JPS5237767A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5237767A
JPS5237767A JP50113858A JP11385875A JPS5237767A JP S5237767 A JPS5237767 A JP S5237767A JP 50113858 A JP50113858 A JP 50113858A JP 11385875 A JP11385875 A JP 11385875A JP S5237767 A JPS5237767 A JP S5237767A
Authority
JP
Japan
Prior art keywords
semiconductor device
contact connection
protrusive
electrode
draws
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50113858A
Other languages
Japanese (ja)
Inventor
Masatake Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50113858A priority Critical patent/JPS5237767A/en
Publication of JPS5237767A publication Critical patent/JPS5237767A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Bipolar Transistors (AREA)

Abstract

PURPOSE: In a semiconductor device which draws an external electrode terminal by contact connection from a protrusive electrode, molding of a built-up projection is easy and a protrusive electrode that insures contact connection is formed.
COPYRIGHT: (C)1977,JPO&Japio
JP50113858A 1975-09-19 1975-09-19 Semiconductor device Pending JPS5237767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50113858A JPS5237767A (en) 1975-09-19 1975-09-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50113858A JPS5237767A (en) 1975-09-19 1975-09-19 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5237767A true JPS5237767A (en) 1977-03-23

Family

ID=14622830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50113858A Pending JPS5237767A (en) 1975-09-19 1975-09-19 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5237767A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103194A (en) * 2012-11-19 2014-06-05 Fujitsu Ltd Semiconductor device and method for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4327738Y1 (en) * 1965-09-03 1968-11-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4327738Y1 (en) * 1965-09-03 1968-11-15

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103194A (en) * 2012-11-19 2014-06-05 Fujitsu Ltd Semiconductor device and method for manufacturing the same

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