JPS52135282A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device

Info

Publication number
JPS52135282A
JPS52135282A JP5261576A JP5261576A JPS52135282A JP S52135282 A JPS52135282 A JP S52135282A JP 5261576 A JP5261576 A JP 5261576A JP 5261576 A JP5261576 A JP 5261576A JP S52135282 A JPS52135282 A JP S52135282A
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
semiconductor light
burying
emission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5261576A
Other languages
Japanese (ja)
Other versions
JPS584834B2 (en
Inventor
Toshio Sogo
Hiroharu Niinobu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP51052615A priority Critical patent/JPS584834B2/en
Publication of JPS52135282A publication Critical patent/JPS52135282A/en
Publication of JPS584834B2 publication Critical patent/JPS584834B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: Emission of side light is prevented by burying a ligh emitting semiconductor chip within conductive epoxy resin up to the surface.
COPYRIGHT: (C)1977,JPO&Japio
JP51052615A 1976-05-08 1976-05-08 semiconductor light emitting device Expired JPS584834B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51052615A JPS584834B2 (en) 1976-05-08 1976-05-08 semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51052615A JPS584834B2 (en) 1976-05-08 1976-05-08 semiconductor light emitting device

Publications (2)

Publication Number Publication Date
JPS52135282A true JPS52135282A (en) 1977-11-12
JPS584834B2 JPS584834B2 (en) 1983-01-27

Family

ID=12919693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51052615A Expired JPS584834B2 (en) 1976-05-08 1976-05-08 semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS584834B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494163U (en) * 1977-12-15 1979-07-03
JP2018518049A (en) * 2015-05-13 2018-07-05 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Optoelectronic semiconductor component and method for manufacturing optoelectronic semiconductor component

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60205033A (en) * 1984-03-29 1985-10-16 Yamaha Motor Co Ltd Brake disc structure of disc brake
JPS62199545U (en) * 1986-06-07 1987-12-18

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494163U (en) * 1977-12-15 1979-07-03
JP2018518049A (en) * 2015-05-13 2018-07-05 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Optoelectronic semiconductor component and method for manufacturing optoelectronic semiconductor component
US10381391B2 (en) 2015-05-13 2019-08-13 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

Also Published As

Publication number Publication date
JPS584834B2 (en) 1983-01-27

Similar Documents

Publication Publication Date Title
JPS5228281A (en) Light emitting semiconductor device
JPS52124885A (en) Semiconductor light emitting device
JPS52135282A (en) Semiconductor light emitting device
JPS5234739A (en) Light printer
JPS5299792A (en) Production of semiconductor light emitting device
JPS5252590A (en) Semiconductor light emitting device
JPS546789A (en) Semiconductor light emitting device
JPS51147986A (en) Semiconductor light emission device
JPS5269592A (en) Semiconductor luminescent element
JPS5376692A (en) Semiconductor light emitting device
JPS5420685A (en) Light emitting diode
JPS5533028A (en) Light-emitting semiconductor device
JPS5394883A (en) Light emission diode device
JPS52117067A (en) Semiconductor device
JPS5240079A (en) Semiconductor device
JPS5292490A (en) Photo-coupling semiconductor device
JPS535596A (en) Led display unit
JPS52154335A (en) Duty control circuit
JPS5258492A (en) Semiconductor light emitting device
JPS53126882A (en) Mount for light emitting elements
JPS53108792A (en) Semiconductor light emitting device
JPS52146581A (en) Compound semiconductor light emitting element
JPS5361287A (en) Compound semiconductor light emitting element
JPS5361289A (en) Photo semiconductor device
JPS51142282A (en) Method of manufacturing light emitting diode