JPS50105573A - - Google Patents
Info
- Publication number
- JPS50105573A JPS50105573A JP49144124A JP14412474A JPS50105573A JP S50105573 A JPS50105573 A JP S50105573A JP 49144124 A JP49144124 A JP 49144124A JP 14412474 A JP14412474 A JP 14412474A JP S50105573 A JPS50105573 A JP S50105573A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Formation Of Insulating Films (AREA)
- Lubricants (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US425815A US3885984A (en) | 1973-12-18 | 1973-12-18 | Methyl alkyl silicone thermoconducting compositions |
US425815 | 1973-12-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS50105573A true JPS50105573A (ja) | 1975-08-20 |
JPS5952195B2 JPS5952195B2 (ja) | 1984-12-18 |
Family
ID=23688151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49144124A Expired JPS5952195B2 (ja) | 1973-12-18 | 1974-12-17 | 熱伝導性シリコ−ン組成物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3885984A (ja) |
JP (1) | JPS5952195B2 (ja) |
DE (1) | DE2458507A1 (ja) |
FR (1) | FR2254622B1 (ja) |
GB (1) | GB1480931A (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000327917A (ja) * | 1999-05-24 | 2000-11-28 | Fuji Kobunshi Kogyo Kk | 熱伝導性・電気絶縁性シリコーン組成物 |
JP2003080640A (ja) * | 2001-09-12 | 2003-03-19 | Fuji Kobunshi Kogyo Kk | 熱軟化シート |
US7396872B2 (en) | 2001-03-09 | 2008-07-08 | Dow Corning Toray Silicone Co. | Greasy silicone composition |
US7510998B2 (en) | 2004-05-21 | 2009-03-31 | Shin-Etsu Chemical Co., Ltd. | Silicon grease compositions |
US7592383B2 (en) | 2002-11-08 | 2009-09-22 | Dow Corning Toray Company, Ltd. | Heat conductive silicone composition |
WO2011083880A1 (en) | 2010-01-07 | 2011-07-14 | Dow Corning Toray Co., Ltd. | Thermally conductive silicone grease composition |
US8796190B2 (en) | 2008-01-30 | 2014-08-05 | Dow Corning Toray Company, Ltd. | Thermally conductive silicone grease composition |
WO2015022998A1 (en) | 2013-08-14 | 2015-02-19 | Dow Corning Toray Co., Ltd. | Novel organic silicon compound, surface treatment agent containing same, resin composition containing same, and gel or cured product of same |
KR20160043030A (ko) | 2013-08-14 | 2016-04-20 | 다우 코닝 도레이 캄파니 리미티드 | 신규한 오가노폴리실록산, 이를 포함하는 표면 처리제, 이를 포함하는 수지 조성물, 및 이의 겔상물 또는 경화물 |
US10150902B2 (en) | 2014-04-09 | 2018-12-11 | Dow Corning Toray Co., Ltd. | Thermally conductive silicone composition and electrical/electronic apparatus |
WO2022210782A1 (ja) * | 2021-03-31 | 2022-10-06 | 積水化学工業株式会社 | 側鎖型アルキル変性シリコーン樹脂 |
WO2022210780A1 (ja) * | 2021-03-31 | 2022-10-06 | 積水化学工業株式会社 | 側鎖型アルキル変性シリコーン樹脂 |
WO2022210781A1 (ja) * | 2021-03-31 | 2022-10-06 | 積水化学工業株式会社 | 側鎖型アルキル変性シリコーン樹脂 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4092192A (en) * | 1977-03-10 | 1978-05-30 | Douglas Magyari | High temperature caulking composition and method |
JPS5549803A (en) * | 1978-10-03 | 1980-04-10 | Toray Silicone Co | Electric insulating composition |
US4265775A (en) * | 1979-08-16 | 1981-05-05 | International Business Machines Corporation | Non-bleeding thixotropic thermally conductive material |
DE3366648D1 (en) * | 1983-01-11 | 1986-11-06 | Ferranti Plc | Thermally conducting filler for enclosing electrical components |
FR2570383B1 (fr) * | 1984-09-20 | 1988-03-18 | Nec Corp | Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee |
US4604424A (en) * | 1986-01-29 | 1986-08-05 | Dow Corning Corporation | Thermally conductive polyorganosiloxane elastomer composition |
DE3707320A1 (de) * | 1987-03-07 | 1988-09-15 | Messerschmitt Boelkow Blohm | Einrichtung zur kuehlung eines sensors |
US4803100A (en) * | 1987-10-21 | 1989-02-07 | International Business Machines Corporation | Suspension and use thereof |
US5094769A (en) * | 1988-05-13 | 1992-03-10 | International Business Machines Corporation | Compliant thermally conductive compound |
JPH0619027B2 (ja) * | 1989-02-13 | 1994-03-16 | 信越化学工業株式会社 | 熱伝導性シリコーンオイルコンパウンド |
US5098609A (en) * | 1989-11-03 | 1992-03-24 | The Research Foundation Of State Univ. Of N.Y. | Stable high solids, high thermal conductivity pastes |
JP2580348B2 (ja) * | 1989-11-20 | 1997-02-12 | 信越化学工業 株式会社 | 放熱用グリ―ス組成物 |
US5055741A (en) * | 1990-07-13 | 1991-10-08 | The United States Of America As Represented By The Secretary Of The Air Force | Liquid coolant for high power microwave excited plasma tubes |
US5008593A (en) * | 1990-07-13 | 1991-04-16 | The United States Of America As Represented By The Secretary Of The Air Force | Coaxial liquid cooling of high power microwave excited plasma UV lamps |
US5250209A (en) * | 1991-04-22 | 1993-10-05 | Thermoset Plastics, Inc. | Thermal coupling with water-washable thermally conductive grease |
US5235251A (en) * | 1991-08-09 | 1993-08-10 | The United States Of America As Represented By The Secretary Of The Air Force | Hydraulic fluid cooling of high power microwave plasma tubes |
US5232693A (en) * | 1992-03-09 | 1993-08-03 | Dow Corning Corporation | Method of treating dry skin |
CA2090793A1 (en) * | 1992-10-09 | 1994-04-10 | Ronald Sinclair Nohr | Nonwoven webs having improved tensile strength characteristics |
JP4933094B2 (ja) | 2005-12-27 | 2012-05-16 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
US7816785B2 (en) * | 2009-01-22 | 2010-10-19 | International Business Machines Corporation | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package |
JP6919716B2 (ja) | 2017-11-09 | 2021-08-18 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
JP6866877B2 (ja) | 2018-05-31 | 2021-04-28 | 信越化学工業株式会社 | 低熱抵抗シリコーン組成物 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2900338A (en) * | 1956-05-01 | 1959-08-18 | Postelnck William | Glass fiber-thickened grease compositions |
-
1973
- 1973-12-18 US US425815A patent/US3885984A/en not_active Expired - Lifetime
-
1974
- 1974-10-08 GB GB43586/74A patent/GB1480931A/en not_active Expired
- 1974-12-11 DE DE19742458507 patent/DE2458507A1/de not_active Withdrawn
- 1974-12-17 JP JP49144124A patent/JPS5952195B2/ja not_active Expired
- 1974-12-17 FR FR7441454A patent/FR2254622B1/fr not_active Expired
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000327917A (ja) * | 1999-05-24 | 2000-11-28 | Fuji Kobunshi Kogyo Kk | 熱伝導性・電気絶縁性シリコーン組成物 |
US7396872B2 (en) | 2001-03-09 | 2008-07-08 | Dow Corning Toray Silicone Co. | Greasy silicone composition |
JP2003080640A (ja) * | 2001-09-12 | 2003-03-19 | Fuji Kobunshi Kogyo Kk | 熱軟化シート |
US7592383B2 (en) | 2002-11-08 | 2009-09-22 | Dow Corning Toray Company, Ltd. | Heat conductive silicone composition |
US7510998B2 (en) | 2004-05-21 | 2009-03-31 | Shin-Etsu Chemical Co., Ltd. | Silicon grease compositions |
US8796190B2 (en) | 2008-01-30 | 2014-08-05 | Dow Corning Toray Company, Ltd. | Thermally conductive silicone grease composition |
WO2011083880A1 (en) | 2010-01-07 | 2011-07-14 | Dow Corning Toray Co., Ltd. | Thermally conductive silicone grease composition |
WO2015022998A1 (en) | 2013-08-14 | 2015-02-19 | Dow Corning Toray Co., Ltd. | Novel organic silicon compound, surface treatment agent containing same, resin composition containing same, and gel or cured product of same |
KR20160043030A (ko) | 2013-08-14 | 2016-04-20 | 다우 코닝 도레이 캄파니 리미티드 | 신규한 오가노폴리실록산, 이를 포함하는 표면 처리제, 이를 포함하는 수지 조성물, 및 이의 겔상물 또는 경화물 |
US10604658B2 (en) | 2013-08-14 | 2020-03-31 | Dow Toray Co., Ltd. | Organic silicon compound, surface treatment agent containing same, resin composition containing same, and gel or cured product of same |
US10150902B2 (en) | 2014-04-09 | 2018-12-11 | Dow Corning Toray Co., Ltd. | Thermally conductive silicone composition and electrical/electronic apparatus |
WO2022210782A1 (ja) * | 2021-03-31 | 2022-10-06 | 積水化学工業株式会社 | 側鎖型アルキル変性シリコーン樹脂 |
WO2022210780A1 (ja) * | 2021-03-31 | 2022-10-06 | 積水化学工業株式会社 | 側鎖型アルキル変性シリコーン樹脂 |
WO2022210781A1 (ja) * | 2021-03-31 | 2022-10-06 | 積水化学工業株式会社 | 側鎖型アルキル変性シリコーン樹脂 |
Also Published As
Publication number | Publication date |
---|---|
FR2254622A1 (ja) | 1975-07-11 |
JPS5952195B2 (ja) | 1984-12-18 |
US3885984A (en) | 1975-05-27 |
DE2458507A1 (de) | 1975-06-19 |
GB1480931A (en) | 1977-07-27 |
FR2254622B1 (ja) | 1979-10-12 |