JPS51118187A - Method of cutting brittle materials - Google Patents
Method of cutting brittle materialsInfo
- Publication number
- JPS51118187A JPS51118187A JP4284775A JP4284775A JPS51118187A JP S51118187 A JPS51118187 A JP S51118187A JP 4284775 A JP4284775 A JP 4284775A JP 4284775 A JP4284775 A JP 4284775A JP S51118187 A JPS51118187 A JP S51118187A
- Authority
- JP
- Japan
- Prior art keywords
- brittle materials
- cutting brittle
- cutting
- crossing
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
Landscapes
- Engineering & Computer Science (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
PURPOSE:A cutting method to make a hole deeper than the grooves at a point at which the cutting lines are crossing on a brittle semiconductor wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4284775A JPS51118187A (en) | 1975-04-10 | 1975-04-10 | Method of cutting brittle materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4284775A JPS51118187A (en) | 1975-04-10 | 1975-04-10 | Method of cutting brittle materials |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51118187A true JPS51118187A (en) | 1976-10-16 |
Family
ID=12647382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4284775A Pending JPS51118187A (en) | 1975-04-10 | 1975-04-10 | Method of cutting brittle materials |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51118187A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0588681A1 (en) * | 1992-08-31 | 1994-03-23 | Sumitomo Electric Industries, Ltd. | Method for cutting a wafer hard to cut |
JP2005332841A (en) * | 2004-05-18 | 2005-12-02 | Disco Abrasive Syst Ltd | Method of dividing wafer |
JP2007149820A (en) * | 2005-11-25 | 2007-06-14 | Disco Abrasive Syst Ltd | Laser machining method of wafer |
JP2007149743A (en) * | 2005-11-24 | 2007-06-14 | Disco Abrasive Syst Ltd | Laser-machining method for wafer |
-
1975
- 1975-04-10 JP JP4284775A patent/JPS51118187A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0588681A1 (en) * | 1992-08-31 | 1994-03-23 | Sumitomo Electric Industries, Ltd. | Method for cutting a wafer hard to cut |
JP2005332841A (en) * | 2004-05-18 | 2005-12-02 | Disco Abrasive Syst Ltd | Method of dividing wafer |
JP4694795B2 (en) * | 2004-05-18 | 2011-06-08 | 株式会社ディスコ | Wafer division method |
JP2007149743A (en) * | 2005-11-24 | 2007-06-14 | Disco Abrasive Syst Ltd | Laser-machining method for wafer |
JP2007149820A (en) * | 2005-11-25 | 2007-06-14 | Disco Abrasive Syst Ltd | Laser machining method of wafer |
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