JPS4864879A - - Google Patents
Info
- Publication number
- JPS4864879A JPS4864879A JP9942071A JP9942071A JPS4864879A JP S4864879 A JPS4864879 A JP S4864879A JP 9942071 A JP9942071 A JP 9942071A JP 9942071 A JP9942071 A JP 9942071A JP S4864879 A JPS4864879 A JP S4864879A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9942071A JPS4864879A (ja) | 1971-12-10 | 1971-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9942071A JPS4864879A (ja) | 1971-12-10 | 1971-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4864879A true JPS4864879A (ja) | 1973-09-07 |
Family
ID=14246965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9942071A Pending JPS4864879A (ja) | 1971-12-10 | 1971-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4864879A (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5073572A (ja) * | 1973-10-30 | 1975-06-17 | ||
| US9434009B2 (en) | 2011-05-18 | 2016-09-06 | Uht Corporation | Drill and boring device using same |
-
1971
- 1971-12-10 JP JP9942071A patent/JPS4864879A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5073572A (ja) * | 1973-10-30 | 1975-06-17 | ||
| JPS588136B2 (ja) * | 1973-10-30 | 1983-02-14 | 日本電気ホームエレクトロニクス株式会社 | ソシトリツケヨウキタイ |
| US9434009B2 (en) | 2011-05-18 | 2016-09-06 | Uht Corporation | Drill and boring device using same |