JPS52130285A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS52130285A JPS52130285A JP4681876A JP4681876A JPS52130285A JP S52130285 A JPS52130285 A JP S52130285A JP 4681876 A JP4681876 A JP 4681876A JP 4681876 A JP4681876 A JP 4681876A JP S52130285 A JPS52130285 A JP S52130285A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4681876A JPS5916405B2 (en) | 1976-04-24 | 1976-04-24 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4681876A JPS5916405B2 (en) | 1976-04-24 | 1976-04-24 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52130285A true JPS52130285A (en) | 1977-11-01 |
JPS5916405B2 JPS5916405B2 (en) | 1984-04-16 |
Family
ID=12757908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4681876A Expired JPS5916405B2 (en) | 1976-04-24 | 1976-04-24 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5916405B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3523808A1 (en) | 1984-07-03 | 1986-01-16 | Hitachi, Ltd., Tokio/Tokyo | Method for the soldering of parts made of different materials |
-
1976
- 1976-04-24 JP JP4681876A patent/JPS5916405B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3523808A1 (en) | 1984-07-03 | 1986-01-16 | Hitachi, Ltd., Tokio/Tokyo | Method for the soldering of parts made of different materials |
Also Published As
Publication number | Publication date |
---|---|
JPS5916405B2 (en) | 1984-04-16 |
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