JPS52155466U - - Google Patents

Info

Publication number
JPS52155466U
JPS52155466U JP6506576U JP6506576U JPS52155466U JP S52155466 U JPS52155466 U JP S52155466U JP 6506576 U JP6506576 U JP 6506576U JP 6506576 U JP6506576 U JP 6506576U JP S52155466 U JPS52155466 U JP S52155466U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6506576U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6506576U priority Critical patent/JPS52155466U/ja
Publication of JPS52155466U publication Critical patent/JPS52155466U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • H01L2924/10158Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP6506576U 1976-05-20 1976-05-20 Pending JPS52155466U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6506576U JPS52155466U (en) 1976-05-20 1976-05-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6506576U JPS52155466U (en) 1976-05-20 1976-05-20

Publications (1)

Publication Number Publication Date
JPS52155466U true JPS52155466U (en) 1977-11-25

Family

ID=28529752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6506576U Pending JPS52155466U (en) 1976-05-20 1976-05-20

Country Status (1)

Country Link
JP (1) JPS52155466U (en)

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