JPS52104062A - Production of surface protection film of electronic parts - Google Patents
Production of surface protection film of electronic partsInfo
- Publication number
- JPS52104062A JPS52104062A JP1998976A JP1998976A JPS52104062A JP S52104062 A JPS52104062 A JP S52104062A JP 1998976 A JP1998976 A JP 1998976A JP 1998976 A JP1998976 A JP 1998976A JP S52104062 A JPS52104062 A JP S52104062A
- Authority
- JP
- Japan
- Prior art keywords
- surface protection
- protection film
- production
- electronic parts
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
- H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
- H01L2224/02165—Reinforcing structures
- H01L2224/02166—Collar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To produce a surface protection film with high reliability which excells in wet proof and anti corosive character, by means of forming Si3N4 film with plasma CVD, through a silicate glass film on the surface of Al distribution layer.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1998976A JPS52104062A (en) | 1976-02-27 | 1976-02-27 | Production of surface protection film of electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1998976A JPS52104062A (en) | 1976-02-27 | 1976-02-27 | Production of surface protection film of electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52104062A true JPS52104062A (en) | 1977-09-01 |
Family
ID=12014574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1998976A Pending JPS52104062A (en) | 1976-02-27 | 1976-02-27 | Production of surface protection film of electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52104062A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598833A (en) * | 1979-01-22 | 1980-07-28 | Mitsubishi Electric Corp | Semiconductor device |
JPS56116628A (en) * | 1980-02-20 | 1981-09-12 | Fujitsu Ltd | Semiconductor device |
JPS56150831A (en) * | 1980-04-24 | 1981-11-21 | Nec Corp | Semiconductor device |
JPS5793530A (en) * | 1980-12-03 | 1982-06-10 | Nec Corp | Semiconductor device |
JPS57157529A (en) * | 1981-03-24 | 1982-09-29 | Seiko Epson Corp | Semiconductor device |
JPS59143362A (en) * | 1983-02-03 | 1984-08-16 | Fuji Xerox Co Ltd | Passivation film |
JPS62248239A (en) * | 1986-04-22 | 1987-10-29 | Nec Corp | Manufacture of semiconductor device |
JPS63211648A (en) * | 1988-01-29 | 1988-09-02 | Hitachi Ltd | Resin seal type semiconductor device |
US5371411A (en) * | 1980-09-01 | 1994-12-06 | Hitachi, Ltd. | Resin molded type semiconductor device having a conductor film |
US5552639A (en) * | 1980-09-01 | 1996-09-03 | Hitachi, Ltd. | Resin molded type semiconductor device having a conductor film |
-
1976
- 1976-02-27 JP JP1998976A patent/JPS52104062A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598833A (en) * | 1979-01-22 | 1980-07-28 | Mitsubishi Electric Corp | Semiconductor device |
JPS56116628A (en) * | 1980-02-20 | 1981-09-12 | Fujitsu Ltd | Semiconductor device |
JPS56150831A (en) * | 1980-04-24 | 1981-11-21 | Nec Corp | Semiconductor device |
US5371411A (en) * | 1980-09-01 | 1994-12-06 | Hitachi, Ltd. | Resin molded type semiconductor device having a conductor film |
US5583381A (en) * | 1980-09-01 | 1996-12-10 | Hitachi, Ltd. | Resin molded type-semiconductor device having a conductor film |
US5552639A (en) * | 1980-09-01 | 1996-09-03 | Hitachi, Ltd. | Resin molded type semiconductor device having a conductor film |
US5539257A (en) * | 1980-09-01 | 1996-07-23 | Hitachi, Ltd. | Resin molded type semiconductor device having a conductor film |
JPS5793530A (en) * | 1980-12-03 | 1982-06-10 | Nec Corp | Semiconductor device |
JPS57157529A (en) * | 1981-03-24 | 1982-09-29 | Seiko Epson Corp | Semiconductor device |
JPH0582065B2 (en) * | 1983-02-03 | 1993-11-17 | Fuji Xerox Co Ltd | |
JPS59143362A (en) * | 1983-02-03 | 1984-08-16 | Fuji Xerox Co Ltd | Passivation film |
JPS62248239A (en) * | 1986-04-22 | 1987-10-29 | Nec Corp | Manufacture of semiconductor device |
JPS63211648A (en) * | 1988-01-29 | 1988-09-02 | Hitachi Ltd | Resin seal type semiconductor device |
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