JPS5228275A - Semiconductive rectifier - Google Patents

Semiconductive rectifier

Info

Publication number
JPS5228275A
JPS5228275A JP50103455A JP10345575A JPS5228275A JP S5228275 A JPS5228275 A JP S5228275A JP 50103455 A JP50103455 A JP 50103455A JP 10345575 A JP10345575 A JP 10345575A JP S5228275 A JPS5228275 A JP S5228275A
Authority
JP
Japan
Prior art keywords
semiconductive
rectifier
make
radiative electrode
whisker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50103455A
Other languages
Japanese (ja)
Other versions
JPS5845825B2 (en
Inventor
Takahiro Sawano
Tetsuo Machii
Masaru Ando
Fumio Tanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP50103455A priority Critical patent/JPS5845825B2/en
Publication of JPS5228275A publication Critical patent/JPS5228275A/en
Publication of JPS5845825B2 publication Critical patent/JPS5845825B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To make some concavity and convex on the radiative electrode and to make a contact surface of whisker to the fixed shape to get rid of the loose connection and rotation between the radiative electrode and the covering material.
COPYRIGHT: (C)1977,JPO&Japio
JP50103455A 1975-08-28 1975-08-28 handmade seaweed Expired JPS5845825B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50103455A JPS5845825B2 (en) 1975-08-28 1975-08-28 handmade seaweed

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50103455A JPS5845825B2 (en) 1975-08-28 1975-08-28 handmade seaweed

Publications (2)

Publication Number Publication Date
JPS5228275A true JPS5228275A (en) 1977-03-03
JPS5845825B2 JPS5845825B2 (en) 1983-10-12

Family

ID=14354491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50103455A Expired JPS5845825B2 (en) 1975-08-28 1975-08-28 handmade seaweed

Country Status (1)

Country Link
JP (1) JPS5845825B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222847A (en) * 1988-07-11 1990-01-25 Toshiba Corp Semiconductor rectification element

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61225455A (en) * 1985-03-28 1986-10-07 大和ハウス工業株式会社 Roof snow melting apparatus
JPS62154114U (en) * 1986-03-24 1987-09-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222847A (en) * 1988-07-11 1990-01-25 Toshiba Corp Semiconductor rectification element

Also Published As

Publication number Publication date
JPS5845825B2 (en) 1983-10-12

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