JPS5229749A - Optical equipment and its manufacturing process - Google Patents
Optical equipment and its manufacturing processInfo
- Publication number
- JPS5229749A JPS5229749A JP10619875A JP10619875A JPS5229749A JP S5229749 A JPS5229749 A JP S5229749A JP 10619875 A JP10619875 A JP 10619875A JP 10619875 A JP10619875 A JP 10619875A JP S5229749 A JPS5229749 A JP S5229749A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing process
- optical
- optical equipment
- optical element
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
Abstract
PURPOSE:Optical element and optical guide section are connected free to be detached by connecting the optical guide section to the optical transmission section which receives or emits light of the optical element mounted on a substrate 20 thru a guide hole formed on its enveloping material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10619875A JPS5229749A (en) | 1975-09-02 | 1975-09-02 | Optical equipment and its manufacturing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10619875A JPS5229749A (en) | 1975-09-02 | 1975-09-02 | Optical equipment and its manufacturing process |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5229749A true JPS5229749A (en) | 1977-03-05 |
JPS5731665B2 JPS5731665B2 (en) | 1982-07-06 |
Family
ID=14427465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10619875A Granted JPS5229749A (en) | 1975-09-02 | 1975-09-02 | Optical equipment and its manufacturing process |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5229749A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4410469A (en) * | 1980-11-28 | 1983-10-18 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for manufacturing a module for a fiber optic link |
EP0563010A2 (en) * | 1992-03-23 | 1993-09-29 | Ciba-Geigy Ag | Method of preparation of nucleosides |
JPH06204622A (en) * | 1992-10-14 | 1994-07-22 | Internatl Business Mach Corp <Ibm> | Optical module and sealing of capsule |
WO2014196263A1 (en) * | 2013-06-07 | 2014-12-11 | 株式会社村田製作所 | Optical component, optical plug, optical connector, and optical-component production method |
US20190129108A1 (en) * | 2017-10-31 | 2019-05-02 | Versalume LLC | Modular Laser Connector Packaging System and Method |
US10551542B1 (en) | 2018-12-11 | 2020-02-04 | Corning Incorporated | Light modules and devices incorporating light modules |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015180914A (en) * | 2014-03-04 | 2015-10-15 | 株式会社東芝 | Optical link device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4918344A (en) * | 1972-06-12 | 1974-02-18 | ||
JPS524852A (en) * | 1975-06-05 | 1977-01-14 | Western Electric Co | Sealing of device capsule unit |
-
1975
- 1975-09-02 JP JP10619875A patent/JPS5229749A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4918344A (en) * | 1972-06-12 | 1974-02-18 | ||
JPS524852A (en) * | 1975-06-05 | 1977-01-14 | Western Electric Co | Sealing of device capsule unit |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4410469A (en) * | 1980-11-28 | 1983-10-18 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for manufacturing a module for a fiber optic link |
EP0563010A2 (en) * | 1992-03-23 | 1993-09-29 | Ciba-Geigy Ag | Method of preparation of nucleosides |
EP0563010A3 (en) * | 1992-03-23 | 1994-09-14 | Ciba Geigy Ag | Method of preparation of nucleosides |
JPH06204622A (en) * | 1992-10-14 | 1994-07-22 | Internatl Business Mach Corp <Ibm> | Optical module and sealing of capsule |
WO2014196263A1 (en) * | 2013-06-07 | 2014-12-11 | 株式会社村田製作所 | Optical component, optical plug, optical connector, and optical-component production method |
JP5892292B2 (en) * | 2013-06-07 | 2016-03-23 | 株式会社村田製作所 | Optical plug and optical connector |
US20190129108A1 (en) * | 2017-10-31 | 2019-05-02 | Versalume LLC | Modular Laser Connector Packaging System and Method |
US10838158B2 (en) | 2017-10-31 | 2020-11-17 | Corning Incorporated | Modular laser connector packaging system and method |
US10551542B1 (en) | 2018-12-11 | 2020-02-04 | Corning Incorporated | Light modules and devices incorporating light modules |
US10598840B1 (en) | 2018-12-11 | 2020-03-24 | Corning Incorporated | Light modules and devices incorporating light modules |
US10768352B2 (en) | 2018-12-11 | 2020-09-08 | Corning Incorporated | Light modules and devices incorporating light modules |
Also Published As
Publication number | Publication date |
---|---|
JPS5731665B2 (en) | 1982-07-06 |
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