JPS51269A - Handotaisoshino seizosochi - Google Patents
Handotaisoshino seizosochiInfo
- Publication number
- JPS51269A JPS51269A JP6966774A JP6966774A JPS51269A JP S51269 A JPS51269 A JP S51269A JP 6966774 A JP6966774 A JP 6966774A JP 6966774 A JP6966774 A JP 6966774A JP S51269 A JPS51269 A JP S51269A
- Authority
- JP
- Japan
- Prior art keywords
- seizosochi
- handotaisoshino
- handotaisoshino seizosochi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6966774A JPS51269A (en) | 1974-06-20 | 1974-06-20 | Handotaisoshino seizosochi |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6966774A JPS51269A (en) | 1974-06-20 | 1974-06-20 | Handotaisoshino seizosochi |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51269A true JPS51269A (en) | 1976-01-05 |
JPS579215B2 JPS579215B2 (en) | 1982-02-20 |
Family
ID=13409402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6966774A Granted JPS51269A (en) | 1974-06-20 | 1974-06-20 | Handotaisoshino seizosochi |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51269A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5424571A (en) * | 1977-07-25 | 1979-02-23 | Nec Corp | Manufacture for semiconductor wafer |
JPS55115334A (en) * | 1979-02-28 | 1980-09-05 | Fujitsu Ltd | Processing method of wafer |
JP2017117915A (en) * | 2015-12-24 | 2017-06-29 | 株式会社Sumco | Bevelling method of silicon wafer, method of manufacturing silicon wafer and silicon wafer |
-
1974
- 1974-06-20 JP JP6966774A patent/JPS51269A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5424571A (en) * | 1977-07-25 | 1979-02-23 | Nec Corp | Manufacture for semiconductor wafer |
JPS6058579B2 (en) * | 1977-07-25 | 1985-12-20 | 日本電気株式会社 | Method of manufacturing semiconductor wafers |
JPS55115334A (en) * | 1979-02-28 | 1980-09-05 | Fujitsu Ltd | Processing method of wafer |
JP2017117915A (en) * | 2015-12-24 | 2017-06-29 | 株式会社Sumco | Bevelling method of silicon wafer, method of manufacturing silicon wafer and silicon wafer |
Also Published As
Publication number | Publication date |
---|---|
JPS579215B2 (en) | 1982-02-20 |
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