JPS5152308Y2 - - Google Patents
Info
- Publication number
- JPS5152308Y2 JPS5152308Y2 JP1973139269U JP13926973U JPS5152308Y2 JP S5152308 Y2 JPS5152308 Y2 JP S5152308Y2 JP 1973139269 U JP1973139269 U JP 1973139269U JP 13926973 U JP13926973 U JP 13926973U JP S5152308 Y2 JPS5152308 Y2 JP S5152308Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1973139269U JPS5152308Y2 (en) | 1973-12-03 | 1973-12-03 | |
GB4444774A GB1454188A (en) | 1973-12-03 | 1974-10-14 | |
DE2451018A DE2451018C3 (en) | 1973-12-03 | 1974-10-26 | Injection semiconductor laser device |
US05/519,051 US4003074A (en) | 1973-12-03 | 1974-10-29 | Hermetically-sealed injection semiconductor laser device |
CA214,297A CA1027222A (en) | 1973-12-03 | 1974-11-21 | Hermetically sealed injection semiconductor laser device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1973139269U JPS5152308Y2 (en) | 1973-12-03 | 1973-12-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5081770U JPS5081770U (en) | 1975-07-14 |
JPS5152308Y2 true JPS5152308Y2 (en) | 1976-12-14 |
Family
ID=28414821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1973139269U Expired JPS5152308Y2 (en) | 1973-12-03 | 1973-12-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5152308Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53111718A (en) * | 1977-03-11 | 1978-09-29 | Japan Synthetic Rubber Co Ltd | Sensitive resin conposite |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS595985Y2 (en) * | 1976-12-29 | 1984-02-23 | 富士通株式会社 | Optical semiconductor device |
JP2012156549A (en) * | 2009-10-30 | 2012-08-16 | Sony Corp | Optical amplifier |
JP2011119630A (en) * | 2009-10-30 | 2011-06-16 | Sony Corp | Optical device |
-
1973
- 1973-12-03 JP JP1973139269U patent/JPS5152308Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53111718A (en) * | 1977-03-11 | 1978-09-29 | Japan Synthetic Rubber Co Ltd | Sensitive resin conposite |
Also Published As
Publication number | Publication date |
---|---|
JPS5081770U (en) | 1975-07-14 |