JPS50161692A - - Google Patents

Info

Publication number
JPS50161692A
JPS50161692A JP6907874A JP6907874A JPS50161692A JP S50161692 A JPS50161692 A JP S50161692A JP 6907874 A JP6907874 A JP 6907874A JP 6907874 A JP6907874 A JP 6907874A JP S50161692 A JPS50161692 A JP S50161692A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6907874A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6907874A priority Critical patent/JPS50161692A/ja
Publication of JPS50161692A publication Critical patent/JPS50161692A/ja
Pending legal-status Critical Current

Links

JP6907874A 1974-06-19 1974-06-19 Pending JPS50161692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6907874A JPS50161692A (en) 1974-06-19 1974-06-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6907874A JPS50161692A (en) 1974-06-19 1974-06-19

Publications (1)

Publication Number Publication Date
JPS50161692A true JPS50161692A (en) 1975-12-27

Family

ID=13392177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6907874A Pending JPS50161692A (en) 1974-06-19 1974-06-19

Country Status (1)

Country Link
JP (1) JPS50161692A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006236921A (en) * 2005-02-28 2006-09-07 Kyocera Corp Conductive paste, ceramic wiring board using it and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006236921A (en) * 2005-02-28 2006-09-07 Kyocera Corp Conductive paste, ceramic wiring board using it and its manufacturing method
JP4673086B2 (en) * 2005-02-28 2011-04-20 京セラ株式会社 Conductor paste for via conductor metallization and method of manufacturing ceramic wiring board using the same

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