JPS4984385A - - Google Patents
Info
- Publication number
- JPS4984385A JPS4984385A JP12614072A JP12614072A JPS4984385A JP S4984385 A JPS4984385 A JP S4984385A JP 12614072 A JP12614072 A JP 12614072A JP 12614072 A JP12614072 A JP 12614072A JP S4984385 A JPS4984385 A JP S4984385A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12614072A JPS4984385A (en) | 1972-12-18 | 1972-12-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12614072A JPS4984385A (en) | 1972-12-18 | 1972-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4984385A true JPS4984385A (en) | 1974-08-13 |
Family
ID=14927649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12614072A Pending JPS4984385A (en) | 1972-12-18 | 1972-12-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4984385A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49126288A (en) * | 1973-04-04 | 1974-12-03 | ||
JPS51124388A (en) * | 1975-04-24 | 1976-10-29 | Toshiba Corp | Solid state light emitting display unit |
JPS52137786U (en) * | 1976-04-15 | 1977-10-19 | ||
JPS52130294A (en) * | 1976-04-24 | 1977-11-01 | Oki Electric Ind Co Ltd | Production of semiconductor device |
JPS5725009U (en) * | 1980-07-21 | 1982-02-09 | ||
JPH10256605A (en) * | 1997-03-13 | 1998-09-25 | Rohm Co Ltd | Semiconductor light emitting element |
EP1021817A1 (en) * | 1997-07-14 | 2000-07-26 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
JP2005072628A (en) * | 2004-12-13 | 2005-03-17 | Rohm Co Ltd | Semiconductor light emitting device |
-
1972
- 1972-12-18 JP JP12614072A patent/JPS4984385A/ja active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49126288A (en) * | 1973-04-04 | 1974-12-03 | ||
JPS5325634B2 (en) * | 1973-04-04 | 1978-07-27 | ||
JPS51124388A (en) * | 1975-04-24 | 1976-10-29 | Toshiba Corp | Solid state light emitting display unit |
JPS52137786U (en) * | 1976-04-15 | 1977-10-19 | ||
JPS52130294A (en) * | 1976-04-24 | 1977-11-01 | Oki Electric Ind Co Ltd | Production of semiconductor device |
JPS5625033B2 (en) * | 1976-04-24 | 1981-06-10 | ||
JPS5725009U (en) * | 1980-07-21 | 1982-02-09 | ||
JPH10256605A (en) * | 1997-03-13 | 1998-09-25 | Rohm Co Ltd | Semiconductor light emitting element |
EP1021817A1 (en) * | 1997-07-14 | 2000-07-26 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
EP1021817A4 (en) * | 1997-07-14 | 2005-08-03 | Lumileds Lighting Us L L C | Fluorescent dye added to epoxy of light emitting diode lens |
JP2005072628A (en) * | 2004-12-13 | 2005-03-17 | Rohm Co Ltd | Semiconductor light emitting device |