JPH1163547A - Cooling structure of casing for storing electronic equipment - Google Patents

Cooling structure of casing for storing electronic equipment

Info

Publication number
JPH1163547A
JPH1163547A JP9220480A JP22048097A JPH1163547A JP H1163547 A JPH1163547 A JP H1163547A JP 9220480 A JP9220480 A JP 9220480A JP 22048097 A JP22048097 A JP 22048097A JP H1163547 A JPH1163547 A JP H1163547A
Authority
JP
Japan
Prior art keywords
housing
air
electronic equipment
casing
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9220480A
Other languages
Japanese (ja)
Other versions
JP2910740B2 (en
Inventor
Norio Shibuya
則雄 渋谷
Norihiro Ooura
教宏 大浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP9220480A priority Critical patent/JP2910740B2/en
Publication of JPH1163547A publication Critical patent/JPH1163547A/en
Application granted granted Critical
Publication of JP2910740B2 publication Critical patent/JP2910740B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20736Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Air-Conditioning Room Units, And Self-Contained Units In General (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable a concurrent cooling of a stored electronic equipment to be carried out from two directions at its lower side and front side by a method wherein a casing is cooled from below with cooling air flowed out of arm air conditioner facility, the lower side of the casing is formed an aeration hole and the cold air to be fed is guided to the front surface of the electronic equipment. SOLUTION: Cold air 7 flowed out of an air conditioner facility directly cools a frame 6 of a casing 1. Concurrently, its partial cold air 7a passes through an aeration hole 8, this cold air is regulated to flow in one direction by a plurality of flow straightening plates 9 formed alone an arranging direction of the aeration hole 8 in such a way that it may be directed toward the front surface of the electronic equipment 5 exposed at the front surface of the casing 1 so as to perform a direct cooling of the electronic equipment 5. Further, a part of the cold air 7 ascends to cool the electronic equipment 5 together with air 10 in a computer room. Due to this fact, the electronic equipment stored in the casing 1 is cooled concurrently at two directions of lower side and front surface side to improve a cooling efficiency. Further, since its structure is simple, it can be easily adapted for its small-sized state and a light- weight state in an instant manner.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子機器収納用筐
体の冷却構造に関し、特に、発熱する電子機器を効果的
に冷却するための電子機器収納用筐体の冷却構造に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an electronic device housing, and more particularly to a cooling structure for an electronic device housing for effectively cooling an electronic device that generates heat.

【0002】[0002]

【従来の技術】従来、複数の電子機器を収納する筐体を
冷却する場合、例えば、コンピュータ室内に設置される
筐体では、コンピュータ室内の一定温度にコントロール
されている空気を取り入れることにより、内部に収納さ
れている電子機器を冷却する構造が採られている。ま
た、該筐体が床下に空調設備を施したコンピュータ室等
に設置される場合、該筐体に収納される電子機器の近傍
に、前記空調設備から送風される冷気を取り入れるため
の導入口を形成し、該導入口から流入する冷気により電
子機器の冷却効果を上げている構造のものも採られてい
る。
2. Description of the Related Art Conventionally, when cooling a housing housing a plurality of electronic devices, for example, in a housing installed in a computer room, air controlled at a constant temperature in the computer room is taken into the housing. The structure which cools the electronic device stored in this is adopted. Further, when the housing is installed in a computer room or the like provided with air conditioning equipment under the floor, an introduction port for taking in cool air blown from the air conditioning equipment is provided near electronic devices housed in the housing. Also, there is adopted a structure in which the cooling effect of the electronic device is enhanced by the cool air flowing from the inlet.

【0003】また、筐体の冷却構造の一例として、例え
ば、特開昭57−159096号公報に開示されている
ように、熱を発生する電子機器を収納する筐体の上面に
ルーバー方式等を採用することにより開閉自在とされた
天井板を設けるとともに、下面にパンチング形状等の床
板を設けた構造のものが提案されている。
Further, as an example of a cooling structure of a housing, for example, as disclosed in Japanese Patent Application Laid-Open No. 57-159096, a louver system or the like is provided on the upper surface of a housing for housing heat-generating electronic devices. There has been proposed a structure in which a ceiling plate which can be freely opened and closed by being adopted is provided, and a floor plate having a punching shape or the like is provided on the lower surface.

【0004】この構造では、前記筐体の側面の上下部に
設けられた開口部のいずれか一方にエアフィルタを配置
するとともに、いずれか他方に閉ぐ板を配置し、上下の
任意の方向に送風を行なうことのできるファンを設けて
いる。特に、電子部品実装ゲートの上下に着脱自在にフ
ァンを設けたことにより、ファンの風の方向が下向きま
たは上向きに変更可能な構成になっている。
In this structure, an air filter is arranged in one of the openings provided in the upper and lower portions of the side surface of the housing, and a plate for closing is arranged in one of the other, so that the air filter can be arranged in any direction up and down. There is a fan that can blow air. In particular, by providing a detachable fan above and below the electronic component mounting gate, the direction of the wind of the fan can be changed downward or upward.

【0005】[0005]

【発明が解決しようとする課題】第1の問題点は、コン
ピュータ室内に設置された筐体を冷却する場合、収納さ
れる電子機器の冷却をコンピュータ室内の空気を取り入
れることにより行っているが、コンピュータ室内の空気
は、他の装置から排出された温風をも含んでいるため
に、常に良好な冷気状態を保持し得るとは限らず、前記
筐体に収納されている電子機器を冷却するのに充分な冷
気を取り入れることができない虞が生じる点である。
A first problem is that, when cooling a housing installed in a computer room, electronic equipment to be stored is cooled by taking in air in the computer room. Since the air in the computer room also includes hot air discharged from other devices, it cannot always maintain a good cold air condition, and cools electronic devices housed in the housing. There is a possibility that sufficient cold air cannot be taken in.

【0006】また、第2の問題点は、前記筐体を床下に
空調設備を施したコンピュータ室等に設置する場合、該
筐体の床下には、収納される電子機器に電力を供給する
電源ケーブル、電子機器間のデータ信号をやり取りする
ためのインターフェースケーブル等が収容されており、
これらのケーブル等により筐体内の電子機器への冷却効
率を低下させる要因となるために、該筐体の近傍の床面
に導入口を形成して該筐体内に冷気を取り入れる必要が
あった。
A second problem is that when the casing is installed in a computer room or the like with an air conditioner installed under the floor, a power supply for supplying power to electronic devices to be housed is provided under the floor of the casing. It houses cables, interface cables etc. for exchanging data signals between electronic devices,
Since these cables and the like cause a reduction in the cooling efficiency of the electronic device in the housing, it is necessary to form an inlet on the floor near the housing to take in cool air into the housing.

【0007】また、ルーバー方式等を取り入れた筐体で
は。確かに冷却効果はあるものの、天井板や床板を特殊
な形状に変更する必要があり、また、ルーバーや電子部
品実装ゲートに設けられたファン等の駆動装置が必要に
なり、構造が複雑になり、大型になるという問題点があ
った。
[0007] Further, in a case employing a louver system or the like. Although it does have a cooling effect, it is necessary to change the ceiling plate and floor plate to a special shape, and a drive device such as a louver and a fan installed on the gate for mounting electronic components is required, which complicates the structure. There was a problem that it became large.

【0008】本発明は上記の事情に鑑みてなされたもの
であって、筐体に収納されている電子機器を冷却するの
に充分必要な冷気を取り入れることができ、しかも、構
造が簡単で、小型化、軽量化が可能な電子機器収納用筐
体の冷却構造を提供することにある。
The present invention has been made in view of the above circumstances, and can take in sufficient cold air for cooling electronic devices housed in a housing, and has a simple structure. An object of the present invention is to provide a cooling structure of an electronic device housing that can be reduced in size and weight.

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に、本発明は次の様な電子機器収納用筐体の冷却構造を
採用した。すなわち、請求項1記載の電子機器収納用筐
体の冷却構造は、1つもしくは複数の電子機器を収納す
る筐体の冷却構造であり、該筐体の下部に、外部から冷
気を導入する通気孔を形成し、該通気孔近傍に、導入さ
れた冷気を整流する整流部材を設けたものである。
In order to solve the above-mentioned problems, the present invention employs the following cooling structure for a housing for electronic equipment. In other words, the cooling structure of the electronic device housing according to the first aspect is a cooling structure of a housing for housing one or a plurality of electronic devices, and a cooling air is introduced into the lower part of the housing from the outside. The air hole is formed, and a rectifying member for rectifying the introduced cool air is provided near the air hole.

【0010】請求項2記載の電子機器収納用筐体の冷却
構造は、前記筐体を、空調設備が設けられた床の上に設
け、前記空調設備から流出する冷気を前記整流部材によ
り前記電子機器に向かって誘導するものである。
The cooling structure for a housing for electronic equipment storage according to claim 2, wherein the housing is provided on a floor provided with an air conditioner, and cool air flowing out of the air conditioner is supplied to the electronic device by the rectifying member. It is directed toward the device.

【0011】本発明の請求項1記載の電子機器収納用筐
体の冷却構造では、筐体の下部に、外部から冷気を導入
する通気孔を形成し、該通気孔の近傍に、導入された冷
気を整流する整流部材を設けたことにより、通気孔より
導入された冷気は、前記整流部材により筐体に向かって
一様に流れることとなり、この一様な流れの冷気が内部
に収納される電子機器を冷却し続ける。これにより、収
納される電子機器は効果的に冷却される。
In the cooling structure for an electronic device housing according to the first aspect of the present invention, a ventilation hole for introducing cool air from outside is formed in a lower portion of the housing, and the cooling air is introduced near the ventilation hole. By providing the rectifying member for rectifying the cool air, the cool air introduced from the ventilation hole flows uniformly toward the housing by the rectifying member, and the cool air having the uniform flow is stored inside. Keep the electronics cool. As a result, the stored electronic devices are effectively cooled.

【0012】請求項2記載の電子機器収納用筐体の冷却
構造では、前記筐体を、空調設備が設けられた床の上に
設け、前記空調設備から流出する冷気を前記整流部材に
より前記電子機器に向かって誘導することにより、通気
孔より導入された冷気は、前記整流部材により前記電子
機器に向かって誘導されることとなり、収納される電子
機器の冷却効率がさらに向上する。
In the cooling structure for a housing for storing electronic equipment according to the present invention, the housing is provided on a floor provided with an air conditioner, and cool air flowing out of the air conditioner is rectified by the rectifying member. By guiding toward the device, the cool air introduced from the ventilation hole is guided toward the electronic device by the rectifying member, and the cooling efficiency of the stored electronic device is further improved.

【0013】[0013]

【発明の実施の形態】以下、本発明の電子機器収納用筐
体の冷却構造の一実施形態について図面に基づき説明す
る。図1は本発明の一実施形態の電子機器収納用筐体の
冷却構造を示す正面図、図2は図1のA−A線に沿う断
面図であり、図において、1は前面1aの2箇所が開口
された縦型の筐体、2は該筐体1が設置された床面、3
は床面2下に設置された空調設備、4、5は筐体1に収
納され前面が該筐体1より露出されている電子機器、6
は筐体1の底部を構成する架台(筐体の下部)でありそ
の一部が前方に張り出した断面台形状の張出部6aとな
っている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a cooling structure for a housing for electronic equipment according to the present invention will be described below with reference to the drawings. FIG. 1 is a front view showing a cooling structure of an electronic device housing according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line AA of FIG. A vertical housing 2 having an opening, a floor surface 2 on which the housing 1 is installed, 3
Is an air conditioner installed below the floor surface 2, 4 and 5 are electronic devices housed in the housing 1 and the front surface of which is exposed from the housing 1, 6
Is a gantry (a lower part of the housing) constituting a bottom portion of the housing 1 and a part thereof is formed as a protrusion 6a having a trapezoidal cross section which projects forward.

【0014】7は前記空調設備3から流出する冷気、8
は架台6の張出部6a上面に形成され前記空調設備3か
ら流出する一部の冷気7aを通過させる通気孔、9は該
通気孔8の配列方向に沿って該通気孔の一端部に設けら
れ前記冷気7aを一方向に整流する複数の板状の冷気整
流具(整流部材)である。なお、10は一定温度に管理
されているコンピュータ室内の空気である。
7 is cold air flowing out of the air conditioner 3, 8
Are ventilation holes formed on the upper surface of the overhanging portion 6a of the gantry 6 to allow a part of the cool air 7a flowing out of the air conditioning equipment 3 to pass therethrough. And a plurality of plate-shaped cool air rectifiers (rectifier members) for rectifying the cool air 7a in one direction. Reference numeral 10 denotes air in a computer room managed at a constant temperature.

【0015】次に、この筐体1の動作について説明す
る。空調設備3から流出する冷気7は筐体1の架台6を
下方から直接冷却すると同時に、その一部の冷気7aが
通気孔8を通過し、冷気整流具9により筐体1の前面、
即ち電子機器5の露出した前面に向かう様に一方向に整
流されて該電子機器5を直接冷却する。この冷気7aの
さらに一部は、上昇してコンピュータ室内の空気10と
ともに電子機器4を冷却する。
Next, the operation of the housing 1 will be described. The cool air 7 flowing out of the air conditioner 3 directly cools the gantry 6 of the housing 1 from below, and at the same time, a part of the cool air 7 a passes through the ventilation hole 8, and the cool air rectifier 9 causes the front surface of the housing 1 to cool.
That is, the flow is rectified in one direction toward the exposed front surface of the electronic device 5 to directly cool the electronic device 5. A part of the cool air 7a rises to cool the electronic device 4 together with the air 10 in the computer room.

【0016】この筐体1によれば、筐体1の架台6の張
出部6aに空調設備3から流出する冷気7を通過させる
通気孔8を形成し、該通気孔8の配列方向に沿って複数
の冷気整流具9を設けたので、筐体1に収納された電子
機器4、5を、空調設備3から流出する冷気7とコンピ
ュータ室内の空気10とを用いて効果的に冷却すること
ができる。
According to the housing 1, the ventilation hole 8 for passing the cool air 7 flowing out of the air conditioner 3 is formed in the projecting portion 6 a of the gantry 6 of the housing 1. Since the plurality of cool air rectifiers 9 are provided, the electronic devices 4 and 5 housed in the housing 1 can be effectively cooled using the cool air 7 flowing out of the air conditioner 3 and the air 10 in the computer room. Can be.

【0017】従来では、筐体内の電子機器を冷却する場
合、コンピュータ室の空気を用いているために、常に良
好な冷気状態を保持し得るとは限らなかったが、本実施
形態では、空調設備3からの冷気7とコンピュータ室内
の空気10とを充分取り入れて冷却する構造としたの
で、簡単でしかも冷却効果の高い電子機器収納用筐体を
提供することができる。
In the past, when cooling electronic equipment in a housing, air in a computer room was used, so that it was not always possible to always maintain a good cool air condition. Since the structure is such that the cool air 7 from 3 and the air 10 in the computer room are sufficiently taken in and cooled, it is possible to provide an electronic device housing that is simple and has a high cooling effect.

【0018】なお、本実施形態では、架台6の張出部6
aに形成した通気孔8の一端部に冷気整流具9を設けた
構成としたが、通気孔8及び冷気整流具9は、筐体1内
の電子機器4、5を冷却することのできるものであれば
よく、通気孔8の位置や大きさ、数量、及び冷気整流具
9の形状や数量は、電子機器4、5の大きさや位置、空
調設備の位置や大きさ等に合わせて適宜変更可能であ
る。
In the present embodiment, the projecting portion 6
The configuration is such that the cool air rectifier 9 is provided at one end of the air hole 8 formed in a. However, the air hole 8 and the cool air rectifier 9 can cool the electronic devices 4 and 5 in the housing 1. The position, size, and number of the ventilation holes 8 and the shape and number of the cool air rectifier 9 are appropriately changed according to the sizes and positions of the electronic devices 4 and 5 and the positions and sizes of the air conditioning equipment. It is possible.

【0019】[0019]

【発明の効果】以上説明した様に、本発明の請求項1記
載の電子機器収納用筐体の冷却構造によれば、筐体の下
部に、外部から冷気を導入する通気孔を形成し、該通気
孔の近傍に、導入された冷気を整流する整流部材を設け
たので、通気孔より導入された冷気が、前記整流部材に
より筐体に向かって一様に流れ、該筐体に収納される電
子機器を効率良く冷却することとなり、筐体に収納され
ている電子機器を充分に冷却することができる。しか
も、構造が簡単であるから、小型化、軽量化に即座に対
応することができる。
As described above, according to the cooling structure of the electronic device housing of the first aspect of the present invention, a ventilation hole for introducing cool air from the outside is formed at the lower portion of the housing. A rectifying member for rectifying the introduced cool air is provided in the vicinity of the ventilation hole, so that the cool air introduced from the ventilation hole flows uniformly toward the housing by the rectifying member and is stored in the housing. The electronic device can be efficiently cooled, and the electronic device housed in the housing can be sufficiently cooled. Moreover, since the structure is simple, it is possible to immediately cope with reduction in size and weight.

【0020】請求項2記載の電子機器収納用筐体の冷却
構造によれば、前記筐体を、空調設備が設けられた床の
上に設け、前記空調設備から流出する冷気を前記整流部
材により前記電子機器に向かって誘導したので、通気孔
より導入された冷気は、前記整流部材により前記電子機
器に向かって誘導され、収納される電子機器の冷却効率
をさらに向上されることができる。
According to the cooling structure of the electronic equipment housing of the present invention, the housing is provided on the floor provided with the air conditioner, and the cool air flowing out of the air conditioner is controlled by the rectifying member. Since the air is guided toward the electronic device, the cool air introduced from the ventilation hole is guided toward the electronic device by the rectifying member, and the cooling efficiency of the stored electronic device can be further improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の一実施形態の電子機器収納用筐体の
冷却構造を示す正面図である。
FIG. 1 is a front view showing a cooling structure of an electronic device housing according to an embodiment of the present invention.

【図2】 図1のA−A線に沿う断面図である。FIG. 2 is a sectional view taken along line AA of FIG.

【符号の説明】[Explanation of symbols]

1 筐体 2 床面 3 空調設備 4、5 電子機器 6 架台(筐体の下部) 6a 張出部 7 冷気 7a 一部の冷気 8 通気孔 9 冷気整流具(整流部材) 10 コンピュータ室内の空気 DESCRIPTION OF SYMBOLS 1 Housing 2 Floor surface 3 Air conditioning equipment 4, 5 Electronic equipment 6 Stand (lower part of housing) 6a Overhanging part 7 Cold air 7a Partial cool air 8 Vent 9 Cool air rectifier (rectifying member) 10 Air in computer room

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成10年10月16日[Submission date] October 16, 1998

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】特許請求の範囲[Correction target item name] Claims

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【特許請求の範囲】[Claims]

【手続補正2】[Procedure amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0009[Correction target item name] 0009

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に、本発明は次の様な電子機器収納用筐体の冷却構造を
採用した。すなわち、請求項1記載の電子機器収納用筐
体の冷却構造は、1つもしくは複数の電子機器を収納す
る筐体の冷却構造であり、該筐体を、空調設備が設けら
れた床の上に設け、該空調設備から流出する冷気により
前記筐体を下方から冷却するとともに、前記筐体の下部
に、前記空調設備から流出する冷気の一部を導入して外
部へ排出する通気孔を形成し、該通気孔近傍に、導入さ
れた冷気を前記電子機器の前面に向かって誘導する整流
部材を設けたものである。
In order to solve the above-mentioned problems, the present invention employs the following cooling structure for a housing for electronic equipment. That is, the cooling structure of the electronic device housing according to the first aspect is a cooling structure of a housing for housing one or a plurality of electronic devices .
Installed on a raised floor, and
While cooling the casing from below, a part of cool air flowing out of the air conditioning equipment is introduced and
And a rectifying member that guides the introduced cool air toward the front surface of the electronic device is provided near the ventilation hole.

【手続補正3】[Procedure amendment 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0010[Correction target item name] 0010

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0010】請求項2記載の電子機器収納用筐体の冷却
構造は、前記整流部材は、複数の板状体からなり、該板
状体は、前記電子機器の前面に向かって傾斜してなる
のである。
According to a second aspect of the present invention , in the cooling structure for an electronic device housing, the rectifying member includes a plurality of plate-like members.
The shape is inclined toward a front surface of the electronic device .

【手続補正4】[Procedure amendment 4]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0011[Correction target item name] 0011

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0011】本発明の請求項1記載の電子機器収納用筐
体の冷却構造では、筐体の下部に、前記空調設備から流
出する冷気の一部を導入して外部へ排出する通気孔を形
成し、該通気孔の近傍に、導入された冷気を前記電子機
器の前面に向かって誘導する整流部材を設けたことによ
り、前記筐体に収納された電子機器を下方と前面の2方
向から同時に冷却することが可能になる。これにより、
収納される電子機器は効果的に冷却される。
In the cooling structure for an electronic device housing according to the first aspect of the present invention, a flow from the air conditioning equipment is provided below the housing.
Introducing a portion of the output to the cool air to form a vent for discharging to the outside, in the vicinity of the vent pores, said electronic device the introduced cool air
By providing a rectifying member for guiding toward the front of the container, the electronic device housed in the housing can be moved downward and forward.
It becomes possible to cool from the same direction. This allows
The stored electronic devices are effectively cooled.

【手続補正5】[Procedure amendment 5]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0012[Correction target item name] 0012

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0012】請求項2記載の電子機器収納用筐体の冷却
構造では、整流部材の複数の板状体を前記電子機器の前
面に向かって傾斜させたことにより、通気孔より導入さ
れた冷気は、前記板状体により前記電子機器の前面に向
かって誘導されることとなり、収納される電子機器の冷
却効率がさらに向上する。
[0012] In the cooling structure of the electronic device housing according to the second aspect, the plurality of plate members of the rectifying member are arranged in front of the electronic device.
By inclining toward the surface, the cool air introduced from the ventilation hole is guided toward the front surface of the electronic device by the plate-like body , and the cooling efficiency of the stored electronic device is further improved. .

【手続補正6】[Procedure amendment 6]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0014[Correction target item name] 0014

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0014】7は前記空調設備3から流出する冷気、8
は架台6の張出部6a上面に形成され前記空調設備3か
ら流出する一部の冷気7aを通過させる通気孔、9は該
通気孔8の配列方向に沿って該通気孔の一端部に設けら
れ前記冷気7aを一方向に整流する複数の整流板であ
る。なお、10は一定温度に管理されているコンピュー
タ室内の空気である。
7 is cold air flowing out of the air conditioner 3, 8
Are ventilation holes formed on the overhanging portion 6a of the gantry 6 to allow a part of the cool air 7a flowing out of the air conditioner 3 to pass therethrough, and 9 is provided at one end of the ventilation holes 8 along the arrangement direction of the ventilation holes 8 And a plurality of rectifying plates for rectifying the cool air 7a in one direction. Reference numeral 10 denotes air in a computer room managed at a constant temperature.

【手続補正7】[Procedure amendment 7]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0015[Correction target item name] 0015

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0015】次に、この筐体1の動作について説明す
る。空調設備3から流出する冷気7は筐体1の架台6を
下方から直接冷却すると同時に、その一部の冷気7aが
通気孔8を通過し、整流板9により筐体1の前面、即ち
電子機器5の露出した前面に向かう様に一方向に整流さ
れて該電子機器5を直接冷却する。この冷気7aのさら
に一部は、上昇してコンピュータ室内の空気10ととも
に電子機器4を冷却する。
Next, the operation of the housing 1 will be described. The cool air 7 flowing out of the air conditioner 3 directly cools the gantry 6 of the housing 1 from below, and at the same time, a part of the cool air 7a passes through the ventilation hole 8 and the rectifying plate 9 causes the front surface of the housing 1, that is, electronic equipment The electronic device 5 is cooled in one direction so as to be directed toward the exposed front surface of the electronic device 5 and directly cooled. A part of the cool air 7a rises to cool the electronic device 4 together with the air 10 in the computer room.

【手続補正8】[Procedure amendment 8]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0016[Correction target item name] 0016

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0016】この筐体1によれば、筐体1の架台6の張
出部6aに空調設備3から流出する冷気7を通過させる
通気孔8を形成し、該通気孔8の配列方向に沿って複数
整流板9を設けたので、筐体1に収納された電子機器
4、5を、空調設備3から流出する冷気7とコンピュー
タ室内の空気10とを用いて効果的に冷却することがで
きる。
According to the housing 1, the ventilation hole 8 for passing the cool air 7 flowing out of the air conditioner 3 is formed in the projecting portion 6 a of the gantry 6 of the housing 1, and the air hole 8 extends in the arrangement direction of the ventilation holes 8. Since the plurality of rectifying plates 9 are provided, the electronic devices 4 and 5 housed in the housing 1 can be effectively cooled using the cool air 7 flowing out of the air conditioner 3 and the air 10 in the computer room. it can.

【手続補正9】[Procedure amendment 9]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0018[Correction target item name] 0018

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0018】なお、本実施形態では、架台6の張出部6
aに形成した通気孔8の一端部に整流板9を設けた構成
としたが、通気孔8及び整流板9は、筐体1内の電子機
器4、5を冷却することのできるものであればよく、通
気孔8の位置や大きさ、数量、及び整流板9の形状や数
量は、電子機器4、5の大きさや位置、空調設備の位置
や大きさ等に合わせて適宜変更可能である。
In the present embodiment, the projecting portion 6
Although the rectifying plate 9 is provided at one end of the ventilation hole 8 formed in a, the ventilation hole 8 and the rectifying plate 9 can cool the electronic devices 4 and 5 in the housing 1. The position, size, and number of the ventilation holes 8 and the shape and number of the rectifying plates 9 can be appropriately changed according to the size and position of the electronic devices 4, 5 and the position and size of the air conditioning equipment. .

【手続補正10】[Procedure amendment 10]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0019[Correction target item name] 0019

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0019】[0019]

【発明の効果】以上説明した様に、本発明の請求項1記
載の電子機器収納用筐体の冷却構造によれば、筐体を、
空調設備が設けられた床の上に設け、該空調設備から流
出する冷気により前記筐体を下方から冷却するととも
に、前記筐体の下部に、前記空調設備から流出する冷気
の一部を導入して外部へ排出する通気孔を形成し、該通
気孔の近傍に、導入された冷気を前記電子機器の前面に
向かって誘導する整流部材を設けたので、前記筐体に収
納された電子機器を下方と前面の2方向から同時に冷却
することができ、筐体に収納されている電子機器を充分
に冷却することができる。しかも、構造が簡単であるか
ら、小型化、軽量化に即座に対応することができる。
As described above, according to the cooling structure for an electronic device housing of the first aspect of the present invention ,
Installed on the floor where air conditioning equipment is installed,
Cooling the casing from below with the cold air
In the lower part of the housing, cool air flowing out of the air conditioning equipment
Forming a ventilation hole for introducing a part of the air to the outside , and introducing the introduced cool air to the front of the electronic device in the vicinity of the ventilation hole.
It is provided with the rectifying member to induce headed, yield to the housing
Simultaneously cools electronic devices from two directions: from the bottom and front
The electronic device housed in the housing can be cooled sufficiently. Moreover, since the structure is simple, it is possible to immediately cope with reduction in size and weight.

【手続補正11】[Procedure amendment 11]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0020[Correction target item name] 0020

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0020】請求項2記載の電子機器収納用筐体の冷却
構造によれば、整流部材の複数の板状体を前記電子機器
の前面に向かって傾斜させたので、通気孔より導入され
た冷気を、前記板状体により前記電子機器の前面に向か
って誘導することができ、収納される電子機器の冷却効
率をさらに向上させることができる。
According to the cooling structure of the electronic device housing of the second aspect, the plurality of plate members of the rectifying member are connected to the electronic device.
, The cold air introduced through the ventilation holes can be guided toward the front surface of the electronic device by the plate-like body , further improving the cooling efficiency of the stored electronic device . be able to.

【手続補正12】[Procedure amendment 12]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】符号の説明[Correction target item name] Explanation of sign

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【符号の説明】 1 筐体 2 床面 3 空調設備 4、5 電子機器 6 架台(筐体の下部) 6a 張出部 7 冷気 7a 一部の冷気 8 通気孔 9 整流板 10 コンピュータ室内の空気[Description of Signs] 1 housing 2 floor surface 3 air conditioner 4, 5 electronic equipment 6 frame (lower part of housing) 6a overhang 7 cold air 7a some cold air 8 ventilation hole 9 rectifying plate 10 air in computer room

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 1つもしくは複数の電子機器を収納する
筐体の冷却構造であって、 前記筐体の下部に、外部から冷気を導入する通気孔を形
成し、該通気孔近傍に、導入された冷気を整流する整流
部材を設けたことを特徴とする電子機器収納用筐体の冷
却構造。
1. A cooling structure for a housing for accommodating one or a plurality of electronic devices, wherein a ventilation hole for introducing cool air from outside is formed in a lower portion of the housing, and a ventilation hole is provided near the ventilation hole. A cooling structure for a housing for electronic equipment storage, comprising a rectifying member for rectifying the cooled air.
【請求項2】 前記筐体は、空調設備が設けられた床の
上に設けられ、前記空調設備から流出する冷気を前記整
流部材により前記電子機器に向かって誘導することを特
徴とする請求項1記載の電子機器収納用筐体の冷却構
造。
2. The air conditioner according to claim 2, wherein the housing is provided on a floor provided with an air conditioner, and guides the cool air flowing out of the air conditioner toward the electronic device by the rectifying member. 2. The cooling structure for an electronic device housing according to claim 1.
JP9220480A 1997-08-15 1997-08-15 Cooling structure for electronic equipment housing Expired - Fee Related JP2910740B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9220480A JP2910740B2 (en) 1997-08-15 1997-08-15 Cooling structure for electronic equipment housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9220480A JP2910740B2 (en) 1997-08-15 1997-08-15 Cooling structure for electronic equipment housing

Publications (2)

Publication Number Publication Date
JPH1163547A true JPH1163547A (en) 1999-03-05
JP2910740B2 JP2910740B2 (en) 1999-06-23

Family

ID=16751759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9220480A Expired - Fee Related JP2910740B2 (en) 1997-08-15 1997-08-15 Cooling structure for electronic equipment housing

Country Status (1)

Country Link
JP (1) JP2910740B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112867367A (en) * 2021-02-24 2021-05-28 贵州民族大学 Cooling device for coal mine electromechanical equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112867367A (en) * 2021-02-24 2021-05-28 贵州民族大学 Cooling device for coal mine electromechanical equipment

Also Published As

Publication number Publication date
JP2910740B2 (en) 1999-06-23

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