JPS52144988A - Semiconductor light emitting element - Google Patents

Semiconductor light emitting element

Info

Publication number
JPS52144988A
JPS52144988A JP5352476A JP5352476A JPS52144988A JP S52144988 A JPS52144988 A JP S52144988A JP 5352476 A JP5352476 A JP 5352476A JP 5352476 A JP5352476 A JP 5352476A JP S52144988 A JPS52144988 A JP S52144988A
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
semiconductor light
stem
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5352476A
Other languages
Japanese (ja)
Inventor
Hirohisa Abe
Kazumi Unno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5352476A priority Critical patent/JPS52144988A/en
Publication of JPS52144988A publication Critical patent/JPS52144988A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: To increase light emitting efficiency without causing shorting of PN junction part by mounting a light emitting element body on a stem with its semiconductor wafer being placed upward and covering the PN junction faces close to said stem with an insulation layer.
COPYRIGHT: (C)1977,JPO&Japio
JP5352476A 1976-05-11 1976-05-11 Semiconductor light emitting element Pending JPS52144988A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5352476A JPS52144988A (en) 1976-05-11 1976-05-11 Semiconductor light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5352476A JPS52144988A (en) 1976-05-11 1976-05-11 Semiconductor light emitting element

Publications (1)

Publication Number Publication Date
JPS52144988A true JPS52144988A (en) 1977-12-02

Family

ID=12945196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5352476A Pending JPS52144988A (en) 1976-05-11 1976-05-11 Semiconductor light emitting element

Country Status (1)

Country Link
JP (1) JPS52144988A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000046862A1 (en) * 1999-02-05 2000-08-10 Japan Energy Corporation Photoelectric conversion functional element and production method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000046862A1 (en) * 1999-02-05 2000-08-10 Japan Energy Corporation Photoelectric conversion functional element and production method thereof
US6791257B1 (en) 1999-02-05 2004-09-14 Japan Energy Corporation Photoelectric conversion functional element and production method thereof

Similar Documents

Publication Publication Date Title
JPS51114886A (en) Photocoupling semiconductor device and its manufacturing process
JPS57139976A (en) Light emitting/receiving device
JPS52144988A (en) Semiconductor light emitting element
JPS52143785A (en) Semiconductor device
JPS5417682A (en) Semiconductor and its manufacture
JPS52129380A (en) Semiconductor device
JPS5396666A (en) Manufacture of semiconductor device with pn junction
JPS538570A (en) Semiconductor device
JPS547891A (en) Manufacture for planar semiconductor light emission device
JPS548982A (en) Semiconductor device
JPS5249780A (en) Semiconductor integrated circuit
JPS53118374A (en) Integrated diode device
JPS51147986A (en) Semiconductor light emission device
JPS52138871A (en) Semiconductor device
JPS5376692A (en) Semiconductor light emitting device
JPS5338981A (en) Semiconductor device
JPS5420670A (en) Surface stabilizing method of semiconductor elements
JPS5538080A (en) Semiconductor device
JPS5353973A (en) Semiconductor device
JPS5314585A (en) Semiconductor device
JPS52141566A (en) Semiconductor device and its manufacture
JPS536589A (en) Heat sensitive semiconductor element
JPS53139476A (en) Manufacture of semiconductor device
JPS5287375A (en) Semiconductor device and its production
JPS5434784A (en) Semiconductor integrated circuit device