JPS50147441A - - Google Patents
Info
- Publication number
- JPS50147441A JPS50147441A JP5558374A JP5558374A JPS50147441A JP S50147441 A JPS50147441 A JP S50147441A JP 5558374 A JP5558374 A JP 5558374A JP 5558374 A JP5558374 A JP 5558374A JP S50147441 A JPS50147441 A JP S50147441A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5558374A JPS50147441A (en) | 1974-05-20 | 1974-05-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5558374A JPS50147441A (en) | 1974-05-20 | 1974-05-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS50147441A true JPS50147441A (en) | 1975-11-26 |
Family
ID=13002746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5558374A Pending JPS50147441A (en) | 1974-05-20 | 1974-05-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS50147441A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55138067A (en) * | 1979-04-11 | 1980-10-28 | Hitachi Ltd | Preventing method of generation of needle crystal from tin plated product |
JP2010531550A (en) * | 2007-06-28 | 2010-09-24 | アギア システムズ インコーポレーテッド | Inhibiting copper dissolution of lead-free solder |
-
1974
- 1974-05-20 JP JP5558374A patent/JPS50147441A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55138067A (en) * | 1979-04-11 | 1980-10-28 | Hitachi Ltd | Preventing method of generation of needle crystal from tin plated product |
JPS64465B2 (en) * | 1979-04-11 | 1989-01-06 | Hitachi Ltd | |
JP2010531550A (en) * | 2007-06-28 | 2010-09-24 | アギア システムズ インコーポレーテッド | Inhibiting copper dissolution of lead-free solder |