JPS4923127A - - Google Patents
Info
- Publication number
- JPS4923127A JPS4923127A JP6381272A JP6381272A JPS4923127A JP S4923127 A JPS4923127 A JP S4923127A JP 6381272 A JP6381272 A JP 6381272A JP 6381272 A JP6381272 A JP 6381272A JP S4923127 A JPS4923127 A JP S4923127A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6381272A JPS4923127A (en) | 1972-06-26 | 1972-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6381272A JPS4923127A (en) | 1972-06-26 | 1972-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4923127A true JPS4923127A (en) | 1974-03-01 |
Family
ID=13240145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6381272A Pending JPS4923127A (en) | 1972-06-26 | 1972-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4923127A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4733235U (en) * | 1971-05-04 | 1972-12-14 | ||
| WO2003064722A1 (en) * | 2002-01-30 | 2003-08-07 | Nikko Materials Company, Limited | Copper alloy sputtering target and method for manufacturing the target |
| US7740721B2 (en) | 2003-03-17 | 2010-06-22 | Nippon Mining & Metals Co., Ltd | Copper alloy sputtering target process for producing the same and semiconductor element wiring |
| US8246764B2 (en) | 2002-11-21 | 2012-08-21 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target and semiconductor element wiring |
-
1972
- 1972-06-26 JP JP6381272A patent/JPS4923127A/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4733235U (en) * | 1971-05-04 | 1972-12-14 | ||
| JPS5131854Y2 (en) * | 1971-05-04 | 1976-08-10 | ||
| WO2003064722A1 (en) * | 2002-01-30 | 2003-08-07 | Nikko Materials Company, Limited | Copper alloy sputtering target and method for manufacturing the target |
| US9896745B2 (en) | 2002-01-30 | 2018-02-20 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target and method for manufacturing the target |
| US8246764B2 (en) | 2002-11-21 | 2012-08-21 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target and semiconductor element wiring |
| US10665462B2 (en) | 2002-11-21 | 2020-05-26 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target and semiconductor element wiring |
| US7740721B2 (en) | 2003-03-17 | 2010-06-22 | Nippon Mining & Metals Co., Ltd | Copper alloy sputtering target process for producing the same and semiconductor element wiring |
| US9765425B2 (en) | 2003-03-17 | 2017-09-19 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target, process for producing the same and semiconductor element wiring |