JPS5116874A - HANDOTA ISOCHI - Google Patents

HANDOTA ISOCHI

Info

Publication number
JPS5116874A
JPS5116874A JP8806774A JP8806774A JPS5116874A JP S5116874 A JPS5116874 A JP S5116874A JP 8806774 A JP8806774 A JP 8806774A JP 8806774 A JP8806774 A JP 8806774A JP S5116874 A JPS5116874 A JP S5116874A
Authority
JP
Japan
Prior art keywords
handota
isochi
handota isochi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8806774A
Other languages
Japanese (ja)
Inventor
Susumu Okikawa
Osamu Yugawa
Hiroshi Mikino
Atsushi Sasayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8806774A priority Critical patent/JPS5116874A/en
Publication of JPS5116874A publication Critical patent/JPS5116874A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad

Landscapes

  • Die Bonding (AREA)
JP8806774A 1974-08-02 1974-08-02 HANDOTA ISOCHI Pending JPS5116874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8806774A JPS5116874A (en) 1974-08-02 1974-08-02 HANDOTA ISOCHI

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8806774A JPS5116874A (en) 1974-08-02 1974-08-02 HANDOTA ISOCHI

Publications (1)

Publication Number Publication Date
JPS5116874A true JPS5116874A (en) 1976-02-10

Family

ID=13932495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8806774A Pending JPS5116874A (en) 1974-08-02 1974-08-02 HANDOTA ISOCHI

Country Status (1)

Country Link
JP (1) JPS5116874A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5470991A (en) * 1977-11-08 1979-06-07 Nobuyoshi Kumaki Automatic winder for *ipponzuri*
JPS54110064U (en) * 1978-01-20 1979-08-02

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5470991A (en) * 1977-11-08 1979-06-07 Nobuyoshi Kumaki Automatic winder for *ipponzuri*
JPS5631085B2 (en) * 1977-11-08 1981-07-18
JPS54110064U (en) * 1978-01-20 1979-08-02

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