JPS52116995A - Lapping grinder - Google Patents
Lapping grinderInfo
- Publication number
- JPS52116995A JPS52116995A JP3395476A JP3395476A JPS52116995A JP S52116995 A JPS52116995 A JP S52116995A JP 3395476 A JP3395476 A JP 3395476A JP 3395476 A JP3395476 A JP 3395476A JP S52116995 A JPS52116995 A JP S52116995A
- Authority
- JP
- Japan
- Prior art keywords
- lapping
- grinder
- lapping grinder
- plate
- grind
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE: To grind at a proper position, by detecting a form of a lapping machine plate electrically and moving a ground surface forward and backward in a direction of a center on a radius of the plate.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3395476A JPS52116995A (en) | 1976-03-27 | 1976-03-27 | Lapping grinder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3395476A JPS52116995A (en) | 1976-03-27 | 1976-03-27 | Lapping grinder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52116995A true JPS52116995A (en) | 1977-09-30 |
Family
ID=12400875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3395476A Pending JPS52116995A (en) | 1976-03-27 | 1976-03-27 | Lapping grinder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52116995A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59129663A (en) * | 1983-01-18 | 1984-07-26 | Toshiba Corp | Wafer lapping device |
JPS6052246A (en) * | 1983-09-01 | 1985-03-25 | Mabuchi Shoten:Kk | Polishing machine |
JPS6125760A (en) * | 1984-07-09 | 1986-02-04 | Toshiba Corp | Grinding method and device |
JPS6138856A (en) * | 1984-07-28 | 1986-02-24 | Hoya Corp | Surface machining |
JPS6171955A (en) * | 1984-09-12 | 1986-04-12 | Toshiba Corp | Grinding method and its device |
JPS6171958A (en) * | 1984-09-13 | 1986-04-12 | Toshiba Corp | Grinding device |
JPH029572A (en) * | 1988-06-28 | 1990-01-12 | Hitachi Zosen Corp | Lapping device |
-
1976
- 1976-03-27 JP JP3395476A patent/JPS52116995A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59129663A (en) * | 1983-01-18 | 1984-07-26 | Toshiba Corp | Wafer lapping device |
JPS6052246A (en) * | 1983-09-01 | 1985-03-25 | Mabuchi Shoten:Kk | Polishing machine |
JPS6125760A (en) * | 1984-07-09 | 1986-02-04 | Toshiba Corp | Grinding method and device |
JPH0558859B2 (en) * | 1984-07-09 | 1993-08-27 | Tokyo Shibaura Electric Co | |
JPS6138856A (en) * | 1984-07-28 | 1986-02-24 | Hoya Corp | Surface machining |
JPS6171955A (en) * | 1984-09-12 | 1986-04-12 | Toshiba Corp | Grinding method and its device |
JPH0575548B2 (en) * | 1984-09-12 | 1993-10-20 | Tokyo Shibaura Electric Co | |
JPS6171958A (en) * | 1984-09-13 | 1986-04-12 | Toshiba Corp | Grinding device |
JPH04778B2 (en) * | 1984-09-13 | 1992-01-08 | Tokyo Shibaura Electric Co | |
JPH029572A (en) * | 1988-06-28 | 1990-01-12 | Hitachi Zosen Corp | Lapping device |
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