JPS5011779A - - Google Patents

Info

Publication number
JPS5011779A
JPS5011779A JP48061970A JP6197073A JPS5011779A JP S5011779 A JPS5011779 A JP S5011779A JP 48061970 A JP48061970 A JP 48061970A JP 6197073 A JP6197073 A JP 6197073A JP S5011779 A JPS5011779 A JP S5011779A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48061970A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48061970A priority Critical patent/JPS5011779A/ja
Publication of JPS5011779A publication Critical patent/JPS5011779A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
JP48061970A 1973-06-04 1973-06-04 Pending JPS5011779A (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48061970A JPS5011779A (de) 1973-06-04 1973-06-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48061970A JPS5011779A (de) 1973-06-04 1973-06-04

Publications (1)

Publication Number Publication Date
JPS5011779A true JPS5011779A (de) 1975-02-06

Family

ID=13186529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48061970A Pending JPS5011779A (de) 1973-06-04 1973-06-04

Country Status (1)

Country Link
JP (1) JPS5011779A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240971A (en) * 1975-09-25 1977-03-30 Texas Instruments Inc Semiconductor device
JPS58443U (ja) * 1981-06-25 1983-01-05 富士通株式会社 半導体装置
JPS589329A (ja) * 1981-07-08 1983-01-19 Agency Of Ind Science & Technol 電極リ−ド線接続方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240971A (en) * 1975-09-25 1977-03-30 Texas Instruments Inc Semiconductor device
JPS58443U (ja) * 1981-06-25 1983-01-05 富士通株式会社 半導体装置
JPS589329A (ja) * 1981-07-08 1983-01-19 Agency Of Ind Science & Technol 電極リ−ド線接続方法

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