JPS51118187A - Method of cutting brittle materials - Google Patents

Method of cutting brittle materials

Info

Publication number
JPS51118187A
JPS51118187A JP4284775A JP4284775A JPS51118187A JP S51118187 A JPS51118187 A JP S51118187A JP 4284775 A JP4284775 A JP 4284775A JP 4284775 A JP4284775 A JP 4284775A JP S51118187 A JPS51118187 A JP S51118187A
Authority
JP
Japan
Prior art keywords
brittle materials
cutting brittle
cutting
crossing
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4284775A
Other languages
Japanese (ja)
Inventor
Tomohiro Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP4284775A priority Critical patent/JPS51118187A/en
Publication of JPS51118187A publication Critical patent/JPS51118187A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PURPOSE:A cutting method to make a hole deeper than the grooves at a point at which the cutting lines are crossing on a brittle semiconductor wafer.
JP4284775A 1975-04-10 1975-04-10 Method of cutting brittle materials Pending JPS51118187A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4284775A JPS51118187A (en) 1975-04-10 1975-04-10 Method of cutting brittle materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4284775A JPS51118187A (en) 1975-04-10 1975-04-10 Method of cutting brittle materials

Publications (1)

Publication Number Publication Date
JPS51118187A true JPS51118187A (en) 1976-10-16

Family

ID=12647382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4284775A Pending JPS51118187A (en) 1975-04-10 1975-04-10 Method of cutting brittle materials

Country Status (1)

Country Link
JP (1) JPS51118187A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0588681A1 (en) * 1992-08-31 1994-03-23 Sumitomo Electric Industries, Ltd. Method for cutting a wafer hard to cut
JP2005332841A (en) * 2004-05-18 2005-12-02 Disco Abrasive Syst Ltd Method of dividing wafer
JP2007149820A (en) * 2005-11-25 2007-06-14 Disco Abrasive Syst Ltd Laser machining method of wafer
JP2007149743A (en) * 2005-11-24 2007-06-14 Disco Abrasive Syst Ltd Laser-machining method for wafer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0588681A1 (en) * 1992-08-31 1994-03-23 Sumitomo Electric Industries, Ltd. Method for cutting a wafer hard to cut
JP2005332841A (en) * 2004-05-18 2005-12-02 Disco Abrasive Syst Ltd Method of dividing wafer
JP4694795B2 (en) * 2004-05-18 2011-06-08 株式会社ディスコ Wafer division method
JP2007149743A (en) * 2005-11-24 2007-06-14 Disco Abrasive Syst Ltd Laser-machining method for wafer
JP2007149820A (en) * 2005-11-25 2007-06-14 Disco Abrasive Syst Ltd Laser machining method of wafer

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