JPH11348046A - Mold for molding synthetic resin - Google Patents
Mold for molding synthetic resinInfo
- Publication number
- JPH11348046A JPH11348046A JP16513898A JP16513898A JPH11348046A JP H11348046 A JPH11348046 A JP H11348046A JP 16513898 A JP16513898 A JP 16513898A JP 16513898 A JP16513898 A JP 16513898A JP H11348046 A JPH11348046 A JP H11348046A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- synthetic resin
- mold body
- molding surface
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は合成樹脂成形用金
型、特に合成樹脂材料に形を付与する成形面に、その材
料に転写されることのない大きさを持つ複数の微小孔を
開口させたものの改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a synthetic resin molding die, and more particularly, to a method for forming a plurality of fine holes having a size which is not transferred to a synthetic resin material. Related to the improvement of
【０００２】[0002]
【従来の技術】この種の金型は、前記微小孔を真空孔と
して使用する真空成形法や前記微小孔を空気排出孔とし
て使用する射出成形法に適用される。2. Description of the Related Art This type of mold is applied to a vacuum molding method using the micro holes as vacuum holes and an injection molding method using the micro holes as air discharge holes.
【０００３】本出願人は、先に、成形面構成体として、
複数の微小孔を有する電鋳殻を用いる金型を開発した
（特公平１−５１５５４号公報参照）。[0003] The applicant of the present invention has previously described, as a molded surface structure,
A mold using an electroformed shell having a plurality of minute holes has been developed (see Japanese Patent Publication No. 1-55554).
【０００４】[0004]
【発明が解決しようとする課題】しかしながら前記電鋳
殻は耐圧性が低いため金型の短命化を招き易く、また電
鋳殻の製造に多くの時間を要するためリードタイムが長
くなり、金型の生産コストが高騰する、という問題があ
った。However, the electroformed shell has a low pressure resistance, which tends to shorten the life of the mold, and the production of the electroformed shell requires a lot of time, so that the lead time becomes longer and the mold becomes longer. However, there was a problem that the production cost of the product increased.
【０００５】[0005]
【課題を解決するための手段】本発明は、前記のような
耐圧性に関連した金型の短命化といった問題を回避する
と共にリードタイムを短縮して生産コストを低減し得る
前記金型を提供することを目的とする。SUMMARY OF THE INVENTION The present invention is to provide a mold capable of avoiding the above-described problem of shortening the life of the mold associated with the pressure resistance, shortening the lead time and reducing the production cost. The purpose is to do.
【０００６】前記目的を達成するため本発明によれば、
合成樹脂材料に形を付与する成形面に、その材料に転写
されることのない大きさを持つ複数の微小孔を開口させ
た合成樹脂成形用金型において、複数の通気孔を有する
型本体と、その型本体への溶射処理を経て形成され、且
つ複数の前記通気孔に連通する複数の前記微小孔を有す
る成形面構成体とを備えている合成樹脂成形用金型が提
供される。[0006] In order to achieve the above object, according to the present invention,
In a synthetic resin molding die having a plurality of micro holes having a size that is not transferred to the molding surface that imparts a shape to the synthetic resin material, a mold body having a plurality of air holes is provided. And a molding surface structure having a plurality of micro holes formed through a thermal spraying process on the mold body and communicating with the plurality of air holes.
【０００７】前記のように構成すると、成形面構成体は
高い耐圧性を有するので、耐圧性に関連した金型の短命
化といった問題は回避される。また前記成形面構成体の
形成に要する時間は、前記電鋳殻の形成に要する時間よ
りも大幅に短く、これによりリードタイムを短縮して金
型の生産コストを低減することが可能である。With the above-described structure, the molded surface structure has a high pressure resistance, so that the problem of shortening the life of the mold related to the pressure resistance can be avoided. Also, the time required to form the molding surface structure is significantly shorter than the time required to form the electroformed shell, thereby shortening the lead time and reducing the production cost of the mold.
【０００８】[0008]
【発明の実施の形態】図１，２，７において、合成樹脂
成形用金型としての、固定金型１およびその固定金型１
に対して進退自在の可動金型２は自動車用合成樹脂製バ
ンパの射出成形に用いられる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIGS. 1, 2 and 7, a stationary die 1 and a stationary die 1 as a synthetic resin molding die are shown.
The movable mold 2 which can move forward and backward is used for injection molding of a synthetic resin bumper for automobiles.
【０００９】図１〜６に明示するように、固定金型１の
合せ面３は、相対向する位置に在って、可動金型２の進
退方向ａと交差関係にある一対の平坦面４と、両平坦面
４に両端をそれぞれ連結した帯状をなす凹形面５とより
なる。合せ面３に、一方の平坦面４から凹形面５を経て
他方の平坦面４に至るチャンネル６がＵ字形に折曲げ形
成され、そのチャンネル６の横断面凹形をなす内面は、
合成樹脂材料に形を付与する凹形成形面７として機能す
る。固定金型１に、成形面７の底部に開口するようにゲ
ート８が形成される。各平坦面４の外側に位置決め凸条
９が形成され、また各位置決め凸条９外側の平坦面１０
に、位置決めピン孔１１が開口する。As clearly shown in FIGS. 1 to 6, the mating surfaces 3 of the fixed mold 1 are located at opposing positions and have a pair of flat surfaces 4 intersecting with the advance / retreat direction a of the movable mold 2. And a concave surface 5 in the form of a strip having both ends connected to both flat surfaces 4. A channel 6 extending from one flat surface 4 to the other flat surface 4 via the concave surface 5 is bent into a U-shape on the mating surface 3, and the inner surface of the channel 6 forming a concave cross section is
It functions as a concave forming surface 7 that gives a shape to the synthetic resin material. A gate 8 is formed in the fixed mold 1 so as to open at the bottom of the molding surface 7. A positioning ridge 9 is formed outside each flat surface 4, and a flat surface 10 outside each positioning ridge 9 is formed.
Then, a positioning pin hole 11 is opened.
【００１０】図１，２，７に明示するように可動金型２
の合せ面１２は、固定金型１における両位置決め凸条９
内側の両平坦面４に合致する一対の平坦面１３1 と、両
平坦面１３1 に両端をそれぞれ連結され、且つ固定金型
１の凹形面５に合致する帯状をなす凸形面１４とよりな
る。凸形面１４に、一方の平坦面１３1 側から他方の平
坦面１３1 側に至る凸条１５がＵ字形に折曲げ形成さ
れ、その凸条１５の両端面１５ａと両平坦面１３1 との
間には所定の間隔が設けられている。その凸条１５の表
面および凸形面１４における凸条１５のふもと部分は、
固定金型１の凹形成形面７に対応する凸形成形面１６を
形成する。各平坦面１３1 の外側に、固定金型１の位置
決め凸条９に合致する位置決め凹条１７が形成され、ま
た各位置決め凹条１７の外側の平坦面１３2 からは、固
定金型１の各位置決めピン孔９に合致する位置決めピン
１８が突出している。両位置決め凹条１７内側の両平坦
面１３1 は、型本体２ａに設けられたスライドコアｓに
よりそれぞれ形成される。[0010] As clearly shown in FIGS.
The mating surfaces 12 of the fixed dies 1
A pair of flat surfaces 13 1 that matches the inner side of both the flat surfaces 4 are connected both flat surfaces 13 1 on both ends, respectively, convex shape surface 14 which forms a band shape and matches the concave surface 5 of the stationary die 1 and Consisting of The Totsukatachimen 14, projections 15 extending on the other flat surface 13 1 side from one of the flat surfaces 13 1 side is bent formed into a U-shape, and both end faces 15a and both flat surfaces 13 1 of the projections 15 A predetermined interval is provided between them. The surface of the ridge 15 and the base of the ridge 15 in the convex surface 14 are:
A convex forming surface 16 corresponding to the concave forming surface 7 of the fixed mold 1 is formed. The outside of each planar surface 13 1, the positioning concave 17 is formed to conform to the positioning projections 9 of the stationary mold 1, also from the outside of the flat surface 13 2 of the positioning concave 17, the stationary die 1 A positioning pin 18 that matches each positioning pin hole 9 protrudes. Both positioning concave 17 both flat surfaces 13 1 of the inner, are formed by a slide core s provided in the mold body 2a.
【００１１】図２〜４に明示するように、型締めを行う
と、可動金型２の凸形成形面１６と、固定金型１の凹形
成形面７との協働でバンパ成形用キャビティＣが形成さ
れる。As clearly shown in FIGS. 2 to 4, when the mold is clamped, the bump-forming cavity is formed by the cooperation of the convex forming surface 16 of the movable mold 2 and the concave forming surface 7 of the fixed mold 1. C is formed.
【００１２】固定金型１は、鋳鉄鋳物である型本体１ａ
と、その型本体１ａへの溶射処理を経て形成され、且つ
凹形成形面７を持つ成形面構成体Ｍとを備える。型本体
１ａは複数の通気孔１９を有し、また成形面構成体Ｍ
は、それら通気孔１９に連通し、且つ凹形成形面７に開
口する複数の微小孔２０を有する。各微小孔２０は、図
面では大きく描かれているが、実際は、合成樹脂材料、
したがってバンパに転写されることのないミクロンオー
ダの大きさを持つ。The fixed mold 1 is a mold body 1a which is a cast iron casting.
And a molding surface structure M formed by thermal spraying the mold body 1a and having a concave forming surface 7. The mold body 1a has a plurality of ventilation holes 19, and the molding surface structure M
Has a plurality of minute holes 20 communicating with the vent holes 19 and opening in the concave-formed surface 7. Each micro hole 20 is drawn large in the drawing, but is actually a synthetic resin material,
Therefore, it has a size on the order of microns which is not transferred to the bumper.
【００１３】各微小孔２０および各通気孔１９は、溶融
合成樹脂材料のキャビティＣ内への充填中において、そ
のキャビティＣ内の空気を外部に排出するように機能
し、これにより、キャビティＣ内に閉じ込められた空気
の断熱圧縮による加熱に起因した合成樹脂材料の焼けを
防止することができる。Each of the micro holes 20 and each of the vent holes 19 function to discharge air in the cavity C to the outside during filling of the cavity with the molten synthetic resin material. The burning of the synthetic resin material due to the heating by the adiabatic compression of the air trapped in the space can be prevented.
【００１４】成形面構成体Ｍは、微小孔２０を有し、且
つ型本体１ａに溶接等により固着された複数の金属板Ｍ
ａと、相隣る両金属板Ｍａ間を埋めると共にそれら金属
板Ｍａおよび型本体１ａに付着する溶射金属部Ｍｂとよ
り構成される。このように微小孔２０を金属板Ｍａに形
成すると、成形面構成体全体を溶射処理により形成し
て、それに微小孔を形成する場合に比べ、面倒な、通気
孔１９との位置合せを不要にして、微小孔形成のための
作業コストを低減することができる、といった利点があ
る。溶射金属部Ｍｂは、下地層２１と、その下地層２１
上に在る主体層２２とよりなる。実施例では、主体層２
２の材質と、金属板Ｍａの材質とは同一であって、それ
ら２２，ＭａはＣｕ系合金よりなる。金属板Ｍａは焼結
材および圧延材から選択される一種であって、実施例で
は焼結材よりなる。下地層２１は、Ｎｉ−Ａｌ系合金よ
りなる。The molding surface structure M has a plurality of metal plates M having minute holes 20 and fixed to the mold body 1a by welding or the like.
a, and a sprayed metal portion Mb that fills between the adjacent metal plates Ma and adheres to the metal plates Ma and the mold body 1a. When the minute holes 20 are formed in the metal plate Ma in this way, it is unnecessary to perform complicated alignment with the vent holes 19 as compared with a case where the entire molding surface structure is formed by thermal spraying and minute holes are formed therein. Therefore, there is an advantage that the operation cost for forming the micropores can be reduced. The sprayed metal portion Mb is formed of an underlayer 21 and the underlayer 21.
It is composed of the main layer 22 on the upper side. In the embodiment, the main layer 2
2 and the material of the metal plate Ma are the same, and they 22 and Ma are made of a Cu-based alloy. The metal plate Ma is a kind selected from a sintered material and a rolled material, and is made of a sintered material in the embodiment. The underlayer 21 is made of a Ni-Al alloy.
【００１５】図１，５，６に明示するように、成形面構
成体Ｍは、凹形成形面７を持つ凹形主体としてのチャン
ネル形主体２３を有する。その主体２３における開口
側、したがって両平坦面４に存するコ字形端面２４の外
縁ｂおよび凹形面５に在って互に平行な両端面２５の外
縁ｂには、外方へ折曲がるように、略フランジ状をなす
アンカ部２６が無端状に形成される。そのアンカ部２６
は、各平坦面４および凹形面５よりも凹んだ無端状凹部
２７に付着して主体２３を型本体１ａに留める効果を有
する。As clearly shown in FIGS. 1, 5 and 6, the molding surface structure M has a channel-shaped main body 23 as a concave main body having a concave-formed surface 7. As shown in FIG. The open side of the main body 23, that is, the outer edge b of the U-shaped end face 24 existing on both flat surfaces 4 and the outer edge b of the both end faces 25 present on the concave surface 5 and parallel to each other are bent outward. An anchor portion 26 having a substantially flange shape is formed endlessly. The anchor part 26
Has an effect of attaching the main body 23 to the mold body 1a by adhering to the endless recess 27 recessed from the flat surface 4 and the concave surface 5.
【００１６】前記のように構成すると、摺動面構成体Ｍ
は、高い耐圧性を有するので、耐圧性に関連した固定金
型１の短命化といった問題は回避される。When configured as described above, the sliding surface structure M
Has a high pressure resistance, so that the problem of shortening the life of the fixed mold 1 related to the pressure resistance can be avoided.
【００１７】また成形面構成体Ｍの形成に要する時間
は、前記電鋳殻の形成に要する時間より大幅に短く、こ
れによりリードタイムを短縮して固定金型１の生産コス
トを低減することが可能である。Further, the time required for forming the molding surface structure M is much shorter than the time required for forming the electroformed shell, thereby shortening the lead time and reducing the production cost of the fixed mold 1. It is possible.
【００１８】さらに成形面構成体ＭをＣｕ系合金および
Ｎｉ−Ａｌ系合金より構成すると、凹形成形面７および
その近傍の熱伝導率が比較的高く冷却性能が良好となる
ので、成形作業のサイクルタイムを短縮してバンパの生
産能率を向上させることが可能である。Further, when the forming surface constituting member M is made of a Cu-based alloy and a Ni-Al-based alloy, the heat conductivity of the concave-formed surface 7 and the vicinity thereof is relatively high and the cooling performance is good, so that the forming operation is not necessary. It is possible to shorten the cycle time and improve the production efficiency of the bumper.
【００１９】また型本体１ａは鋳鉄鋳物であって、その
表面にピンホールが現出することがあるが、そのピンホ
ールは成形面構成体Ｍにより被覆され、しかも成形面構
成体Ｍの表面を平滑化することは容易であるから、バン
パの表面状態も優れたものとなる。The mold body 1a is a cast iron casting, and pinholes may appear on its surface. The pinholes are covered with the molding surface structure M, and the surface of the molding surface structure M Since the smoothing is easy, the surface condition of the bumper also becomes excellent.
【００２０】さらにまた型本体１ａに対する成形面構成
体Ｍの溶射金属部Ｍｂの付着性は良好であって、型本体
１ａの温度が２００℃を超えても、その型本体１ａから
溶射金属部Ｍｂが剥離することはない。一方、金属板Ｍ
ａは型本体１ａに溶接等により固着されているので、そ
の付着性は良い。また主体層２２と金属板Ｍａとを同一
材質にすると、両者２２，Ｍａ間の付着性も良好とな
る。Furthermore, the adhesion of the spray metal part Mb of the molding surface structure M to the mold body 1a is good, and even if the temperature of the mold body 1a exceeds 200 ° C., the spray metal part Mb is removed from the mold body 1a. Does not peel off. On the other hand, the metal plate M
Since a is fixed to the mold body 1a by welding or the like, its adhesion is good. In addition, when the main layer 22 and the metal plate Ma are made of the same material, the adhesion between the two 22 and Ma becomes good.
【００２１】また型本体１ａは鋳鉄鋳物であるからその
強度を損わないように複数の肉抜き部２８を設けて、そ
の軽量化を容易に達成することができ、また固定金型１
のコストも比較的安価となる。Further, since the mold body 1a is a cast iron casting, a plurality of lightening portions 28 are provided so as not to lose its strength, so that its weight can be easily reduced.
Cost is relatively low.
【００２２】固定金型１の製造に当っては次のような方
法が採用される。In manufacturing the fixed mold 1, the following method is employed.
【００２３】（１） 図９（ａ）に示すように、型本体
１ａを鋳鉄を用いて鋳造する。鋳鉄としては、ねずみ鋳
鉄、球状黒鉛鋳鉄等が用いられる。(1) As shown in FIG. 9A, the mold body 1a is cast using cast iron. Gray cast iron, spheroidal graphite cast iron, or the like is used as the cast iron.
【００２４】（２） 図９（ｂ）に示すように、型本体
１ａの成形面構成体形成領域２９に溶射前加工を施す。
この加工は、皮むき、成形面構成体Ｍの厚さを考慮した
研削、無端状凹部２７の形成等を行う機械加工および粗
面化を行うサンドブラスト処理を含む。また型本体１ａ
に複数の通気孔１９を形成し、各通気孔１９の一端を成
形面構成体成形領域２９に開口させ、また他端を型本体
１ａの側面および底面にそれぞれ開口させる（図１，２
参照）。一方、Ｃｕ系合金よりなる複数の金属板Ｍａに
ＹＡＧレーザを用いて微小孔２０を形成し、各金属板Ｍ
ａを、その微小孔２０を通気孔１９に連通させて、型本
体１ａの成形面構成体成形領域２９に溶接する。(2) As shown in FIG. 9 (b), a pre-spraying process is performed on the forming surface structure forming region 29 of the mold body 1a.
This processing includes scalping, grinding in consideration of the thickness of the molding surface structure M, formation of the endless recess 27, and the like, and sandblasting for roughening. The mold body 1a
, A plurality of vent holes 19 are formed, one end of each vent hole 19 is opened in the molding surface structure molding region 29, and the other end is opened in the side surface and the bottom surface of the mold body 1a (FIGS. 1 and 2).
reference). On the other hand, minute holes 20 are formed in a plurality of metal plates Ma made of a Cu-based alloy using a YAG laser, and each metal plate M
a is welded to the molding surface structure molding region 29 of the mold body 1a with the micro holes 20 communicating with the ventilation holes 19.
【００２５】（３） 図９（ｃ）に示すように、各金属
板Ｍａの表面に耐熱テープ３０を付着させて微小孔２０
をマスキングし、次いで成形面構成体形成領域２９に、
各金属板Ｍａを除くようにＮｉ−Ａｌ系合金を用いた溶
射処理を施して極く薄い下地層２１を形成し、さらに下
地層２１表面に、各金属板Ｍａが埋没するようにＣｕ系
合金を用いた溶射処理を施して厚い主体層２２を形成す
る。耐熱テープ３０としては、四フッ化エチレン樹脂テ
ープが用いられる。(3) As shown in FIG. 9 (c), a heat-resistant tape 30 is attached to the surface of each
Is then masked, and then the molding surface structure forming area 29 is
An extremely thin underlayer 21 is formed by performing a thermal spraying process using a Ni-Al-based alloy so as to remove each metal plate Ma, and a Cu-based alloy is formed on the surface of the underlayer 21 such that each metal plate Ma is buried. Is applied to form a thick main layer 22. As the heat-resistant tape 30, a tetrafluoroethylene resin tape is used.
【００２６】Ｎｉ−Ａｌ系合金としては、Ｎｉ−５ｗｔ
％Ａｌ合金、Ｎｉ−２０ｗｔ％Ｃｒ合金、Ｎｉ−７ｗｔ
％Ａｌ−８ｗｔ％Ｃｒ−５ｗｔ％Ｆｅ−５ｗｔ％Ｍｏ合
金等が用いられ、Ｃｕ系合金としては、Ｃｕ−１５．５
ｗｔ％Ｎｉ−０．７１ｗｔ％Ｂ−２．６３ｗｔ％Ｓｉ合
金、Ｃｕ−３８ｗｔ％Ｎｉ合金、Ｃｕ−１０ｗｔ％Ａｌ
−５ｗｔ％Ｎｉ合金、Ｃｕ−１０ｗｔ％Ａｌ−１ｗｔ％
Ｆｅ合金、Ｃｕ−９．１ｗｔ％Ａｌ−３．８ｗｔ％Ｆｅ
−２．１ｗｔ％Ｎｉ−１ｗｔ％Ｍｎ合金等が用いられ
る。As the Ni—Al alloy, Ni-5 wt.
% Al alloy, Ni-20wt% Cr alloy, Ni-7wt
% Al-8wt% Cr-5wt% Fe-5wt% Mo alloy or the like is used, and as a Cu-based alloy, Cu-15.5 is used.
wt% Ni-0.71wt% B-2.63wt% Si alloy, Cu-38wt% Ni alloy, Cu-10wt% Al
-5wt% Ni alloy, Cu-10wt% Al-1wt%
Fe alloy, Cu-9.1 wt% Al-3.8 wt% Fe
-2.1 wt% Ni-1 wt% Mn alloy or the like is used.
【００２７】（４） 主体層２２、それに次いで各金属
板Ｍａに研削等の仕上げ加工を施して、図６に明示した
成形面構成体Ｍを得る。(4) The main layer 22, and then each metal plate Ma are subjected to finish processing such as grinding to obtain the molded surface structure M shown in FIG.
【００２８】なお、位置決めピン孔１１の形成等の必要
な機械加工等は、例えば前記（２）または（４）工程で
行われ、最終的には各種部品の組付けが行われる。Necessary machining such as formation of the positioning pin hole 11 is performed in, for example, the above-mentioned step (2) or (4), and finally various components are assembled.
【００２９】図１０に示すように、可動金型２の型本体
２ａも、前記同様の鋳鉄を用いて鋳造される。その型本
体２ａは、機械加工および研磨加工を施された後、各種
部品を組付けられて使用に供される。このように可動金
型２には成形面構成体Ｍは用いられない。これは、可動
金型２０の凸形成形面１６がバンパの、人目に付かない
内面側を成形するものであるからである。As shown in FIG. 10, the mold body 2a of the movable mold 2 is also cast using the same cast iron as described above. After being subjected to machining and polishing, the mold body 2a is assembled with various components and used. As described above, the molding surface structure M is not used for the movable mold 2. This is because the convex forming surface 16 of the movable mold 20 forms an invisible inner surface side of the bumper.
【００３０】次に、固定金型１の具体的製造例について
説明する。Next, a specific example of manufacturing the fixed mold 1 will be described.
【００３１】（ａ） 型本体１ａを球状黒鉛鋳鉄（ＪＩ
Ｓ ＦＣＤ６００）を用いて鋳造し、次いで型本体１ａ
の成形面構成体形成領域２９に前記溶射前加工を施し、
また型本体１ａに内径０．５〜２mmの通気孔１９を複数
形成した。Ｃｕ−１０ｗｔ％Ａｌ−１ｗｔ％Ｎｉ合金よ
りなる厚さ１mmの複数の金属板ＭａにＹＡＧレーザを用
いて内径２０μｍ以下の微小孔２０を形成し、各金属板
Ｍａを前記のように配置して成形面構成体形成領域２９
に溶接した。(A) The mold body 1a is made of spheroidal graphite cast iron (JI
S FCD600), and then mold body 1a
Subjecting the pre-spray processing to the molding surface structure forming region 29 of
Further, a plurality of ventilation holes 19 having an inner diameter of 0.5 to 2 mm were formed in the mold body 1a. Micro holes 20 having an inner diameter of 20 μm or less are formed in a plurality of 1 mm thick metal plates Ma made of Cu-10 wt% Al-1 wt% Ni alloy using a YAG laser, and each metal plate Ma is arranged as described above. Molding surface structure forming area 29
Welded.
【００３２】（ｂ） 各金属板Ｍａに前記マスキングを
施し、次いで成形面構成体形成領域２９に、各金属板Ｍ
ａを除くように粒径４５〜１０６μｍのＮｉ−５ｗｔ％
Ａｌ合金粉末を用いた溶射処理を施して、厚さ約１００
μｍの下地層２１を形成した。(B) The above-mentioned masking is applied to each metal plate Ma, and then each metal plate M
a-5 wt% Ni-5 wt% with a particle size of 45 to 106 μm to remove a
Spraying treatment using Al alloy powder, thickness about 100
A μm underlayer 21 was formed.
【００３３】溶射機としては、ガン型プラズマ溶射機
（ミラーサーマル社製、ＳＧ−１００）が用いられた。
これは、後述の主体層２２の形成にも同様に用いられ
た。溶射条件は、電流：８００Ａ；作動ガス：Ａｒ圧
０．３５ＭＰａ、Ｈｅ圧０．７ＭＰａ；キャリヤガス：
Ａｒ圧０．２８ＭＰａに設定された。As the spraying machine, a gun type plasma spraying machine (SG-100 manufactured by Miller Thermal Co., Ltd.) was used.
This was similarly used for forming a main layer 22 described later. The spraying conditions were as follows: current: 800 A; working gas: Ar pressure 0.35 MPa, He pressure 0.7 MPa; carrier gas:
The Ar pressure was set to 0.28 MPa.
【００３４】（ｃ） 下地層２１上に、金属板Ｍａと同
一材質のＣｕ系合金粉末を用いた溶射処理を施して、厚
さ約２mmの主体層２２を形成した。この場合の溶射条件
は、電流：６００Ａ；作動ガス：Ａｒ圧０．３５ＭＰ
ａ，Ｈｅ圧０．３５ＭＰａ；キャリヤガス：Ａｒ圧０．
３５ＭＰａに設定された。(C) The main layer 22 having a thickness of about 2 mm was formed on the underlayer 21 by thermal spraying using a Cu-based alloy powder of the same material as the metal plate Ma. The spraying conditions in this case were as follows: current: 600 A; working gas: Ar pressure: 0.35 MP
a, He pressure 0.35 MPa; Carrier gas: Ar pressure 0.
It was set to 35 MPa.
【００３５】（ｄ） 仕上げ加工を行って、厚さ約１mm
の成形面構成体Ｍを得た。(D) After finishing, the thickness is about 1 mm
Was obtained.
【００３６】その後、固定金型１と前記可動金型２を用
いて射出成形を行ったところ、平滑な外面を有し、また
焼け発生の無いバンパを得ることができた。射出成形条
件は、成形材料：ポリプロピレン（出光石油化学社製、
商品名ＳＰ８５０）、型締め圧：４５ＭＰａ；射出圧：
１００ＭＰａ；型温：４０℃；成形材料温度：２００℃
に設定された。Thereafter, injection molding was carried out using the fixed mold 1 and the movable mold 2, and a bumper having a smooth outer surface and free from burning was obtained. The injection molding conditions were as follows: Molding material: polypropylene (made by Idemitsu Petrochemical Co., Ltd.
Product name SP850), mold clamping pressure: 45 MPa; injection pressure:
100 MPa; mold temperature: 40 ° C .; molding material temperature: 200 ° C.
Was set to
【００３７】なお、金属板Ｍａの微小孔２０の形成は前
記（ｄ）工程後に行ってもよい。必要に応じて、成形面
構成体Ｍは可動金型２にも設けられる。また金型は射出
成形法以外の成形法、例えば真空成形法にも当然に適用
される。The formation of the fine holes 20 in the metal plate Ma may be performed after the step (d). If necessary, the molding surface structure M is also provided in the movable mold 2. The mold is naturally applied to a molding method other than the injection molding method, for example, a vacuum molding method.
【００３８】[0038]
【発明の効果】本発明によれば合成樹脂材料に形を付与
する成形面に、その材料に転写されることのない大きさ
を持つ複数の微小孔を開口させた合成樹脂成形用金型に
おいて、その成形面構成体を前記のように構成すること
によって、その耐圧性を高めると共にその製造性を良好
にし、これにより優れた耐久性を有し、またリードタイ
ムを短縮して生産コストを低減することが可能な合成樹
脂成形用金型を提供することができる。According to the present invention, there is provided a synthetic resin molding die in which a plurality of minute holes having a size that is not transferred to the material are formed on a molding surface for imparting a shape to the synthetic resin material. By configuring the molded surface structure as described above, the pressure resistance is increased and the manufacturability is improved, thereby having excellent durability, and shortening the lead time and reducing the production cost. It is possible to provide a synthetic resin molding die that can be used.
【図１】固定金型の斜視図である。FIG. 1 is a perspective view of a fixed mold.
【図２】図１の２−２線断面図である。FIG. 2 is a sectional view taken along line 2-2 of FIG.
【図３】図２の３−３線断面図である。FIG. 3 is a sectional view taken along line 3-3 of FIG. 2;
【図４】型締め時の要部拡大断面図である。FIG. 4 is an enlarged sectional view of a main part at the time of mold clamping.
【図５】固定金型における型本体と成形面構成体との関
係を示す斜視図である。FIG. 5 is a perspective view showing a relationship between a mold body and a molding surface structure in a fixed mold.
【図６】図２の要部拡大図である。FIG. 6 is an enlarged view of a main part of FIG. 2;
【図７】可動金型の断面図である。FIG. 7 is a sectional view of a movable mold.
【図８】図２、８矢示部の拡大図である。FIG. 8 is an enlarged view of a portion indicated by arrows in FIGS.
【図９】固定金型の製造方法説明図である。FIG. 9 is an illustration of a method for manufacturing a fixed mold.
【図１０】可動金型用型本体の断面図である。FIG. 10 is a sectional view of a movable mold body.
１ 固定金型（合成樹脂成形用金型） １ａ 型本体 ７ 凹形成形面（成形面） １９ 通気孔 ２０ 微小孔 ２１ 下地層 ２２ 主体層 Ｍ 成形面構成体 Ｍａ 金属板 Ｍｂ 溶射金属部 REFERENCE SIGNS LIST 1 fixed mold (synthetic resin molding mold) 1a mold main body 7 concave-formed surface (molding surface) 19 air hole 20 micropore 21 base layer 22 main layer M molding surface constituting member Ma metal plate Mb sprayed metal portion
Claims (4)
（７）に、その材料に転写されることのない大きさを持
つ複数の微小孔（２０）を開口させた合成樹脂成形用金
型において、複数の通気孔（１９）を有する型本体（１
ａ）と、その型本体（１ａ）への溶射処理を経て形成さ
れ、且つ複数の前記通気孔（１９）に連通する複数の前
記微小孔（２０）を有する成形面構成体（Ｍ）とを備え
ていることを特徴とする合成樹脂成形用金型。1. A synthetic resin molding die in which a plurality of minute holes (20) having a size that is not transferred to the material are formed in a molding surface (7) for imparting a shape to the synthetic resin material. , A mold body (1) having a plurality of ventilation holes (19).
a) and a molding surface structure (M) formed through thermal spraying of the mold body (1a) and having a plurality of micro holes (20) communicating with a plurality of air holes (19). A synthetic resin molding die, comprising:
（２０）を有し、且つ前記型本体（１ａ）に固着された
複数の金属板（Ｍａ）と、相隣る両金属板（Ｍａ）間を
埋めると共にそれら金属板（Ｍａ）および前記型本体
（１ａ）に付着する溶射金属部（Ｍｂ）とよりなる、請
求項１記載の合成樹脂成形用金型。2. The molding surface structure (M) has a plurality of metal plates (Ma) having the micro holes (20) and fixed to the mold body (1a), and two adjacent metals. 2. The synthetic resin molding die according to claim 1, wherein the metal plate (Ma) and the sprayed metal part (Mb) attached to the die body (1 a) are filled in between the plates (Ma). 3.
１）と、その下地層（２１）上に在る主体層（２２）と
よりなり、その主体層（２２）の材質と、前記金属板
（Ｍａ）の材質とが同一である、請求項２記載の合成樹
脂成形用金型。3. The thermal spray metal part (Mb) includes an underlayer (2).
3. The semiconductor device according to claim 2, further comprising: (1) a main layer (22) on the base layer (21), wherein a material of the main layer (22) is the same as a material of the metal plate (Ma). The synthetic resin molding die according to the above.
（Ｍａ）はＣｕ系合金よりなり、その金属板（Ｍａ）は
焼結材および圧延材から選択される一種である、請求項
２または３記載の合成樹脂成形用金型。4. The main layer (22) and the metal plate (Ma) are made of a Cu-based alloy, and the metal plate (Ma) is a kind selected from a sintered material and a rolled material. 3. The synthetic resin molding die according to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16513898A JP3838602B2 (en) | 1998-06-12 | 1998-06-12 | Mold for plastic molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16513898A JP3838602B2 (en) | 1998-06-12 | 1998-06-12 | Mold for plastic molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11348046A true JPH11348046A (en) | 1999-12-21 |
| JP3838602B2 JP3838602B2 (en) | 2006-10-25 |
Family
ID=15806626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16513898A Expired - Fee Related JP3838602B2 (en) | 1998-06-12 | 1998-06-12 | Mold for plastic molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3838602B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2380704A (en) * | 1998-05-27 | 2003-04-16 | Honda Motor Co Ltd | Process for the production of moulds for synthetic resin moulding |
| GB2339166B (en) * | 1998-05-27 | 2003-07-23 | Honda Motor Co Ltd | Moulds for synthetic resin moulding and process for the production thereof |
-
1998
- 1998-06-12 JP JP16513898A patent/JP3838602B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2380704A (en) * | 1998-05-27 | 2003-04-16 | Honda Motor Co Ltd | Process for the production of moulds for synthetic resin moulding |
| GB2380704B (en) * | 1998-05-27 | 2003-07-23 | Honda Motor Co Ltd | Process for the production of moulds for synthetic resin moulding |
| GB2339166B (en) * | 1998-05-27 | 2003-07-23 | Honda Motor Co Ltd | Moulds for synthetic resin moulding and process for the production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3838602B2 (en) | 2006-10-25 |
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