JPS4930870A - - Google Patents
Info
- Publication number
- JPS4930870A JPS4930870A JP47073424A JP7342472A JPS4930870A JP S4930870 A JPS4930870 A JP S4930870A JP 47073424 A JP47073424 A JP 47073424A JP 7342472 A JP7342472 A JP 7342472A JP S4930870 A JPS4930870 A JP S4930870A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47073424A JPS4930870A (ko) | 1972-07-24 | 1972-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47073424A JPS4930870A (ko) | 1972-07-24 | 1972-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4930870A true JPS4930870A (ko) | 1974-03-19 |
Family
ID=13517818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47073424A Pending JPS4930870A (ko) | 1972-07-24 | 1972-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4930870A (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259875A (en) * | 1975-11-13 | 1977-05-17 | Mitsubishi Electric Corp | Transmission line and its forming method |
| JP2010062516A (ja) * | 2008-09-04 | 2010-03-18 | Samsung Electro-Mechanics Co Ltd | マイクロストリップラインを備えた印刷回路基板、ストリップラインを備えた印刷回路基板、及びそれらの製造方法 |
-
1972
- 1972-07-24 JP JP47073424A patent/JPS4930870A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259875A (en) * | 1975-11-13 | 1977-05-17 | Mitsubishi Electric Corp | Transmission line and its forming method |
| JP2010062516A (ja) * | 2008-09-04 | 2010-03-18 | Samsung Electro-Mechanics Co Ltd | マイクロストリップラインを備えた印刷回路基板、ストリップラインを備えた印刷回路基板、及びそれらの製造方法 |