JPS51110985A - - Google Patents
Info
- Publication number
- JPS51110985A JPS51110985A JP50036364A JP3636475A JPS51110985A JP S51110985 A JPS51110985 A JP S51110985A JP 50036364 A JP50036364 A JP 50036364A JP 3636475 A JP3636475 A JP 3636475A JP S51110985 A JPS51110985 A JP S51110985A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Photovoltaic Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3636475A JPS5628383B2 (en) | 1975-03-25 | 1975-03-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3636475A JPS5628383B2 (en) | 1975-03-25 | 1975-03-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51110985A true JPS51110985A (en) | 1976-09-30 |
JPS5628383B2 JPS5628383B2 (en) | 1981-07-01 |
Family
ID=12467766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3636475A Expired JPS5628383B2 (en) | 1975-03-25 | 1975-03-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5628383B2 (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5384495A (en) * | 1976-12-29 | 1978-07-25 | Japan Solar Energy | Semiconductor electrode and method of forming same |
JPS54179075U (en) * | 1978-06-07 | 1979-12-18 | ||
JPS57172777A (en) * | 1981-04-15 | 1982-10-23 | Nippon Sheet Glass Co Ltd | Modularization of photocell |
JPS58190050A (en) * | 1982-04-30 | 1983-11-05 | Nec Home Electronics Ltd | Assembling of diode |
JPS59211286A (en) * | 1983-05-17 | 1984-11-30 | Canon Inc | Solar battery unit |
JPS604270A (en) * | 1983-06-22 | 1985-01-10 | Hitachi Ltd | Manufacture of solar battery |
JPS60107872A (en) * | 1983-11-16 | 1985-06-13 | Kanegafuchi Chem Ind Co Ltd | Photoelectromotive force device |
JPS6182485A (en) * | 1984-09-29 | 1986-04-26 | Toshiba Corp | Solar battery panel |
JPH01121959U (en) * | 1988-02-10 | 1989-08-18 | ||
JP2004200515A (en) * | 2002-12-19 | 2004-07-15 | Kyocera Corp | Solar cell module |
JP2004247402A (en) * | 2003-02-12 | 2004-09-02 | Sanyo Electric Co Ltd | Solar cell module and its manufacturing method |
JP2008508673A (en) * | 2004-07-27 | 2008-03-21 | ケンブリッジ ディスプレイ テクノロジー リミテッド | Stacked interconnects for organic opto-electronic devices |
JP2014075430A (en) * | 2012-10-03 | 2014-04-24 | Sharp Corp | Solar cell module |
US8993364B2 (en) | 2009-02-02 | 2015-03-31 | Hanergy Hi-Tech Power (Hk) Limited | Integrated thin film solar cell interconnection |
US9362433B2 (en) | 2013-01-28 | 2016-06-07 | Hanergy Hi-Tech Power (Hk) Limited | Photovoltaic interconnect systems, devices, and methods |
US9385254B2 (en) | 2012-04-17 | 2016-07-05 | Hanergy Hi-Tech Power (Hk) Limited | Integrated thin film solar cell interconnection |
JP2019208015A (en) * | 2018-03-28 | 2019-12-05 | ザ・ボーイング・カンパニーTheBoeing Company | Wiring for rigid panel solar array |
DE102013219526B4 (en) | 2013-09-27 | 2022-10-13 | Meyer Burger (Germany) Gmbh | Solar cell assembly with connecting element and method for producing a solar cell assembly |
-
1975
- 1975-03-25 JP JP3636475A patent/JPS5628383B2/ja not_active Expired
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5384495A (en) * | 1976-12-29 | 1978-07-25 | Japan Solar Energy | Semiconductor electrode and method of forming same |
JPS5514550B2 (en) * | 1976-12-29 | 1980-04-17 | ||
JPS54179075U (en) * | 1978-06-07 | 1979-12-18 | ||
JPS57172777A (en) * | 1981-04-15 | 1982-10-23 | Nippon Sheet Glass Co Ltd | Modularization of photocell |
JPS58190050A (en) * | 1982-04-30 | 1983-11-05 | Nec Home Electronics Ltd | Assembling of diode |
JPH0473308B2 (en) * | 1983-05-17 | 1992-11-20 | Canon Kk | |
JPS59211286A (en) * | 1983-05-17 | 1984-11-30 | Canon Inc | Solar battery unit |
JPS604270A (en) * | 1983-06-22 | 1985-01-10 | Hitachi Ltd | Manufacture of solar battery |
JPH0554275B2 (en) * | 1983-06-22 | 1993-08-12 | Hitachi Ltd | |
JPS60107872A (en) * | 1983-11-16 | 1985-06-13 | Kanegafuchi Chem Ind Co Ltd | Photoelectromotive force device |
JPS6182485A (en) * | 1984-09-29 | 1986-04-26 | Toshiba Corp | Solar battery panel |
JPH01121959U (en) * | 1988-02-10 | 1989-08-18 | ||
JP2004200515A (en) * | 2002-12-19 | 2004-07-15 | Kyocera Corp | Solar cell module |
JP2004247402A (en) * | 2003-02-12 | 2004-09-02 | Sanyo Electric Co Ltd | Solar cell module and its manufacturing method |
JP2008508673A (en) * | 2004-07-27 | 2008-03-21 | ケンブリッジ ディスプレイ テクノロジー リミテッド | Stacked interconnects for organic opto-electronic devices |
US8993364B2 (en) | 2009-02-02 | 2015-03-31 | Hanergy Hi-Tech Power (Hk) Limited | Integrated thin film solar cell interconnection |
US9236513B2 (en) | 2009-02-02 | 2016-01-12 | Hanergy Hi-Tech Power (Hk) Limited | Integrated thin film solar cell interconnection |
US9385254B2 (en) | 2012-04-17 | 2016-07-05 | Hanergy Hi-Tech Power (Hk) Limited | Integrated thin film solar cell interconnection |
JP2014075430A (en) * | 2012-10-03 | 2014-04-24 | Sharp Corp | Solar cell module |
US9362433B2 (en) | 2013-01-28 | 2016-06-07 | Hanergy Hi-Tech Power (Hk) Limited | Photovoltaic interconnect systems, devices, and methods |
DE102013219526B4 (en) | 2013-09-27 | 2022-10-13 | Meyer Burger (Germany) Gmbh | Solar cell assembly with connecting element and method for producing a solar cell assembly |
JP2019208015A (en) * | 2018-03-28 | 2019-12-05 | ザ・ボーイング・カンパニーTheBoeing Company | Wiring for rigid panel solar array |
Also Published As
Publication number | Publication date |
---|---|
JPS5628383B2 (en) | 1981-07-01 |