JPS5110769A - Handotaisochino seizohoho - Google Patents

Handotaisochino seizohoho

Info

Publication number
JPS5110769A
JPS5110769A JP49081937A JP8193774A JPS5110769A JP S5110769 A JPS5110769 A JP S5110769A JP 49081937 A JP49081937 A JP 49081937A JP 8193774 A JP8193774 A JP 8193774A JP S5110769 A JPS5110769 A JP S5110769A
Authority
JP
Japan
Prior art keywords
handotaisochino seizohoho
handotaisochino
seizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49081937A
Other languages
Japanese (ja)
Other versions
JPS5433109B2 (en
Inventor
Ikuhisa Nishimura
Naomi Suyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHINNIPPON DENKI KK
New Nippon Electric Co Ltd
Original Assignee
SHINNIPPON DENKI KK
New Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHINNIPPON DENKI KK, New Nippon Electric Co Ltd filed Critical SHINNIPPON DENKI KK
Priority to JP49081937A priority Critical patent/JPS5110769A/en
Publication of JPS5110769A publication Critical patent/JPS5110769A/en
Publication of JPS5433109B2 publication Critical patent/JPS5433109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Die Bonding (AREA)
JP49081937A 1974-07-16 1974-07-16 Handotaisochino seizohoho Granted JPS5110769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49081937A JPS5110769A (en) 1974-07-16 1974-07-16 Handotaisochino seizohoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49081937A JPS5110769A (en) 1974-07-16 1974-07-16 Handotaisochino seizohoho

Publications (2)

Publication Number Publication Date
JPS5110769A true JPS5110769A (en) 1976-01-28
JPS5433109B2 JPS5433109B2 (en) 1979-10-18

Family

ID=13760388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49081937A Granted JPS5110769A (en) 1974-07-16 1974-07-16 Handotaisochino seizohoho

Country Status (1)

Country Link
JP (1) JPS5110769A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548461A (en) * 1977-06-21 1979-01-22 Fujitsu Ltd Assembing method of semoconductor device
JPS5593231A (en) * 1979-01-09 1980-07-15 Yamagata Nippon Denki Kk Assembling method of semicondcutor device
JPS6474730A (en) * 1987-09-17 1989-03-20 Rohm Co Ltd Manufacture of electronic parts

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548461A (en) * 1977-06-21 1979-01-22 Fujitsu Ltd Assembing method of semoconductor device
JPS5731293B2 (en) * 1977-06-21 1982-07-03
JPS5593231A (en) * 1979-01-09 1980-07-15 Yamagata Nippon Denki Kk Assembling method of semicondcutor device
JPS6222447B2 (en) * 1979-01-09 1987-05-18 Yamagata Nippon Denki Kk
JPS6474730A (en) * 1987-09-17 1989-03-20 Rohm Co Ltd Manufacture of electronic parts

Also Published As

Publication number Publication date
JPS5433109B2 (en) 1979-10-18

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