JPS51126067A - Resin sealing form semi-conductor equipment - Google Patents
Resin sealing form semi-conductor equipmentInfo
- Publication number
- JPS51126067A JPS51126067A JP4966975A JP4966975A JPS51126067A JP S51126067 A JPS51126067 A JP S51126067A JP 4966975 A JP4966975 A JP 4966975A JP 4966975 A JP4966975 A JP 4966975A JP S51126067 A JPS51126067 A JP S51126067A
- Authority
- JP
- Japan
- Prior art keywords
- resin sealing
- form semi
- sealing form
- conductor equipment
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: Resin sealing form semi-conductor equipment being able to easily combine elements and also to establish a radiator able to radiate effectively the heat from the pellet.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4966975A JPS51126067A (en) | 1975-04-25 | 1975-04-25 | Resin sealing form semi-conductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4966975A JPS51126067A (en) | 1975-04-25 | 1975-04-25 | Resin sealing form semi-conductor equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51126067A true JPS51126067A (en) | 1976-11-02 |
Family
ID=12837565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4966975A Pending JPS51126067A (en) | 1975-04-25 | 1975-04-25 | Resin sealing form semi-conductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51126067A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009295808A (en) * | 2008-06-05 | 2009-12-17 | Mitsubishi Electric Corp | Resin-molded semiconductor module |
JP2010199494A (en) * | 2009-02-27 | 2010-09-09 | Mitsubishi Electric Corp | Semiconductor device and manufacturing method of the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4924071A (en) * | 1972-06-26 | 1974-03-04 |
-
1975
- 1975-04-25 JP JP4966975A patent/JPS51126067A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4924071A (en) * | 1972-06-26 | 1974-03-04 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009295808A (en) * | 2008-06-05 | 2009-12-17 | Mitsubishi Electric Corp | Resin-molded semiconductor module |
JP2010199494A (en) * | 2009-02-27 | 2010-09-09 | Mitsubishi Electric Corp | Semiconductor device and manufacturing method of the same |
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