JPS501326Y1 - - Google Patents

Info

Publication number
JPS501326Y1
JPS501326Y1 JP11110870U JP11110870U JPS501326Y1 JP S501326 Y1 JPS501326 Y1 JP S501326Y1 JP 11110870 U JP11110870 U JP 11110870U JP 11110870 U JP11110870 U JP 11110870U JP S501326 Y1 JPS501326 Y1 JP S501326Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11110870U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11110870U priority Critical patent/JPS501326Y1/ja
Publication of JPS501326Y1 publication Critical patent/JPS501326Y1/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP11110870U 1970-11-09 1970-11-09 Expired JPS501326Y1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11110870U JPS501326Y1 (ja) 1970-11-09 1970-11-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11110870U JPS501326Y1 (ja) 1970-11-09 1970-11-09

Publications (1)

Publication Number Publication Date
JPS501326Y1 true JPS501326Y1 (ja) 1975-01-14

Family

ID=33271305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11110870U Expired JPS501326Y1 (ja) 1970-11-09 1970-11-09

Country Status (1)

Country Link
JP (1) JPS501326Y1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295808A (ja) * 2008-06-05 2009-12-17 Mitsubishi Electric Corp 樹脂モールド型半導体モジュール
JP2010199494A (ja) * 2009-02-27 2010-09-09 Mitsubishi Electric Corp 半導体装置及び半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295808A (ja) * 2008-06-05 2009-12-17 Mitsubishi Electric Corp 樹脂モールド型半導体モジュール
JP2010199494A (ja) * 2009-02-27 2010-09-09 Mitsubishi Electric Corp 半導体装置及び半導体装置の製造方法

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