-16 Surface Technology, Inc. Catalytic primer
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4259113A (en) * 1976-05-26 1981-03-31 Kollmorgen Technologies Corporation Composition for sensitizing articles for metallization
US4066809A (en) * 1976-06-28 1978-01-03 International Business Machines Corporation Method for preparing substrate surfaces for electroless deposition
ZA774561B (en) * 1976-09-20 1978-06-28 Kollmorgen Tech Corp Preparation of solid precious metal sensitizing compositions
DE2659680C2 (en) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Procedure for activating surfaces
IT1107840B (en) * 1978-07-25 1985-12-02 Alfachimici Spa CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION
JPS59500870A (en) * 1982-05-26 1984-05-17 マツクダ−ミツド　インコ−ポレ−テツド Non-conductive substrate activated catalyst solution and electroless plating method
DE3323476A1 (en) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. IMPROVED METHOD FOR GALVANIC METAL DEPOSITION ON NON-METALLIC SURFACES
US4592929A (en) * 1984-02-01 1986-06-03 Shipley Company Inc. Process for metallizing plastics
US4610895A (en) * 1984-02-01 1986-09-09 Shipley Company Inc. Process for metallizing plastics
US4717421A (en) * 1986-04-28 1988-01-05 Mcgean-Rohco, Inc. Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids
DE3843903C1 (en) * 1988-12-24 1990-06-28 Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De Activation solution for electrically non-conductive plastic substrate surfaces and process for the preparation thereof and the use thereof
DE3928500A1 (en) * 1989-08-29 1991-03-14 Deutsche Automobilgesellsch METHOD FOR WASHING AND RINSING CHEMICALLY METALLIZED SUBSTRATE RAILS
US5292557A (en) * 1992-11-16 1994-03-08 Allied-Signal Inc. Electroless plating of substrates
US5418064A (en) * 1992-11-16 1995-05-23 Allied Signal Inc. Electroless plating of substrates
ES2257987T3 (en) * 1993-03-18 2006-08-16 Atotech Deutschland Gmbh COMPOSITION AND PROCEDURE TO TREAT A COVERED SURFACE WITH A SELF-LOADING AND SELF-COOLING IMMERSION COATING, WITHOUT FORMALDEHYDE.
US6261637B1 (en) * 1995-12-15 2001-07-17 Enthone-Omi, Inc. Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication
US5753304A (en) * 1997-06-23 1998-05-19 The Metal Arts Company, Inc. Activation bath for electroless nickel plating
PL1988192T3 (en) * 2007-05-03 2013-04-30 Atotech Deutschland Gmbh Process for applying a metal coating to a non-conductive substrate
JP5458758B2 (en) * 2009-09-11 2014-04-02 上村工業株式会社 Catalyst application solution and electroless plating method and direct plating method using the same
EP2305856A1 (en) 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
EP2767614A1 (en) 2013-02-13 2014-08-20 ATOTECH Deutschland GmbH Method for depositing a first metallic layer onto non-conductive polymers
JP5649150B1 (en) * 2014-07-17 2015-01-07 日本エレクトロプレイテイング・エンジニヤース株式会社 Pretreatment liquid for electroless plating and electroless plating method
CZ309565B6 (en) * 2022-02-02 2023-04-12 EGO 93 s.r.o Sensitizing solution and preparing it

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
DE1446224B2 (en) * 1960-09-01 1971-09-16 Photocircuits Corp , Glen Cove, NY (V St A ) ACID, Aqueous SOLUTION FOR SENSITIZING SURFACES FOR THE SUBSEQUENT ELECTRIC METAL DEPOSITION
GB1174851A (en) * 1967-07-05 1969-12-17 Technograph Ltd Sensitization Process for Electroless Plating

Also Published As

Publication number Publication date
FR2078132A5 (en) 1971-11-05
DE2105898A1 (en) 1971-09-02
CA931301A (en) 1973-08-07
GB1306201A (en) 1973-02-07
DE2105898C3 (en) 1982-08-19
JPS5373429A (en) 1978-06-29
CH564094A5 (en) 1975-07-15
US3682671A (en) 1972-08-08
ES387979A1 (en) 1973-06-01
DE2105898B2 (en) 1975-07-31
SE427189B (en) 1983-03-14
DK144919C (en) 1982-11-22
NL165790B (en) 1980-12-15
NL7101596A (en) 1971-08-09
JPS5426495B1 (en) 1979-09-04
DK144919B (en) 1982-07-05
NL165790C (en) 1981-05-15
AT308487B (en) 1973-07-10

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