JPS52100171A - Composite integrated circuit mudule - Google Patents

Composite integrated circuit mudule

Info

Publication number
JPS52100171A
JPS52100171A JP1605276A JP1605276A JPS52100171A JP S52100171 A JPS52100171 A JP S52100171A JP 1605276 A JP1605276 A JP 1605276A JP 1605276 A JP1605276 A JP 1605276A JP S52100171 A JPS52100171 A JP S52100171A
Authority
JP
Japan
Prior art keywords
mudule
integrated circuit
composite integrated
composite
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1605276A
Other languages
Japanese (ja)
Inventor
Masaaki Kusano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1605276A priority Critical patent/JPS52100171A/en
Publication of JPS52100171A publication Critical patent/JPS52100171A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Combinations Of Printed Boards (AREA)
JP1605276A 1976-02-18 1976-02-18 Composite integrated circuit mudule Pending JPS52100171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1605276A JPS52100171A (en) 1976-02-18 1976-02-18 Composite integrated circuit mudule

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1605276A JPS52100171A (en) 1976-02-18 1976-02-18 Composite integrated circuit mudule

Publications (1)

Publication Number Publication Date
JPS52100171A true JPS52100171A (en) 1977-08-22

Family

ID=11905797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1605276A Pending JPS52100171A (en) 1976-02-18 1976-02-18 Composite integrated circuit mudule

Country Status (1)

Country Link
JP (1) JPS52100171A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5366526A (en) * 1977-11-25 1978-06-14 Hitachi Ltd Full-wave rectifier
JPS57188352U (en) * 1981-05-26 1982-11-30
JPH01143389A (en) * 1987-11-30 1989-06-05 Sony Corp Hybrid integrated circuit device
US4894706A (en) * 1985-02-14 1990-01-16 Nippon Telegraph And Telephone Corporation Three-dimensional packaging of semiconductor device chips
JP4795948B2 (en) * 2003-07-16 2011-10-19 マックスウェル テクノロジーズ， インク Radiation shielding integrated circuit device, method for shielding an integrated circuit device, and method for making a reliable package that protects an integrated circuit die from radiation

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5366526A (en) * 1977-11-25 1978-06-14 Hitachi Ltd Full-wave rectifier
JPS57188352U (en) * 1981-05-26 1982-11-30
US4894706A (en) * 1985-02-14 1990-01-16 Nippon Telegraph And Telephone Corporation Three-dimensional packaging of semiconductor device chips
WO1993013557A1 (en) * 1985-02-14 1993-07-08 Yoshiyuki Sato Structure for mounting the semiconductor chips in a three-dimensional manner
JPH01143389A (en) * 1987-11-30 1989-06-05 Sony Corp Hybrid integrated circuit device
JP4795948B2 (en) * 2003-07-16 2011-10-19 マックスウェル テクノロジーズ， インク Radiation shielding integrated circuit device, method for shielding an integrated circuit device, and method for making a reliable package that protects an integrated circuit die from radiation

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