JPS52136885U - - Google Patents
Info
- Publication number
- JPS52136885U JPS52136885U JP4437676U JP4437676U JPS52136885U JP S52136885 U JPS52136885 U JP S52136885U JP 4437676 U JP4437676 U JP 4437676U JP 4437676 U JP4437676 U JP 4437676U JP S52136885 U JPS52136885 U JP S52136885U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4437676U JPS5551255Y2 (en) | 1976-04-12 | 1976-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4437676U JPS5551255Y2 (en) | 1976-04-12 | 1976-04-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52136885U true JPS52136885U (en) | 1977-10-18 |
| JPS5551255Y2 JPS5551255Y2 (en) | 1980-11-28 |
Family
ID=28503446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4437676U Expired JPS5551255Y2 (en) | 1976-04-12 | 1976-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5551255Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008001390A (en) * | 2006-06-22 | 2008-01-10 | Sunstar Inc | Re-pack blister |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102611300B1 (en) | 2015-07-08 | 2023-12-08 | 가부시끼가이샤 레조낙 | Photosensitive element, laminated body, method for forming resist pattern, and method for producing printed circuit board |
| KR20230129587A (en) | 2015-07-30 | 2023-09-08 | 가부시끼가이샤 레조낙 | Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board |
| WO2019215848A1 (en) | 2018-05-09 | 2019-11-14 | 日立化成株式会社 | Photosensitive element, barrier layer forming resin composition, resist pattern forming method, and printed wiring board manufacturing method |
-
1976
- 1976-04-12 JP JP4437676U patent/JPS5551255Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008001390A (en) * | 2006-06-22 | 2008-01-10 | Sunstar Inc | Re-pack blister |
| JP4687580B2 (en) * | 2006-06-22 | 2011-05-25 | サンスター株式会社 | Repack blister |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5551255Y2 (en) | 1980-11-28 |