JPS5234673A - Cooling apparatus of semiconductor device - Google Patents

Cooling apparatus of semiconductor device

Info

Publication number
JPS5234673A
JPS5234673A JP11937176A JP11937176A JPS5234673A JP S5234673 A JPS5234673 A JP S5234673A JP 11937176 A JP11937176 A JP 11937176A JP 11937176 A JP11937176 A JP 11937176A JP S5234673 A JPS5234673 A JP S5234673A
Authority
JP
Japan
Prior art keywords
semiconductor device
cooling apparatus
fin body
localized
finx
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11937176A
Other languages
Japanese (ja)
Inventor
Hiroshi Iwata
Zensuke Tamura
Takeshi Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11937176A priority Critical patent/JPS5234673A/en
Publication of JPS5234673A publication Critical patent/JPS5234673A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain the device cooling fin body composition by which centering works of contact face of the finx body and the device are easily made, and also the spacing body contained in the fin body is easily localized in the fin body is easily localized and fized.
COPYRIGHT: (C)1977,JPO&Japio
JP11937176A 1976-10-06 1976-10-06 Cooling apparatus of semiconductor device Pending JPS5234673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11937176A JPS5234673A (en) 1976-10-06 1976-10-06 Cooling apparatus of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11937176A JPS5234673A (en) 1976-10-06 1976-10-06 Cooling apparatus of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5234673A true JPS5234673A (en) 1977-03-16

Family

ID=14759836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11937176A Pending JPS5234673A (en) 1976-10-06 1976-10-06 Cooling apparatus of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5234673A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5441554U (en) * 1977-08-30 1979-03-20
US7066240B2 (en) 1999-05-12 2006-06-27 Thermal Corp Integrated circuit heat pipe heat spreader with through mounting holes

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS445571Y1 (en) * 1968-08-29 1969-02-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS445571Y1 (en) * 1968-08-29 1969-02-28

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5441554U (en) * 1977-08-30 1979-03-20
JPS5723897Y2 (en) * 1977-08-30 1982-05-24
US7066240B2 (en) 1999-05-12 2006-06-27 Thermal Corp Integrated circuit heat pipe heat spreader with through mounting holes
US7100680B2 (en) 1999-05-12 2006-09-05 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes

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