JPS5129473B2 - - Google Patents
Info
- Publication number
- JPS5129473B2 JPS5129473B2 JP47033880A JP3388072A JPS5129473B2 JP S5129473 B2 JPS5129473 B2 JP S5129473B2 JP 47033880 A JP47033880 A JP 47033880A JP 3388072 A JP3388072 A JP 3388072A JP S5129473 B2 JPS5129473 B2 JP S5129473B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Basic Packing Technique (AREA)
- Package Closures (AREA)
- Wrapping Of Specific Fragile Articles (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47033880A JPS5129473B2 (fr) | 1972-04-06 | 1972-04-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47033880A JPS5129473B2 (fr) | 1972-04-06 | 1972-04-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS48100293A JPS48100293A (fr) | 1973-12-18 |
JPS5129473B2 true JPS5129473B2 (fr) | 1976-08-25 |
Family
ID=12398820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP47033880A Expired JPS5129473B2 (fr) | 1972-04-06 | 1972-04-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5129473B2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10811341B2 (en) | 2009-01-05 | 2020-10-20 | Amkor Technology Singapore Holding Pte Ltd. | Semiconductor device with through-mold via |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5717908U (fr) * | 1980-07-07 | 1982-01-29 |
-
1972
- 1972-04-06 JP JP47033880A patent/JPS5129473B2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10811341B2 (en) | 2009-01-05 | 2020-10-20 | Amkor Technology Singapore Holding Pte Ltd. | Semiconductor device with through-mold via |
Also Published As
Publication number | Publication date |
---|---|
JPS48100293A (fr) | 1973-12-18 |