JPH1142714A - Light molding apparatus - Google Patents
Light molding apparatusInfo
- Publication number
- JPH1142714A JPH1142714A JP9216974A JP21697497A JPH1142714A JP H1142714 A JPH1142714 A JP H1142714A JP 9216974 A JP9216974 A JP 9216974A JP 21697497 A JP21697497 A JP 21697497A JP H1142714 A JPH1142714 A JP H1142714A
- Authority
- JP
- Japan
- Prior art keywords
- light
- scanning
- pitch
- spot
- spots
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は光造形装置に関し、なか
でもパルス光の照射により硬化する液状物質の液面を選
択的にパルス光で照射することにより硬化物を造形する
光造形装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical shaping apparatus, and more particularly to an optical shaping apparatus for forming a cured product by selectively irradiating a liquid surface of a liquid material which is cured by irradiation with pulsed light with pulsed light. It is.
【０００２】[0002]
【従来の技術】近年、光、なかでも紫外線の照射により
硬化する液状物質である光造形用樹脂の液面を選択的に
紫外線のビームで走査して照射し、立体的な硬化物を造
形する光造形技術が高速立体成形技術として開発されて
いる。そして紫外線光源としてレーザが利用されてい
る。2. Description of the Related Art In recent years, a liquid surface of an optical molding resin, which is a liquid substance which is cured by irradiation of light, especially ultraviolet rays, is selectively scanned and irradiated with an ultraviolet beam to form a three-dimensional cured product. Stereolithography technology has been developed as a high-speed three-dimensional molding technology. A laser is used as an ultraviolet light source.
【０００３】従来の光造形装置は図５に示すようなもの
であった。光源１から放射した紫外線の光束Ｌ１はミラ
ー等で構成される光学系２により導かれ、変調器３、光
束調整器４、走査器５を経て光造形用樹脂６の液面７を
照射する。光源１にはアルゴンレーザが用いられてい
る。光造形用樹脂６は液槽８に収容され、造形中の硬化
物９は保持台１０に保持されている。保持台１０は昇降
器１１により昇降可能となっている。硬化物９の上面９
ａは昇降器１１により液面７より下がった位置に設定さ
れ、硬化物９の上面９ａと液面７との間に光造形用樹脂
６の薄層１２が形成される。液面７に光束Ｌ１が照射さ
れると照射された部分の下の薄層１２で固化が起こり、
硬化物９の上面９ａに新しい硬化部１３が形成される。
順次昇降器１１の降下により形成される薄層に硬化部が
形成されることにより、三次元的な硬化物が完成する。A conventional stereolithography apparatus is as shown in FIG. A light beam L1 of ultraviolet light emitted from the light source 1 is guided by an optical system 2 composed of a mirror or the like, and irradiates a liquid surface 7 of the optical molding resin 6 via a modulator 3, a light beam adjuster 4, and a scanner 5. The light source 1 uses an argon laser. The optical molding resin 6 is accommodated in a liquid tank 8, and the cured product 9 during molding is held on a holding table 10. The holding table 10 can be moved up and down by an elevator 11. Upper surface 9 of cured product 9
a is set at a position lower than the liquid level 7 by the elevator 11, and a thin layer 12 of the optical molding resin 6 is formed between the upper surface 9 a of the cured product 9 and the liquid level 7. When the light beam L1 is irradiated on the liquid surface 7, solidification occurs in the thin layer 12 below the irradiated portion,
A new cured portion 13 is formed on the upper surface 9a of the cured product 9.
The three-dimensional cured product is completed by forming the cured portion in the thin layer formed by the descending of the elevator 11 sequentially.
【０００４】この際の光造形用樹脂の硬化の状況は図６
及び図７に示すようなものであった。図６は光造形用樹
脂６の液面７より下に形成された薄層１２に光束Ｌ１が
照射され、光束Ｌ１が走査方向１４に走査されるとき、
硬化部１５が線状に形成されることを示す。図７は光束
Ｌ１が走査方向１４に走査され、順次同一方向の走査線
が移動したとき、線状に形成された硬化部１５が集合し
て面状の硬化部１６が形成されることを示す。硬化部１
５、１６は既に硬化した硬化物（不図示）の上面に形成
される。FIG. 6 shows the state of curing of the optical molding resin at this time.
And as shown in FIG. FIG. 6 shows that when the light beam L1 is irradiated on the thin layer 12 formed below the liquid level 7 of the optical molding resin 6 and the light beam L1 is scanned in the scanning direction 14,
This shows that the hardened portion 15 is formed in a linear shape. FIG. 7 shows that when the light beam L1 is scanned in the scanning direction 14 and the scanning lines in the same direction are sequentially moved, the cured portions 15 formed in a linear shape are aggregated to form a planar cured portion 16. . Curing part 1
5 and 16 are formed on the upper surface of a cured product (not shown) which has already been cured.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
光造形装置では、高精度が要求される物体の光造形を高
速度で行うことができないという問題があった。即ち、
高精度が要求されるとスポットの大きさを小さくしなく
てはならず、それに対応して走査速度が遅くなり、造形
に要する時間が長くなるという問題があった。However, the conventional stereolithography apparatus has a problem that stereolithography of an object requiring high precision cannot be performed at a high speed. That is,
When high precision is required, the size of the spot must be reduced, and accordingly, there is a problem that the scanning speed is correspondingly slow and the time required for modeling is long.
【０００６】本発明は上記の課題に鑑み、高精度で光造
形が行われ、且つ高速度造形による減価低減が可能な光
造形装置を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a stereolithography apparatus capable of performing stereolithography with high precision and capable of reducing the price reduction by high-speed modeling.
【０００７】[0007]
【課題を解決するための手段】本発明は、パルス光を連
続的に放射する光源と、前記パルス光の径及び焦点位置
を制御する光束制御手段と、前記パルス光を二次元に走
査する走査手段と、前記パルス光の走査を制御する走査
制御手段とを具備し、前記パルス光の照射により硬化す
る液状物質の液面を選択的に前記パルス光で照射するこ
とにより硬化物を造形する光造形装置において、前記光
束制御手段は前記パルス光が前記液状物質の液面に照射
されて形成する光のスポットの大きさを、前記液面の硬
化部の図形の周縁近傍部において小さく、前記液面の硬
化部の図形の周縁近傍部より内側の内側部において大き
くなるように制御し、前記走査制御手段は前記スポット
のピッチを、前記周縁近傍部において小さく、前記内側
部において大きくなるように走査手段を制御することを
特徴とする光造形装置構成した。According to the present invention, there is provided a light source for continuously emitting pulsed light, a light flux controlling means for controlling a diameter and a focal position of the pulsed light, and a scanning for scanning the pulsed light two-dimensionally. A light for forming a cured product by selectively irradiating a liquid surface of a liquid material to be cured by irradiation of the pulsed light with the pulsed light, comprising: In the shaping apparatus, the light flux controlling means may reduce a size of a spot of light formed by irradiating the liquid surface of the liquid material with the pulsed light in a vicinity of a periphery of a figure of a hardened portion of the liquid surface, The scanning control unit controls the spot pitch to be small in the vicinity of the periphery and large in the inside of the periphery of the figure of the figure of the hardened portion of the surface than the vicinity of the periphery of the figure. It was stereolithography apparatus configured characterized for controlling the scanning means so that.
【０００８】更に、前記光源の出力を制御する出力制御
手段を具備し、前記出力制御手段は前記光源の出力を、
前記周縁近傍部おいて小さく、前記内側部において大き
くなるように前記光源の出力を制御することを特徴とす
る請求項１に記載の光造形装置を望ましいものとして構
成した。Further, the apparatus further comprises output control means for controlling the output of the light source, wherein the output control means controls the output of the light source.
The stereolithography apparatus according to claim 1, wherein the output of the light source is controlled so as to be small near the periphery and large at the inside.
【００１０】[0010]
【作用】液面の硬化部の図形の周縁近傍部においては、
スポットの大きさは小さく、且つスポットのピッチは小
さくなる。液面の硬化部の図形の周縁近傍部より内側の
内側部においては、スポットの大きさは大きく、且つス
ポットのピッチは大きくなる。そして、請求項２に記載
の発明では、図形の周縁近傍部においては、光源の出力
は小さく、図形の内側部においては、光源の出力は大き
い。[Function] In the vicinity of the periphery of the figure of the hardened portion of the liquid surface,
The spot size is small and the spot pitch is small. The spot size is large and the pitch of the spots is large in an inner portion inside the vicinity of the periphery of the figure of the hardened portion of the liquid surface. According to the second aspect of the present invention, the output of the light source is small near the periphery of the figure, and the output of the light source is large near the inside of the figure.
【００１１】[0011]
【実施例】本発明の一実施例に係る光造形装置を図１〜
図４により説明する。図１は光造形装置の概念図、図２
はパルスの波形を示す図、図３及び図４はそれぞれ図形
とスポットの大きさとピッチとの関係を説明する説明図
である。光源１から放射した光束Ｌ１はミラー等で構成
される光学系２により導かれ、変調器３、光束調整器
４、走査器５を経て光造形用樹脂６の液面７を照射す
る。光源１はパルスレーザである。レーザ結晶にはＮ
ｄ：ＹＶＯ4 を使用している。Ｎｄ：ＹＶＯ4 の放射す
るレーザ光の波長は１０６４ｎｍであるので高調波変換
器を組み合わせて波長３５５ｎｍの高調波を使用する。
レーザ結晶にはＮｄ：ＹＡＧ、Ｎｄ：ＹＬＦを使用して
もよい。図２において縦軸に出力、横軸に時間を取る
と、レーザ光の波形は、パルス周波数２０ｋＨｚのと
き、パルス幅５〜１０ｎｓの山状のパルス１６がパルス
間隔５０μｓで連続したものとなっている。FIG. 1 is a perspective view of an optical shaping apparatus according to an embodiment of the present invention.
This will be described with reference to FIG. FIG. 1 is a conceptual diagram of an optical molding apparatus, and FIG.
Is a diagram showing a pulse waveform, and FIGS. 3 and 4 are explanatory diagrams for explaining the relationship between the figure, the spot size, and the pitch, respectively. A light beam L1 emitted from the light source 1 is guided by an optical system 2 composed of a mirror or the like, and irradiates a liquid surface 7 of the optical molding resin 6 via a modulator 3, a light beam adjuster 4, and a scanner 5. The light source 1 is a pulse laser. N for laser crystal
d: YVO 4 is used. Since the wavelength of the laser light emitted by Nd: YVO 4 is 1064 nm, a harmonic having a wavelength of 355 nm is used in combination with a harmonic converter.
Nd: YAG or Nd: YLF may be used for the laser crystal. In FIG. 2, when the output is plotted on the ordinate and the time is plotted on the abscissa, the waveform of the laser light is such that, at a pulse frequency of 20 kHz, a mountain-shaped pulse 16 having a pulse width of 5 to 10 ns is continuous at a pulse interval of 50 μs. I have.
【００１２】変調器３は光束Ｌ１を断続する超音波変調
器であり、変調制御部１８により光束Ｌ１の断続即ち遮
断及び通過が制御されている。光束調整器４は光束Ｌ１
の径及び焦点距離を調整するリニアトランスレータであ
り、光束制御部１９によりパルス光のスポットの直径は
制御されている。走査器５は光束Ｌ１を二次元に走査す
るガルバノメータミラーであり、走査制御部２０により
走査が制御されている。The modulator 3 is an ultrasonic modulator for intermittently switching the light beam L1. The modulation controller 18 controls the intermittent, ie, interception and passage of the light beam L1. The light flux adjuster 4 is a light flux L1
Is a linear translator that adjusts the diameter and the focal length of the pulse light, and the light flux controller 19 controls the diameter of the spot of the pulse light. The scanner 5 is a galvanometer mirror that scans the light beam L1 two-dimensionally, and the scanning is controlled by the scanning control unit 20.
【００１３】光造形用樹脂６にはウレタンアクリレート
系樹脂を使用している。光造形用樹脂６は液槽８に収容
され、造形中の硬化物９は保持台１０に保持されてい
る。保持台１０は昇降器１１により昇降可能となってい
る。硬化物９の上面９ａは昇降器１１により液面７より
下がった位置に設定され、硬化物９の上面９ａと液面７
との間に光造形用樹脂６の薄層１２が形成される。液面
７に光束Ｌ１が照射されると照射された部分の下の薄層
１２で固化が起こり、硬化物９の上面９ａに新しい硬化
部１３が形成される。個々の硬化部１３の平面形状は光
束Ｌ１の液面７におけるスポット（不図示）の略円形に
近似し、深さは薄層１２を通して硬化物９の上面９ａに
到達する大きさである。硬化部１３が集合し硬化物９の
上面９ａに二次元的な硬化部が形成されると、照順次昇
降器１１は降下し、順次薄層状の二次元的な硬化部が積
層して形成されることにより、三次元的な硬化物が完成
する。As the stereolithography resin 6, a urethane acrylate resin is used. The optical molding resin 6 is accommodated in a liquid tank 8, and the cured product 9 during molding is held on a holding table 10. The holding table 10 can be moved up and down by an elevator 11. The upper surface 9a of the cured product 9 is set at a position lower than the liquid level 7 by the elevator 11, and the upper surface 9a of the cured product 9 and the liquid surface 7
A thin layer 12 of the optical molding resin 6 is formed between the two. When the liquid surface 7 is irradiated with the light beam L <b> 1, solidification occurs in the thin layer 12 below the irradiated portion, and a new cured portion 13 is formed on the upper surface 9 a of the cured product 9. The planar shape of each of the cured portions 13 approximates a substantially circular spot (not shown) on the liquid surface 7 of the light beam L <b> 1, and has a depth that reaches the upper surface 9 a of the cured product 9 through the thin layer 12. When the hardened portions 13 are gathered to form a two-dimensional hardened portion on the upper surface 9a of the hardened material 9, the elevator 11 descends and the thin two-dimensional hardened portions are sequentially stacked and formed. Thereby, a three-dimensional cured product is completed.
【００１４】先ず、本実施例で光造形が予定される物体
の各薄層の形状について説明する。物体がＣＡＤ等によ
り設計されると、先ず光造形時に予定される水平方向に
物体を多数の所定厚の薄層に輪切りにした形状が得られ
る。この各薄層の形状を基本にして、光造形が容易に実
行できるように、例えば支持部を設置する等その他の改
変を行い、全体としての物体の光造形用プログラムが作
成される。照射作業が行われる薄層の形状を以下図形と
称して説明する。First, a description will be given of the shape of each thin layer of an object to be optically molded in this embodiment. When an object is designed by CAD or the like, a shape in which the object is first sliced into a plurality of thin layers having a predetermined thickness in a horizontal direction expected at the time of stereolithography is obtained. On the basis of the shape of each thin layer, other modifications such as installation of a support portion are performed so that stereolithography can be easily performed, and a stereolithography program of the object as a whole is created. The shape of the thin layer on which the irradiation operation is performed will be described below with reference to a figure.
【００１５】パルスレーザが液面７を照射するとき液面
７上に形成される光束Ｌ１のスポットは円で略近似する
ことができる。When the pulse laser irradiates the liquid surface 7, the spot of the light beam L1 formed on the liquid surface 7 can be approximately approximated by a circle.
【００１６】照射作業の動作は次ようである。先ず、第
１の走査線では、光束制御部１９は光束調整器４を光束
Ｌ１のスポットの直径がＤ１になるように制御する。走
査制御部２０は走査器５をスポットのピッチがＰ１、及
び走査線間隔がＣ１になるように制御する。走査器５の
指向する向きが図形２１から外れている間は、変調器３
は光束Ｌ１を遮断し、光束Ｌ１は液面７上に到達しな
い。走査器５の指向する向きが図形２１に入ると、変調
器３は光束Ｌ１を通過させ、光束Ｌ１は液面７上に到達
する。この時スポットの直径はＤ１、ピッチはＰ１であ
り、あらかじめ設定したスポット数１で照射が行われ
る。この１個のスポットでの照射が終了すると光束制御
部１９によりスポットは直径がＤ２、走査制御部２０に
よりピッチがＰ２にそれぞれ変更され、走査が進み照射
が行われる。本実施例ではＤ２及びＰ２はそれぞれ、Ｄ
２＝Ｄ１×２、Ｐ２＝Ｐ１×２となるように設定され
る。走査が進み、走査器５の指向する向きが図形２１か
ら外れると、再びスポットは直径がＤ１、ピッチがＰ１
に変更され、あらかじめ設定したスポット数１で照射が
行われ、この１個のスポットでの照射が終了すると変調
器３は光束Ｌ１を遮断する。The operation of the irradiation operation is as follows. First, in the first scanning line, the light beam controller 19 controls the light beam adjuster 4 so that the spot diameter of the light beam L1 becomes D1. The scanning control unit 20 controls the scanner 5 so that the spot pitch is P1 and the scanning line interval is C1. While the direction in which the scanner 5 is directed deviates from the graphic 21, the modulator 3
Blocks the light beam L1, and the light beam L1 does not reach the liquid surface 7. When the direction in which the scanner 5 is directed enters the figure 21, the modulator 3 allows the light beam L1 to pass, and the light beam L1 reaches the liquid surface 7. At this time, the spot diameter is D1 and the pitch is P1, and irradiation is performed with a preset number of spots of one. When the irradiation with one spot is completed, the diameter of the spot is changed to D2 by the light beam control unit 19, and the pitch is changed to P2 by the scanning control unit 20, and scanning proceeds and irradiation is performed. In this embodiment, D2 and P2 are D
It is set so that 2 = D1 × 2 and P2 = P1 × 2. When the scanning progresses and the direction of the scanner 5 deviates from the graphic 21, the spot has a diameter D1 and a pitch P1 again.
And the irradiation is performed with a preset number of spots, and when the irradiation with this one spot is completed, the modulator 3 blocks the light beam L1.
【００１７】第１の走査線の走査が終了すると第２の走
査線の走査が開始する。走査線間隔Ｃ１はピッチＰ１に
等しく設定されている。隣接する第２の走査線における
照射作業の動作は次ようである。先ずスポットの直径が
Ｄ１、スポットのピッチがＰ１になるようにそれぞれ制
御され、走査器５の指向する向きが図形２１から外れて
いる間は、変調器３は光束Ｌ１を遮断し、光束Ｌ１は液
面７上に到達しない。走査器５の指向する向きが図形２
１に入ると、変調器３は光束Ｌ１を通過させ、光束Ｌ１
は液面７上に到達する。スポットは直径がＤ１、ピッチ
がＰ１であり、あらかじめ設定したスポット数１で照射
が行われる。この１個のスポットでの照射が終了すると
変調器３は光束Ｌ１を遮断する。走査器５の指向する向
きが図形２１から外れると、変調器３は光束Ｌ１を通過
させ、スポットは直径がＤ１、ピッチがＰ１で、あらか
じめ設定したスポット数１で照射が行われ、この１個の
スポットでの照射が終了すると変調器３は光束Ｌ１を遮
断する。When the scanning of the first scanning line is completed, the scanning of the second scanning line starts. The scanning line interval C1 is set equal to the pitch P1. The operation of the irradiation operation on the adjacent second scanning line is as follows. First, the spot diameter is controlled to be D1, and the spot pitch is controlled to be P1. While the direction in which the scanner 5 is directed is out of the figure 21, the modulator 3 blocks the light beam L1, and the light beam L1 It does not reach the liquid level 7. The orientation of the scanner 5 is figure 2
1, the modulator 3 allows the light beam L1 to pass therethrough,
Reaches the liquid level 7. The spots have a diameter of D1 and a pitch of P1, and irradiation is performed with a preset number of spots of one. When the irradiation with this one spot is completed, the modulator 3 blocks the light beam L1. When the direction of the scanner 5 deviates from the figure 21, the modulator 3 allows the light beam L1 to pass, and the spots are radiated with the diameter D1, the pitch P1, and the preset number of spots 1. When the irradiation at the spot is completed, the modulator 3 blocks the light beam L1.
【００１８】次に隣接する第３の走査線については最初
に述べた第１の走査線における動作と同様な動作が行わ
れる。このように同一方向の走査線の２本に１本の割合
で、直径がＤ２、ピッチがＰ２の走査が行われる。残り
の１本の走査線では直径がＤ２、ピッチがＰ２の照射は
行われない。The operation similar to the operation in the first scanning line described above is performed on the next adjacent third scanning line. In this manner, scanning is performed with a diameter of D2 and a pitch of P2 at a rate of one out of two scanning lines in the same direction. In the remaining one scanning line, irradiation with a diameter of D2 and a pitch of P2 is not performed.
【００１９】本実施例においては、スポットの直径Ｄ２
とＤ１の比率と、ピッチＰ２とＰ１の比率は２、又直径
がＤ２、ピッチがＰ２の走査が行われる走査線の割合は
２であるが他の比率とすることもできるのはいうまでも
ない。一般には、スポットの直径Ｄ２とＤ１の比率と、
ピッチＰ２とＰ１の比率は等しく、これは直径がＤ２、
ピッチがＰ２の走査が行われる走査線の割合に等しい
が、必ずしもそうでなくてもよい。又直径がＤ１、ピッ
チがＰ１のスポットの数は１以外の数を設定することが
できる。外面を強固に光造形したいときは２以上の数に
することができる。又図形２１の周縁線が走査方向との
なす角が小さいときは、走査方向のみならず走査方向と
垂直方向にも所定の数のスポットによる照射が行えるよ
うにプログラムを組むようにする。走査線間隔Ｃ１はピ
ッチＰ１に等しく設定されているが、必ずしもピッチＰ
１に等しくなくてもよいし、等間隔でなくてもよい。In this embodiment, the spot diameter D2
And the ratio of D1 and the ratio of the pitches P2 and P1 is 2, and the ratio of the scanning lines on which the scanning with the diameter D2 and the pitch P2 is performed is 2, but it is needless to say that other ratios can be used. Absent. Generally, the ratio of the spot diameters D2 and D1;
The ratio of pitches P2 and P1 is equal, which means that the diameter is D2,
Although the pitch is equal to the ratio of the scanning lines on which the scanning of P2 is performed, it is not always necessary. The number of spots having a diameter of D1 and a pitch of P1 can be set to a number other than one. If the outer surface is to be solidly shaped, the number can be two or more. When the angle between the peripheral line of the figure 21 and the scanning direction is small, a program is designed so that irradiation with a predetermined number of spots can be performed not only in the scanning direction but also in the scanning direction and the vertical direction. The scanning line interval C1 is set to be equal to the pitch P1.
It does not need to be equal to 1 and may not be at equal intervals.
【００２０】第２の実施例は、直径がＤ２、ピッチがＰ
２の走査が行われる際、パルス光の強度が変更される点
が前述した一実施例と異なる他は同一であるから説明の
詳述は省略する。第１の走査線における照射作業の動作
は次ようである。先ず、光束制御部１９は光束調整器４
を光束Ｌ１のスポットの直径がＤ１になるように制御す
る。走査制御部２０は走査器５をスポットのピッチがＰ
１、及び走査線間隔がＣ１になるように制御する。出力
制御部１７は光源１を出力Ｆ１になるように制御する。
走査器５の指向する向きが図形２１から外れている間
は、変調器３は光束Ｌ１を遮断し、光束Ｌ１は液面７上
に到達しない。走査器５の指向する向きが図形２１に入
ると、変調器３は光束Ｌ１を通過させ、光束Ｌ１は液面
７上に到達する。この時光源１の出力Ｆ１でスポットの
直径はＤ１、ピッチはＰ１であり、あらかじめ設定した
スポット数１で照射が行われる。この１個のスポットで
の照射が終了すると光束制御部１９によりスポットは直
径がＤ２、走査制御部２０によりピッチがＰ２、出力制
御部１７により光源１の出力は出力Ｆ２にそれぞれ変更
され、走査が進み照射が行われる。本実施例ではＤ２、
Ｐ２及びＦ２はそれぞれ、Ｄ２＝Ｄ１×２、Ｐ２＝Ｐ１
×２及びＦ２＝Ｆ１×２に設定されている。走査が進
み、走査器５の指向する向きが図形２１から外れると、
再びスポットは直径がＤ１、ピッチがＰ１、出力はＦ１
に変更され、あらかじめ設定したスポット数１で照射が
行われ、この１個のスポットでの照射が終了すると変調
器３は光束Ｌ１を遮断する。第１の走査線の走査が終了
すると、第２の走査線の走査が開始する。走査線間隔は
Ｃ１に設定されている。In the second embodiment, the diameter is D2 and the pitch is P
When the second scan is performed, the point is that the intensity of the pulse light is changed, except that it is different from the above-described embodiment. The operation of the irradiation operation on the first scanning line is as follows. First, the luminous flux controller 19 controls the luminous flux adjuster 4.
Is controlled such that the diameter of the spot of the light beam L1 becomes D1. The scanning control unit 20 controls the scanner 5 so that the spot pitch is P
1 and the scanning line interval is controlled to be C1. The output control unit 17 controls the light source 1 so as to have the output F1.
While the direction in which the scanner 5 is directed is out of the figure 21, the modulator 3 blocks the light beam L1, and the light beam L1 does not reach the liquid surface 7. When the direction in which the scanner 5 is directed enters the figure 21, the modulator 3 allows the light beam L1 to pass, and the light beam L1 reaches the liquid surface 7. At this time, at the output F1 of the light source 1, the diameter of the spot is D1, the pitch is P1, and irradiation is performed with a preset number of spots. When the irradiation with this one spot is completed, the diameter of the spot is changed to D2 by the light flux control unit 19, the pitch is changed to P2 by the scanning control unit 20, and the output of the light source 1 is changed to the output F2 by the output control unit 17. Advance irradiation is performed. In this embodiment, D2,
P2 and F2 are respectively D2 = D1 × 2, P2 = P1
× 2 and F2 = F1 × 2. When the scanning proceeds and the direction of the scanner 5 deviates from the graphic 21,
Again, the spot has a diameter of D1, a pitch of P1, and an output of F1
And the irradiation is performed with a preset number of spots, and when the irradiation with this one spot is completed, the modulator 3 blocks the light beam L1. When the scanning of the first scanning line ends, the scanning of the second scanning line starts. The scanning line interval is set to C1.
【００２１】次に隣接する第２の走査線における照射作
業の動作は次ようである。先ずスポットの直径がＤ１、
スポットのピッチがＰ１、光源１の出力がＦ１になるよ
になるようにそれぞれ制御され、走査器５の指向する向
きが図形２１から外れている間は、変調器３は光束Ｌ１
を遮断し、光束Ｌ１は液面７上に到達しない。走査器５
の指向する向きが図形２１に入ると、変調器３は光束Ｌ
１を通過させ、光束Ｌ１は液面７上に到達する。スポッ
トは直径がＤ１、ピッチがＰ１、出力がＦ１であり、あ
らかじめ設定したスポット数１で照射が行われる。この
１個のスポットでの照射が終了すると変調器３は光束Ｌ
１を遮断する。走査器５の指向する向きが図形２１から
外れると、変調器３は光束Ｌ１を通過させ、スポットは
直径がＤ１、ピッチがＰ１、出力がＦ１で、あらかじめ
設定したスポット数１で照射が行われ、この１個のスポ
ットでの照射が終了すると変調器３は光束Ｌ１を遮断す
る。The operation of the irradiation operation on the next adjacent second scanning line is as follows. First, the spot diameter is D1,
The modulator is controlled so that the pitch of the spot is P1 and the output of the light source 1 is F1.
And the light beam L1 does not reach the liquid surface 7. Scanner 5
When the direction in which the light is directed enters FIG.
1 and the light beam L 1 reaches the liquid surface 7. The spot has a diameter of D1, a pitch of P1, and an output of F1, and is irradiated with a preset number of spots of one. When the irradiation with this one spot is completed, the modulator 3 outputs the light flux L
Block 1 When the direction of the scanner 5 deviates from the figure 21, the modulator 3 allows the light beam L1 to pass, and the spots are radiated with the diameter D1, the pitch P1, the output F1, and the number of spots 1 set in advance. When the irradiation with this one spot is completed, the modulator 3 blocks the light beam L1.
【００２２】次に隣接する第３の走査線においては第１
の走査線における動作と同一の動作が行われる。このよ
うに同一方向の走査線の２本に１本の割合で、直径がＤ
２、ピッチがＰ２、出力がＦ２での走査が進み照射が行
われる。残りの１本の走査線では直径がＤ２、ピッチが
Ｐ２、出力がＦ２での照射は行われない。In the next adjacent third scanning line, the first
The same operation as the operation in the scanning line is performed. As described above, the ratio of the scanning line in the same direction to the ratio of one to two is
2. The scanning with the pitch P2 and the output F2 proceeds, and irradiation is performed. Irradiation with a diameter of D2, a pitch of P2, and an output of F2 is not performed in the remaining one scanning line.
【００２３】本実施例においては、スポットの直径、ピ
ッチ、スポットの数に関しては前述の一実施例と同様で
あり説明を省略する。光源１の出力については、第１の
走査線において直径Ｄ２のスポットの面積は直径Ｄ１の
スポットの面積の４倍あり、単位面積当たりに照射され
る光エネルギーの大きさは直径Ｄ２のスポットでは直径
Ｄ１のスポットの４分の１となるが、光エネルギーの大
きさと光造形用樹脂の硬化の度合いとは直線的な関係に
はなく、経験的に最適の割合が求められる。又歪みの発
生の回避、造形時間の短縮等との関連し、本実施例では
Ｆ２はＦ１の２倍の大きさが適当である。In this embodiment, the spot diameter, pitch, and number of spots are the same as those in the above-described embodiment, and a description thereof will be omitted. Regarding the output of the light source 1, the area of the spot having the diameter D2 in the first scanning line is four times the area of the spot having the diameter D1, and the magnitude of light energy irradiated per unit area is the diameter of the spot having the diameter D2. Although it is a quarter of the spot of D1, the magnitude of the light energy and the degree of curing of the stereolithography resin do not have a linear relationship, and an optimum ratio is empirically obtained. In the present embodiment, F2 is suitably twice as large as F1 in relation to avoiding generation of distortion, shortening of molding time, and the like.
【００２４】なお各実施例においては、パルス光源とし
てパルスレーザを使用したが、硬化作用を有する断続光
を放射する光源であれば他の光源であっても良いことは
言うまでもなく、例えばアルゴンレーザの連続ビームを
断続して使用することを妨げるものではない。In each of the embodiments, a pulse laser is used as a pulse light source. However, it is needless to say that another light source may be used as long as it emits intermittent light having a curing effect. It does not prevent intermittent use of continuous beams.
【００２５】[0025]
【発明の効果】液面の硬化部の図形の周縁近傍部におい
ては、スポットの大きさは小さく、且つピッチは小さく
することができるから、且つ、図形の周縁近傍部より内
側の内側部においては、スポットの大きさは大きく、且
つピッチは大きくすることができるから、物体は高精度
で光造形が行われ、且つ高速度造形による減価低減が可
能となる。そして、図形の周縁近傍部においては光源の
出力は小さく、図形の内側部においては光源の出力は大
きくできるから、高精度、高速度で且つ強度の大きい物
体の光造形が可能となる。The spot size and the pitch can be reduced in the vicinity of the periphery of the figure in the hardened portion of the liquid surface, and in the inner part inside the vicinity of the periphery of the figure. Since the size of the spot and the pitch can be increased, the object can be optically molded with high precision, and the depreciation can be reduced by high-speed molding. Since the output of the light source can be small near the periphery of the graphic and the output of the light source can be large inside the graphic, it is possible to perform stereolithography of a high-precision, high-speed and high-intensity object.
【図１】本発明の一実施例に係る光造形装置の概念図で
ある。FIG. 1 is a conceptual diagram of an optical shaping apparatus according to one embodiment of the present invention.
【図２】本発明の一実施例に係る光造形装置の光源のパ
ルスの波形を示す図である。FIG. 2 is a diagram showing a pulse waveform of a light source of the optical shaping apparatus according to one embodiment of the present invention.
【図３】本発明の一実施例に係る図形とスポットの大き
さとピッチとの関係を説明する説明図である。FIG. 3 is an explanatory diagram illustrating a relationship between a figure, a spot size, and a pitch according to an embodiment of the present invention.
【図４】本発明の一実施例に係る図形とスポットの大き
さとピッチとの関係を説明する説明図である。FIG. 4 is an explanatory diagram illustrating a relationship between a figure, a spot size, and a pitch according to an embodiment of the present invention.
【図５】従来の光造形装置の概略図である。FIG. 5 is a schematic view of a conventional stereolithography apparatus.
【図６】従来の光造形装置における光造形用樹脂の硬化
の状況を説明する図である。FIG. 6 is a view for explaining a state of curing of an optical molding resin in a conventional optical molding apparatus.
【図７】従来の光造形装置における光造形用樹脂の硬化
の状況を説明する図である。FIG. 7 is a view for explaining the state of curing of an optical molding resin in a conventional optical molding apparatus.
１・・・光源、Ｌ１・・・光束、５・・・走査器、６・
・・光造形用樹脂、７・・・液面、９・・・硬化物、１
０・・・保持台、１３・・・硬化部、１７・・・出力制
御部、１８・・・変調制御部、１９・・・光束制御部、
２０・・・走査制御部、Ｓ１、Ｓ２・・・スポット1 ... light source, L1 ... light flux, 5 ... scanner, 6 ...
..Stereolithography resin, 7 ... liquid level, 9 ... cured product, 1
0: holding table, 13: curing unit, 17: output control unit, 18: modulation control unit, 19: light flux control unit,
20: scanning control unit, S1, S2: spot
Claims (2)
パルス光の径及び焦点位置を制御する光束制御手段と、
前記パルス光を二次元に走査する走査手段と、前記パル
ス光の走査を制御する走査制御手段とを具備し、前記パ
ルス光の照射により硬化する液状物質の液面を選択的に
前記パルス光で照射することにより硬化物を造形する光
造形装置において、前記光束制御手段は前記パルス光が
前記液状物質の液面に照射されて形成する光のスポット
の大きさを、前記液面の硬化部の図形の周縁近傍部にお
いて小さく、前記液面の硬化部の図形の周縁近傍部より
内側の内側部において大きくなるように制御し、前記走
査制御手段は前記スポットのピッチを、前記周縁近傍部
において小さく、前記内側部において大きくなるように
走査手段を制御することを特徴とする光造形装置。A light source for continuously emitting pulsed light; a light flux controlling means for controlling a diameter and a focal position of the pulsed light;
Scanning means for scanning the pulsed light two-dimensionally, and scanning control means for controlling the scanning of the pulsed light, the liquid surface of the liquid material that is cured by the irradiation of the pulsed light is selectively applied with the pulsed light. In an optical shaping apparatus for shaping a cured product by irradiating, the light flux controlling means adjusts the size of a spot of light formed by irradiating the liquid surface of the liquid material with the pulsed light, It is small in the vicinity of the periphery of the figure, and is controlled so as to be larger in the inner part than the vicinity of the periphery of the figure of the hardened portion of the liquid surface, and the scanning control means reduces the pitch of the spot in the vicinity of the periphery. A stereolithography apparatus for controlling a scanning means so as to increase the size of the inside portion.
具備し、前記出力制御手段は前記光源の出力を、前記周
縁近傍部おいて小さく、前記内側部において大きくなる
ように前記光源の出力を制御することを特徴とする請求
項１に記載の光造形装置。2. An output control means for controlling an output of the light source, wherein the output control means reduces an output of the light source such that the output of the light source is small near the periphery and large at the inside. The stereolithography apparatus according to claim 1, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9216974A JPH1142714A (en) | 1997-07-29 | 1997-07-29 | Light molding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9216974A JPH1142714A (en) | 1997-07-29 | 1997-07-29 | Light molding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1142714A true JPH1142714A (en) | 1999-02-16 |
Family
ID=16696845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9216974A Pending JPH1142714A (en) | 1997-07-29 | 1997-07-29 | Light molding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1142714A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003016031A1 (en) * | 2001-08-16 | 2003-02-27 | Riken | Rapid prototyping method and device using v-cad data |
| JP2004506097A (en) * | 2000-06-07 | 2004-02-26 | ［ベーウー：エステー］ ゲーエムベーハー ベラートゥングスウンターネーメン フルア ジステーメ ウント テヒノロギーエン | Method and apparatus for manufacturing precision shaped workpieces |
| JP2009132124A (en) * | 2007-12-03 | 2009-06-18 | Sony Corp | Optical shaping apparatus and optical shaping method |
| CN109532005A (en) * | 2018-11-20 | 2019-03-29 | 广州捷和电子科技有限公司 | A kind of adaptive hot spot Method of printing of 3D photocuring dynamic focusing |
| KR20190041133A (en) * | 2017-10-12 | 2019-04-22 | 한국기계연구원 | Method for manufacturing three dimensional shapes using laser and powder |
| CN109878075A (en) * | 2019-03-15 | 2019-06-14 | 华中科技大学 | Using the method for continuous variable beam spot scans processing in a kind of 3D printing |
| US10596800B2 (en) | 2016-03-07 | 2020-03-24 | Seiko Epson Corporation | Three-dimensional shaped article production method, three-dimensional shaped article production apparatus, and three-dimensional shaped article |
| US10611137B2 (en) | 2016-03-07 | 2020-04-07 | Seiko Epson Corporation | Three-dimensional shaped article production method, three-dimensional shaped article production apparatus, and three-dimensional shaped article |
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-
1997
- 1997-07-29 JP JP9216974A patent/JPH1142714A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004506097A (en) * | 2000-06-07 | 2004-02-26 | ［ベーウー：エステー］ ゲーエムベーハー ベラートゥングスウンターネーメン フルア ジステーメ ウント テヒノロギーエン | Method and apparatus for manufacturing precision shaped workpieces |
| WO2003016031A1 (en) * | 2001-08-16 | 2003-02-27 | Riken | Rapid prototyping method and device using v-cad data |
| JP2009132124A (en) * | 2007-12-03 | 2009-06-18 | Sony Corp | Optical shaping apparatus and optical shaping method |
| US10926526B2 (en) | 2015-11-12 | 2021-02-23 | Seiko Epson Corporation | Method of manufacturing three-dimensionally formed object |
| US10596800B2 (en) | 2016-03-07 | 2020-03-24 | Seiko Epson Corporation | Three-dimensional shaped article production method, three-dimensional shaped article production apparatus, and three-dimensional shaped article |
| US10611137B2 (en) | 2016-03-07 | 2020-04-07 | Seiko Epson Corporation | Three-dimensional shaped article production method, three-dimensional shaped article production apparatus, and three-dimensional shaped article |
| KR20190041133A (en) * | 2017-10-12 | 2019-04-22 | 한국기계연구원 | Method for manufacturing three dimensional shapes using laser and powder |
| CN109532005A (en) * | 2018-11-20 | 2019-03-29 | 广州捷和电子科技有限公司 | A kind of adaptive hot spot Method of printing of 3D photocuring dynamic focusing |
| CN109532005B (en) * | 2018-11-20 | 2021-08-10 | 广州捷和电子科技有限公司 | 3D photocuring dynamic focusing self-adaptive light spot printing method |
| CN109878075A (en) * | 2019-03-15 | 2019-06-14 | 华中科技大学 | Using the method for continuous variable beam spot scans processing in a kind of 3D printing |
| WO2021025307A1 (en) * | 2019-08-02 | 2021-02-11 | 한국과학기술원 | 3d printer having microhole processing function, and method for processing microhole by using same |
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