JPS502378B1 - - Google Patents
Info
- Publication number
- JPS502378B1 JPS502378B1 JP1393369A JP1393369A JPS502378B1 JP S502378 B1 JPS502378 B1 JP S502378B1 JP 1393369 A JP1393369 A JP 1393369A JP 1393369 A JP1393369 A JP 1393369A JP S502378 B1 JPS502378 B1 JP S502378B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1393369A JPS502378B1 (en) | 1969-02-26 | 1969-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1393369A JPS502378B1 (en) | 1969-02-26 | 1969-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS502378B1 true JPS502378B1 (en) | 1975-01-25 |
Family
ID=11846976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1393369A Pending JPS502378B1 (en) | 1969-02-26 | 1969-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS502378B1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005064494A (en) * | 2003-07-30 | 2005-03-10 | Kyocera Corp | Method for manufacturing electronic component |
| WO2007105635A1 (en) * | 2006-03-10 | 2007-09-20 | Mitsui Mining & Smelting Co., Ltd. | Surface treated elctrolytic copper foil and process for producing the same |
| JP2017511428A (en) * | 2014-02-19 | 2017-04-20 | インドゥストリエ・デ・ノラ・ソチエタ・ペル・アツィオーニ | Anode structure for metal electrowinning cell |
| WO2017098774A1 (en) * | 2015-12-11 | 2017-06-15 | 日立金属株式会社 | Electrode device and metal foil manufacturing method using same |
-
1969
- 1969-02-26 JP JP1393369A patent/JPS502378B1/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005064494A (en) * | 2003-07-30 | 2005-03-10 | Kyocera Corp | Method for manufacturing electronic component |
| WO2007105635A1 (en) * | 2006-03-10 | 2007-09-20 | Mitsui Mining & Smelting Co., Ltd. | Surface treated elctrolytic copper foil and process for producing the same |
| JP2013019056A (en) * | 2006-03-10 | 2013-01-31 | Mitsui Mining & Smelting Co Ltd | Surface treated electrolytic copper foil and copper clad laminate obtained by using the same |
| JP5180815B2 (en) * | 2006-03-10 | 2013-04-10 | 三井金属鉱業株式会社 | Surface-treated electrolytic copper foil and method for producing the same |
| JP2013147755A (en) * | 2006-03-10 | 2013-08-01 | Mitsui Mining & Smelting Co Ltd | Surface-treated electrolytic copper foil and copper clad laminated sheet obtained by using the surface-treated copper foil |
| JP2017511428A (en) * | 2014-02-19 | 2017-04-20 | インドゥストリエ・デ・ノラ・ソチエタ・ペル・アツィオーニ | Anode structure for metal electrowinning cell |
| WO2017098774A1 (en) * | 2015-12-11 | 2017-06-15 | 日立金属株式会社 | Electrode device and metal foil manufacturing method using same |
| JPWO2017098774A1 (en) * | 2015-12-11 | 2018-06-21 | 日立金属株式会社 | Electrode device and metal foil manufacturing method using the same |
| US10633753B2 (en) | 2015-12-11 | 2020-04-28 | Hitachi Metals, Ltd. | Electrode device and metal foil manufacturing method using same |