JPS52131454A - Thermal treating method of wafer - Google Patents

Thermal treating method of wafer

Info

Publication number
JPS52131454A
JPS52131454A JP4765976A JP4765976A JPS52131454A JP S52131454 A JPS52131454 A JP S52131454A JP 4765976 A JP4765976 A JP 4765976A JP 4765976 A JP4765976 A JP 4765976A JP S52131454 A JPS52131454 A JP S52131454A
Authority
JP
Japan
Prior art keywords
wafer
treating method
thermal treating
thermal
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4765976A
Other languages
Japanese (ja)
Inventor
Toshimoto Mogi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4765976A priority Critical patent/JPS52131454A/en
Publication of JPS52131454A publication Critical patent/JPS52131454A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To secure uniform thermal processing by giving inclination to the wafer set up in the groove to one direction with a certain angle from vertical direction.
COPYRIGHT: (C)1977,JPO&Japio
JP4765976A 1976-04-28 1976-04-28 Thermal treating method of wafer Pending JPS52131454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4765976A JPS52131454A (en) 1976-04-28 1976-04-28 Thermal treating method of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4765976A JPS52131454A (en) 1976-04-28 1976-04-28 Thermal treating method of wafer

Publications (1)

Publication Number Publication Date
JPS52131454A true JPS52131454A (en) 1977-11-04

Family

ID=12781373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4765976A Pending JPS52131454A (en) 1976-04-28 1976-04-28 Thermal treating method of wafer

Country Status (1)

Country Link
JP (1) JPS52131454A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944822A (en) * 1982-09-06 1984-03-13 Tekunisuko:Kk Diffusion jig supporting wafers with slant
JPS59208717A (en) * 1983-05-12 1984-11-27 Matsushita Electric Ind Co Ltd Infrared annealing apparatus
JPS61111557A (en) * 1984-11-06 1986-05-29 Mitsubishi Electric Corp Device for transferring semiconductor waffer
JPS62162835U (en) * 1986-04-03 1987-10-16
JP2010027744A (en) * 2008-07-16 2010-02-04 Shin-Etsu Chemical Co Ltd Method for forming diffusion layer on substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944822A (en) * 1982-09-06 1984-03-13 Tekunisuko:Kk Diffusion jig supporting wafers with slant
JPS59208717A (en) * 1983-05-12 1984-11-27 Matsushita Electric Ind Co Ltd Infrared annealing apparatus
JPS61111557A (en) * 1984-11-06 1986-05-29 Mitsubishi Electric Corp Device for transferring semiconductor waffer
JPS62162835U (en) * 1986-04-03 1987-10-16
JP2010027744A (en) * 2008-07-16 2010-02-04 Shin-Etsu Chemical Co Ltd Method for forming diffusion layer on substrate

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