JPS5218169A - Production method of semiconductor - Google Patents
Production method of semiconductorInfo
- Publication number
- JPS5218169A JPS5218169A JP9459475A JP9459475A JPS5218169A JP S5218169 A JPS5218169 A JP S5218169A JP 9459475 A JP9459475 A JP 9459475A JP 9459475 A JP9459475 A JP 9459475A JP S5218169 A JPS5218169 A JP S5218169A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- production method
- metal layer
- reproducibility
- lift
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE: In order to promote the reproducibility through improving the lift-off wiring method, by means of providing the gap between the metal layer being directly coated on the surface of base plate and the metal layer being formed on resist film.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9459475A JPS5845810B2 (en) | 1975-08-01 | 1975-08-01 | Pattern formation method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9459475A JPS5845810B2 (en) | 1975-08-01 | 1975-08-01 | Pattern formation method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5218169A true JPS5218169A (en) | 1977-02-10 |
JPS5845810B2 JPS5845810B2 (en) | 1983-10-12 |
Family
ID=14114592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9459475A Expired JPS5845810B2 (en) | 1975-08-01 | 1975-08-01 | Pattern formation method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5845810B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54156488A (en) * | 1978-05-31 | 1979-12-10 | Hitachi Ltd | Manufacture for semiconductor device |
JPS55105350A (en) * | 1979-02-07 | 1980-08-12 | Nec Corp | Semiconductor device |
US4882839A (en) * | 1988-04-22 | 1989-11-28 | Nec Corporation | Method of manufacturing multi-layered wiring substrate |
-
1975
- 1975-08-01 JP JP9459475A patent/JPS5845810B2/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54156488A (en) * | 1978-05-31 | 1979-12-10 | Hitachi Ltd | Manufacture for semiconductor device |
JPS55105350A (en) * | 1979-02-07 | 1980-08-12 | Nec Corp | Semiconductor device |
JPS6210027B2 (en) * | 1979-02-07 | 1987-03-04 | Nippon Electric Co | |
US4882839A (en) * | 1988-04-22 | 1989-11-28 | Nec Corporation | Method of manufacturing multi-layered wiring substrate |
Also Published As
Publication number | Publication date |
---|---|
JPS5845810B2 (en) | 1983-10-12 |
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