Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
  • H01L21/4807—Ceramic parts
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
  • B28B1/00—Producing shaped prefabricated articles from the material
  • B28B1/14—Producing shaped prefabricated articles from the material by simple casting, the material being neither forcibly fed nor positively compacted
  • B28B1/16—Producing shaped prefabricated articles from the material by simple casting, the material being neither forcibly fed nor positively compacted for producing layered articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
  • B28B1/00—Producing shaped prefabricated articles from the material
  • B28B1/26—Producing shaped prefabricated articles from the material by slip-casting, i.e. by casting a suspension or dispersion of the material in a liquid-absorbent or porous mould, the liquid being allowed to soak into or pass through the walls of the mould; Moulds therefor ; specially for manufacturing articles starting from a ceramic slip; Moulds therefor
  • B28B1/267—Producing shaped prefabricated articles from the material by slip-casting, i.e. by casting a suspension or dispersion of the material in a liquid-absorbent or porous mould, the liquid being allowed to soak into or pass through the walls of the mould; Moulds therefor ; specially for manufacturing articles starting from a ceramic slip; Moulds therefor in moulds or on moulding surfaces supported by, or formed in or by, conveyors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
  • B28B13/00—Feeding the unshaped material to moulds or apparatus for producing shaped articles; Discharging shaped articles from such moulds or apparatus
  • B28B13/02—Feeding the unshaped material to moulds or apparatus for producing shaped articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
  • B28B19/00—Machines or methods for applying the material to surfaces to form a permanent layer thereon
  • B28B19/0015—Machines or methods for applying the material to surfaces to form a permanent layer thereon on multilayered articles
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Mechanical Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Dispersion Chemistry (AREA)
• Power Engineering (AREA)
• Compositions Of Oxide Ceramics (AREA)
• Mold Materials And Core Materials (AREA)
• Laminated Bodies (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (2)

Family

ID=65041501

Family Applications (1)

Country Status (13)

Cited By (8)

Families Citing this family (18)

Family Cites Families (5)

• 1970
  • 1970-02-19 US US12666A patent/US3652378A/en not_active Expired - Lifetime
  • 1970-10-13 CA CA095372A patent/CA936183A/en not_active Expired
• 1971
  • 1971-02-11 SE SE7101725A patent/SE373566B/xx unknown
  • 1971-02-15 IL IL36187A patent/IL36187A/xx unknown
  • 1971-02-15 NL NL7101995A patent/NL7101995A/xx unknown
  • 1971-02-15 IE IE178/71A patent/IE34951B1/xx unknown
  • 1971-02-16 BE BE763006A patent/BE763006A/xx unknown
  • 1971-02-18 DE DE2107797A patent/DE2107797C3/de not_active Expired
  • 1971-02-18 ES ES388813A patent/ES388813A1/es not_active Expired
  • 1971-02-18 FR FR7105496A patent/FR2083089A5/fr not_active Expired
  • 1971-02-19 CH CH245071A patent/CH555302A5/xx not_active IP Right Cessation
  • 1971-02-19 JP JP46007454A patent/JPS5010881B1/ja active Pending
  • 1971-04-19 GB GB2183671A patent/GB1344004A/en not_active Expired

Also Published As

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