JPS5057927A - - Google Patents

Info

Publication number
JPS5057927A
JPS5057927A JP10776273A JP10776273A JPS5057927A JP S5057927 A JPS5057927 A JP S5057927A JP 10776273 A JP10776273 A JP 10776273A JP 10776273 A JP10776273 A JP 10776273A JP S5057927 A JPS5057927 A JP S5057927A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10776273A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10776273A priority Critical patent/JPS5057927A/ja
Publication of JPS5057927A publication Critical patent/JPS5057927A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
JP10776273A 1973-09-25 1973-09-25 Pending JPS5057927A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10776273A JPS5057927A (en) 1973-09-25 1973-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10776273A JPS5057927A (en) 1973-09-25 1973-09-25

Publications (1)

Publication Number Publication Date
JPS5057927A true JPS5057927A (en) 1975-05-20

Family

ID=14467336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10776273A Pending JPS5057927A (en) 1973-09-25 1973-09-25

Country Status (1)

Country Link
JP (1) JPS5057927A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process
US5173109A (en) * 1990-06-04 1992-12-22 Shipley Company Inc. Process for forming reflowable immersion tin lead deposit
US5248527A (en) * 1991-03-01 1993-09-28 C. Uyemura And Company, Limited Process for electroless plating tin, lead or tin-lead alloy

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
US5173109A (en) * 1990-06-04 1992-12-22 Shipley Company Inc. Process for forming reflowable immersion tin lead deposit
US5248527A (en) * 1991-03-01 1993-09-28 C. Uyemura And Company, Limited Process for electroless plating tin, lead or tin-lead alloy
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process

Similar Documents

Publication Publication Date Title
AR201758A1 (en)
AU465372B2 (en)
AR201235Q (en)
AR201231Q (en)
AU465453B2 (en)
AU471343B2 (en)
AU465434B2 (en)
AU450229B2 (en)
AR201229Q (en)
AU472848B2 (en)
AU466283B2 (en)
JPS5339857B2 (en)
JPS5019316A (en)
AR199451A1 (en)
JPS5057927A (en)
AR210729A1 (en)
AR196382A1 (en)
AU471461B2 (en)
AR200885A1 (en)
AU461342B2 (en)
AR200256A1 (en)
AR193950A1 (en)
AU447540B2 (en)
AR195948A1 (en)
AR195311A1 (en)