JPS5211784A - Photo semiconductor device - Google Patents

Photo semiconductor device

Info

Publication number
JPS5211784A
JPS5211784A JP50088168A JP8816875A JPS5211784A JP S5211784 A JPS5211784 A JP S5211784A JP 50088168 A JP50088168 A JP 50088168A JP 8816875 A JP8816875 A JP 8816875A JP S5211784 A JPS5211784 A JP S5211784A
Authority
JP
Japan
Prior art keywords
semiconductor device
photo semiconductor
photo
composiing
jigs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50088168A
Other languages
Japanese (ja)
Inventor
Mikio Murozono
Hiroyuki Kitamura
Motonori Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50088168A priority Critical patent/JPS5211784A/en
Publication of JPS5211784A publication Critical patent/JPS5211784A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE: To facilitate the adhering of the device to various cases and jigs by composiing a package of a flat light section with a lens enclosed.
COPYRIGHT: (C)1977,JPO&Japio
JP50088168A 1975-07-17 1975-07-17 Photo semiconductor device Pending JPS5211784A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50088168A JPS5211784A (en) 1975-07-17 1975-07-17 Photo semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50088168A JPS5211784A (en) 1975-07-17 1975-07-17 Photo semiconductor device

Publications (1)

Publication Number Publication Date
JPS5211784A true JPS5211784A (en) 1977-01-28

Family

ID=13935375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50088168A Pending JPS5211784A (en) 1975-07-17 1975-07-17 Photo semiconductor device

Country Status (1)

Country Link
JP (1) JPS5211784A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494163U (en) * 1977-12-15 1979-07-03
JPS54103761U (en) * 1977-12-30 1979-07-21
JPS57145383A (en) * 1981-03-04 1982-09-08 Nec Corp Light emitting diode
JPS57169282A (en) * 1981-04-13 1982-10-18 Mitsubishi Electric Corp Light emitting diode
JPS5983062U (en) * 1982-11-26 1984-06-05 安藤電気株式会社 Light emitting diode with filter
JPS59129476A (en) * 1983-01-14 1984-07-25 Matsushita Electric Ind Co Ltd Photoelectric conversion device
JPS60210708A (en) * 1984-04-04 1985-10-23 Asahi Optical Co Ltd Projector for apparatus for measuring distance
JPS61217673A (en) * 1985-03-22 1986-09-27 山陽国策パルプ株式会社 Multi-cylinder type drier
JPH0321861U (en) * 1989-07-11 1991-03-05
JPH0399447U (en) * 1990-01-31 1991-10-17
JP2009139217A (en) * 2007-12-06 2009-06-25 Seiko Instruments Inc Infrared sensor

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494163U (en) * 1977-12-15 1979-07-03
JPS54103761U (en) * 1977-12-30 1979-07-21
JPS5915509Y2 (en) * 1977-12-30 1984-05-08 ロ−ム株式会社 light emitting display device
JPS57145383A (en) * 1981-03-04 1982-09-08 Nec Corp Light emitting diode
JPS57169282A (en) * 1981-04-13 1982-10-18 Mitsubishi Electric Corp Light emitting diode
JPS5983062U (en) * 1982-11-26 1984-06-05 安藤電気株式会社 Light emitting diode with filter
JPS59129476A (en) * 1983-01-14 1984-07-25 Matsushita Electric Ind Co Ltd Photoelectric conversion device
JPS60210708A (en) * 1984-04-04 1985-10-23 Asahi Optical Co Ltd Projector for apparatus for measuring distance
JPS61217673A (en) * 1985-03-22 1986-09-27 山陽国策パルプ株式会社 Multi-cylinder type drier
JPH0238873B2 (en) * 1985-03-22 1990-09-03 Sanyo Kokusaku Pulp Co
JPH0321861U (en) * 1989-07-11 1991-03-05
JPH0399447U (en) * 1990-01-31 1991-10-17
JP2009139217A (en) * 2007-12-06 2009-06-25 Seiko Instruments Inc Infrared sensor

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