JPS51868U - - Google Patents

Info

Publication number: JPS51868U
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP7210274U

Other languages

Japanese (ja)

Other versions

JPS5623898Y2 (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-06-20

Filing date

1974-06-20

Publication date

1976-01-06

1974-06-20 Application filed filed Critical

1974-06-20 Priority to JP7210274U priority Critical patent/JPS5623898Y2/ja

1976-01-06 Publication of JPS51868U publication Critical patent/JPS51868U/ja

1981-06-04 Application granted granted Critical

1981-06-04 Publication of JPS5623898Y2 publication Critical patent/JPS5623898Y2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements

Landscapes

Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
Lead Frames For Integrated Circuits (AREA)
Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)

JP7210274U 1974-06-20 1974-06-20 Expired JPS5623898Y2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP7210274U JPS5623898Y2 (en)	1974-06-20	1974-06-20

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP7210274U JPS5623898Y2 (en)	1974-06-20	1974-06-20

Publications (2)

Publication Number	Publication Date
JPS51868U true JPS51868U (en)	1976-01-06
JPS5623898Y2 JPS5623898Y2 (en)	1981-06-04

Family

ID=28242362

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP7210274U Expired JPS5623898Y2 (en)	1974-06-20	1974-06-20

Country Status (1)

Country	Link
JP (1)	JPS5623898Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5354500A (en) *	1976-10-27	1978-05-17	Gutsudowan Kk	Traffic alarm system
JPS54141983A (en) *	1978-04-25	1979-11-05	Onishi Hitoshi	System for transmitting traffic information into vehicles
JPS58187899U (en) *	1982-06-09	1983-12-13	杉山　信二	Auxiliary road signal
WO1991004575A1 (en) *	1989-09-12	1991-04-04	Kabushiki Kaisha Toshiba	Lead frame for semiconductor device and semiconductor device using the lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5238915U (en) *	1975-09-11	1977-03-18

1974
- 1974-06-20 JP JP7210274U patent/JPS5623898Y2/ja not_active Expired

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5238915U (en) *	1975-09-11	1977-03-18

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5354500A (en) *	1976-10-27	1978-05-17	Gutsudowan Kk	Traffic alarm system
JPS54141983A (en) *	1978-04-25	1979-11-05	Onishi Hitoshi	System for transmitting traffic information into vehicles
JPS58187899U (en) *	1982-06-09	1983-12-13	杉山　信二	Auxiliary road signal
WO1991004575A1 (en) *	1989-09-12	1991-04-04	Kabushiki Kaisha Toshiba	Lead frame for semiconductor device and semiconductor device using the lead frame
US5200806A (en) *	1989-09-12	1993-04-06	Kabushiki Kaisha Toshiba	Lead frame having a plurality of island regions and a suspension pin

Also Published As

Publication number	Publication date
JPS5623898Y2 (en)	1981-06-04

Publication	Publication Date	Title
AU7138274A (en)	1976-01-22
CH570049A5 (en)	1975-11-28
CH565976A5 (en)	1975-08-29
BE829996A (en)	1975-12-09
BG19665A1 (en)	1975-10-10
BG19743A1 (en)	1975-10-10
BG19932A1 (en)	1975-10-30
BG19962A1 (en)	1975-10-30
BG19972A1 (en)	1975-10-30
BG20039A1 (en)	1975-10-30
BG20143A1 (en)	1975-11-05
BG20237A1 (en)	1975-11-05
BG20444A1 (en)	1975-12-20
BG20460A1 (en)	1975-12-05
BG20643A1 (en)	1975-12-20
BG20855A2 (en)	1976-01-20
BG21119A1 (en)	1976-03-20
BG21784A1 (en)	1976-09-20
BG21787A1 (en)	1976-09-20
BG22207A1 (en)	1977-02-20
BG22501A1 (en)	1977-04-20
BG22732A1 (en)	1977-04-20
BG23489A1 (en)	1977-09-15
CH1213074A4 (en)	1976-05-31
CH1303275A4 (en)	1977-04-15