JPS4710181Y1 - - Google Patents

Info

Publication number
JPS4710181Y1
JPS4710181Y1 JP741368U JP741368U JPS4710181Y1 JP S4710181 Y1 JPS4710181 Y1 JP S4710181Y1 JP 741368 U JP741368 U JP 741368U JP 741368 U JP741368 U JP 741368U JP S4710181 Y1 JPS4710181 Y1 JP S4710181Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP741368U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP741368U priority Critical patent/JPS4710181Y1/ja
Publication of JPS4710181Y1 publication Critical patent/JPS4710181Y1/ja
Expired legal-status Critical Current

Links

JP741368U 1968-02-05 1968-02-05 Expired JPS4710181Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP741368U JPS4710181Y1 (en) 1968-02-05 1968-02-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP741368U JPS4710181Y1 (en) 1968-02-05 1968-02-05

Publications (1)

Publication Number Publication Date
JPS4710181Y1 true JPS4710181Y1 (en) 1972-04-17

Family

ID=42907785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP741368U Expired JPS4710181Y1 (en) 1968-02-05 1968-02-05

Country Status (1)

Country Link
JP (1) JPS4710181Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5543363A (en) * 1992-04-28 1996-08-06 Mitsubishi Denki Kabushiki Kaisha Process for adhesively attaching a semiconductor device to an electrode plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5543363A (en) * 1992-04-28 1996-08-06 Mitsubishi Denki Kabushiki Kaisha Process for adhesively attaching a semiconductor device to an electrode plate

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