JPS51123987A - Vibration cutting device for a wire saw - Google Patents

Vibration cutting device for a wire saw

Info

Publication number
JPS51123987A
JPS51123987A JP4818475A JP4818475A JPS51123987A JP S51123987 A JPS51123987 A JP S51123987A JP 4818475 A JP4818475 A JP 4818475A JP 4818475 A JP4818475 A JP 4818475A JP S51123987 A JPS51123987 A JP S51123987A
Authority
JP
Japan
Prior art keywords
cutting device
wire saw
vibration cutting
cutting
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4818475A
Other languages
Japanese (ja)
Inventor
Takayuki Minamiyama
Osamu Usuda
Masaaki Kuniyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP4818475A priority Critical patent/JPS51123987A/en
Publication of JPS51123987A publication Critical patent/JPS51123987A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D7/00—Planing or slotting machines characterised only by constructional features of particular parts
    • B23D7/04—Planing or slotting machines characterised only by constructional features of particular parts of pillars, of cross-beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/025—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:The device makes it easy to feed a slurry to a cutting surface, improves cutting accuracy and minimizes breakage of cutting wires by applying vibration to the cutting surface of the wires and a workpiece.
JP4818475A 1975-04-22 1975-04-22 Vibration cutting device for a wire saw Pending JPS51123987A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4818475A JPS51123987A (en) 1975-04-22 1975-04-22 Vibration cutting device for a wire saw

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4818475A JPS51123987A (en) 1975-04-22 1975-04-22 Vibration cutting device for a wire saw

Publications (1)

Publication Number Publication Date
JPS51123987A true JPS51123987A (en) 1976-10-29

Family

ID=12796290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4818475A Pending JPS51123987A (en) 1975-04-22 1975-04-22 Vibration cutting device for a wire saw

Country Status (1)

Country Link
JP (1) JPS51123987A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54106980A (en) * 1977-07-07 1979-08-22 Kenichi Ishikawa Vibration cutting method of hard and brittle material
CN104129001A (en) * 2014-08-06 2014-11-05 江西赛维Ldk太阳能高科技有限公司 Silicon wafer multi-line cutting method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54106980A (en) * 1977-07-07 1979-08-22 Kenichi Ishikawa Vibration cutting method of hard and brittle material
CN104129001A (en) * 2014-08-06 2014-11-05 江西赛维Ldk太阳能高科技有限公司 Silicon wafer multi-line cutting method
CN104129001B (en) * 2014-08-06 2015-12-30 江西赛维Ldk太阳能高科技有限公司 A kind of Multi-wire wafer cutting method

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