JPS52131454A - Thermal treating method of wafer - Google Patents
Thermal treating method of waferInfo
- Publication number
- JPS52131454A JPS52131454A JP4765976A JP4765976A JPS52131454A JP S52131454 A JPS52131454 A JP S52131454A JP 4765976 A JP4765976 A JP 4765976A JP 4765976 A JP4765976 A JP 4765976A JP S52131454 A JPS52131454 A JP S52131454A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- treating method
- thermal treating
- thermal
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To secure uniform thermal processing by giving inclination to the wafer set up in the groove to one direction with a certain angle from vertical direction.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4765976A JPS52131454A (en) | 1976-04-28 | 1976-04-28 | Thermal treating method of wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4765976A JPS52131454A (en) | 1976-04-28 | 1976-04-28 | Thermal treating method of wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52131454A true JPS52131454A (en) | 1977-11-04 |
Family
ID=12781373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4765976A Pending JPS52131454A (en) | 1976-04-28 | 1976-04-28 | Thermal treating method of wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52131454A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5944822A (en) * | 1982-09-06 | 1984-03-13 | Tekunisuko:Kk | Diffusion jig supporting wafers with slant |
JPS59208717A (en) * | 1983-05-12 | 1984-11-27 | Matsushita Electric Ind Co Ltd | Infrared annealing apparatus |
JPS61111557A (en) * | 1984-11-06 | 1986-05-29 | Mitsubishi Electric Corp | Device for transferring semiconductor waffer |
JPS62162835U (en) * | 1986-04-03 | 1987-10-16 | ||
JP2010027744A (en) * | 2008-07-16 | 2010-02-04 | Shin-Etsu Chemical Co Ltd | Method for forming diffusion layer on substrate |
-
1976
- 1976-04-28 JP JP4765976A patent/JPS52131454A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5944822A (en) * | 1982-09-06 | 1984-03-13 | Tekunisuko:Kk | Diffusion jig supporting wafers with slant |
JPS59208717A (en) * | 1983-05-12 | 1984-11-27 | Matsushita Electric Ind Co Ltd | Infrared annealing apparatus |
JPS61111557A (en) * | 1984-11-06 | 1986-05-29 | Mitsubishi Electric Corp | Device for transferring semiconductor waffer |
JPS62162835U (en) * | 1986-04-03 | 1987-10-16 | ||
JP2010027744A (en) * | 2008-07-16 | 2010-02-04 | Shin-Etsu Chemical Co Ltd | Method for forming diffusion layer on substrate |
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