JPS5057927A - - Google Patents
Info
- Publication number
- JPS5057927A JPS5057927A JP10776273A JP10776273A JPS5057927A JP S5057927 A JPS5057927 A JP S5057927A JP 10776273 A JP10776273 A JP 10776273A JP 10776273 A JP10776273 A JP 10776273A JP S5057927 A JPS5057927 A JP S5057927A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10776273A JPS5057927A (en) | 1973-09-25 | 1973-09-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10776273A JPS5057927A (en) | 1973-09-25 | 1973-09-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5057927A true JPS5057927A (en) | 1975-05-20 |
Family
ID=14467336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10776273A Pending JPS5057927A (en) | 1973-09-25 | 1973-09-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5057927A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5143544A (en) * | 1990-06-04 | 1992-09-01 | Shipley Company Inc. | Tin lead plating solution |
US5169692A (en) * | 1991-11-19 | 1992-12-08 | Shipley Company Inc. | Tin lead process |
US5173109A (en) * | 1990-06-04 | 1992-12-22 | Shipley Company Inc. | Process for forming reflowable immersion tin lead deposit |
US5248527A (en) * | 1991-03-01 | 1993-09-28 | C. Uyemura And Company, Limited | Process for electroless plating tin, lead or tin-lead alloy |
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1973
- 1973-09-25 JP JP10776273A patent/JPS5057927A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5143544A (en) * | 1990-06-04 | 1992-09-01 | Shipley Company Inc. | Tin lead plating solution |
US5173109A (en) * | 1990-06-04 | 1992-12-22 | Shipley Company Inc. | Process for forming reflowable immersion tin lead deposit |
US5248527A (en) * | 1991-03-01 | 1993-09-28 | C. Uyemura And Company, Limited | Process for electroless plating tin, lead or tin-lead alloy |
US5169692A (en) * | 1991-11-19 | 1992-12-08 | Shipley Company Inc. | Tin lead process |