JPS5145626B2 - - Google Patents
Info
- Publication number
- JPS5145626B2 JPS5145626B2 JP14065773A JP14065773A JPS5145626B2 JP S5145626 B2 JPS5145626 B2 JP S5145626B2 JP 14065773 A JP14065773 A JP 14065773A JP 14065773 A JP14065773 A JP 14065773A JP S5145626 B2 JPS5145626 B2 JP S5145626B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Mold Materials And Core Materials (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Powder Metallurgy (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14065773A JPS5145626B2 (en) | 1973-12-13 | 1973-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14065773A JPS5145626B2 (en) | 1973-12-13 | 1973-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5094073A JPS5094073A (en) | 1975-07-26 |
| JPS5145626B2 true JPS5145626B2 (en) | 1976-12-04 |
Family
ID=15273725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14065773A Expired JPS5145626B2 (en) | 1973-12-13 | 1973-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5145626B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11004792B2 (en) | 2018-09-28 | 2021-05-11 | Intel Corporation | Microelectronic device including fiber-containing build-up layers |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE411306B (en) * | 1976-01-28 | 1979-12-17 | Severinsson Lars M | FORM INTENDED FOR MOLDING OF MOLDABLE MATERIAL AND METHODS OF MANUFACTUREING SUCH SHAPE |
| JP5255940B2 (en) * | 2008-07-23 | 2013-08-07 | イビデンエンジニアリング株式会社 | Mold manufacturing method and mold |
-
1973
- 1973-12-13 JP JP14065773A patent/JPS5145626B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11004792B2 (en) | 2018-09-28 | 2021-05-11 | Intel Corporation | Microelectronic device including fiber-containing build-up layers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5094073A (en) | 1975-07-26 |