JPS5056199A - - Google Patents

Info

Publication number: JPS5056199A
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP10306573A

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-09-14

Filing date

1973-09-14

Publication date

1975-05-16

1973-09-14 Application filed filed Critical

1973-09-14 Priority to JP10306573A priority Critical patent/JPS5056199A/ja

1975-05-16 Publication of JPS5056199A publication Critical patent/JPS5056199A/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

JP10306573A 1973-09-14 1973-09-14 Pending JPS5056199A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP10306573A JPS5056199A (en)	1973-09-14	1973-09-14

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP10306573A JPS5056199A (en)	1973-09-14	1973-09-14

Publications (1)

Publication Number	Publication Date
JPS5056199A true JPS5056199A (en)	1975-05-16

Family

ID=14344256

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP10306573A Pending JPS5056199A (en)	1973-09-14	1973-09-14

Country Status (1)

Country	Link
JP (1)	JPS5056199A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS54103761U (en) *	1977-12-30	1979-07-21
JPS62139367A (en) *	1985-12-13	1987-06-23	Oki Electric Ind Co Ltd	Light emitting diode
JPH0311771A (en) *	1989-05-31	1991-01-21	Siemens Ag	Opto-device to which surface mounting is enabled
JPH0341954U (en) *	1989-09-01	1991-04-22

1973
- 1973-09-14 JP JP10306573A patent/JPS5056199A/ja active Pending

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS54103761U (en) *	1977-12-30	1979-07-21
JPS5915509Y2 (en) *	1977-12-30	1984-05-08	ロ−ム株式会社	light emitting display device
JPS62139367A (en) *	1985-12-13	1987-06-23	Oki Electric Ind Co Ltd	Light emitting diode
JPH0311771A (en) *	1989-05-31	1991-01-21	Siemens Ag	Opto-device to which surface mounting is enabled
JPH0341954U (en) *	1989-09-01	1991-04-22

Publication	Publication Date	Title
AR201758A1 (en)	1975-04-15
AU476761B2 (en)	1976-09-30
AR201235Q (en)	1975-02-21
AR201231Q (en)	1975-02-21
AU474593B2 (en)	1976-07-29
AU474511B2 (en)	1976-07-22
AU474838B2 (en)	1976-08-05
BR7407611D0 (en)	1975-07-08
AU476714B2 (en)	1976-09-30
AR201229Q (en)	1975-02-21
AU472848B2 (en)	1976-06-03
AU476696B2 (en)	1976-09-30
AR199451A1 (en)	1974-08-30
JPS5056199A (en)	1975-05-16
AU477823B2 (en)	1975-06-19
AR197627A1 (en)	1974-04-23
AU476873B1 (en)	1975-01-09
AR200256A1 (en)	1974-10-31
AR200885A1 (en)	1974-12-27
AR195948A1 (en)	1973-11-15
AR195311A1 (en)	1973-09-28
AR193950A1 (en)	1973-05-31
AU477824B2 (en)	1975-07-17
AR201432A1 (en)	1975-03-14
AR196382A1 (en)	1973-12-18