JPH11346039A - Flexible printed wiring board and its manufacture - Google Patents
Flexible printed wiring board and its manufactureInfo
- Publication number
- JPH11346039A JPH11346039A JP15088398A JP15088398A JPH11346039A JP H11346039 A JPH11346039 A JP H11346039A JP 15088398 A JP15088398 A JP 15088398A JP 15088398 A JP15088398 A JP 15088398A JP H11346039 A JPH11346039 A JP H11346039A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- printed wiring
- wiring board
- copper
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高密度な回路設計
を精度良く加工でき特性インピーダンスをコントロール
することを可能とした特性インピーダンスコントロール
用フレキシブル配線板及びその製造方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit board for controlling characteristic impedance, which can process a high-density circuit design with high precision and control characteristic impedance, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来インピーダンスコントロール用フレ
キシブルプリント配線板の表裏の導通接続は、図２に示
すように、（Ａ）絶縁基材２の両面に接着剤が塗布され
た銅箔を積層した銅張板に、（Ｂ）ＮＣドリルにより予
め所定の位置に所定の穴径で穴明けを行い導通穴３を設
け、（Ｃ）銅張板両面の銅箔面全面に化学銅メッキ処理
を行った後、電気銅メッキ処理を施し、ＮＣドリルによ
り穴明けをした部分の内壁に電気銅メッキ６を析出させ
ることにより、表裏の導通接続を確保していた。次い
で、（Ｄ）電気銅メッキ処理された銅張板の両面に感光
性ドライフィルムレジストをラミネートし、回路となる
部分以外を露光、現像し、回路となる部分はマスク７化
し、（Ｅ）所定の導体回路８及び導通接続部９を形成し
ていた。2. Description of the Related Art Conventionally, as shown in FIG. 2, a conductive connection between a front side and a back side of a flexible printed wiring board for impedance control is performed by (A) a copper-clad laminate obtained by laminating a copper foil coated with an adhesive on both sides of an insulating base material 2. (B) After conducting drilling in a predetermined position with a predetermined hole diameter by an NC drill to form a conductive hole 3 on the plate, and (C) performing a chemical copper plating process on the entire copper foil surface on both surfaces of the copper clad plate. Then, an electrolytic copper plating process is performed, and an electrolytic copper plating 6 is deposited on an inner wall of a portion drilled by an NC drill, thereby ensuring front and rear conductive connection. Next, (D) a photosensitive dry film resist is laminated on both sides of the copper-clad plate subjected to the electro-copper plating treatment, and the portions other than the portions to be circuits are exposed and developed. Of the conductive circuit 8 and the conductive connection portion 9.
【０００３】しかし、この加工方法では両面回路銅箔面
の全面に化学銅メッキ及び電気銅メッキ処理が施される
ため、導通接続後の回路形成工程でエッチング処理を行
う際に、銅箔表面を処理した化学銅メッキ及び電気銅メ
ッキを除去することが必要である。しかし、エッチング
精度の点から回路形成が可能となる導体回路幅及び導体
回路間の間隔には限界があり、更に電気銅メッキの厚さ
のばらつきの影響により導体回路形成後の仕上がり幅の
ばらつきが大きく変化するのでパターン設計及び製造工
程時の歩留低下等の問題があるとともに、特性インピー
ダンスをコントロールする上で重要な導体回路幅及び厚
さが前記の通りばらつくことにより、完成製品の特性面
でも問題があった。導体回路加工精度の制約の他に、構
造の点から絶縁基材の表裏に貼合わせられた銅箔面に表
裏導通接続用の電気メッキ処理がなされるため、銅箔と
して屈曲特性に優れている圧延銅箔を用いても、導体の
厚さが増すことにより屈曲特性が劣化し、圧延銅箔の屈
曲特性を有効に活用することができない。[0003] However, in this processing method, chemical copper plating and electrolytic copper plating are applied to the entire surface of the double-sided circuit copper foil. It is necessary to remove the treated chemical copper plating and electrolytic copper plating. However, there is a limit to the width of conductor circuits and the spacing between conductor circuits that enable circuit formation from the viewpoint of etching accuracy, and furthermore, variations in the finished width after conductor circuits are formed due to the effects of variations in the thickness of electrolytic copper plating. Since it greatly changes, there are problems such as a decrease in the yield during the pattern design and the manufacturing process, and the conductor circuit width and thickness that are important in controlling the characteristic impedance vary as described above. There was a problem. In addition to the restriction of processing accuracy of the conductor circuit, since the copper foil surface bonded to the front and back of the insulating base material is subjected to electroplating for front and back conductive connection from the viewpoint of the structure, it has excellent bending characteristics as copper foil Even when a rolled copper foil is used, the bending characteristics are degraded due to an increase in the thickness of the conductor, and the bending characteristics of the rolled copper foil cannot be effectively utilized.
【０００４】これらの制約条件が特性インピーダンスを
コントロールすることが必要な製品の設計上及び特性上
問題となっているため、これらの導体回路形成及び構造
上の問題点を解消するため、電気銅メッキを行う際にガ
ラス基材エポキシ樹脂積層板等を所定の形状でくり抜い
た遮蔽板を銅張板表裏にクリップ等で挟み合わせ、回路
の表裏導通接続が必要な部分にのみ電気銅メッキを析出
させ、導体回路幅精度が必要な部分には析出させないよ
うにする遮蔽メッキ方法があるが、製品の形状毎に遮蔽
板を準備する必要があり、又電気銅メッキ工程での遮蔽
板の取り付け、取り外し作業等の工数増加、製品の取り
扱い工程の増加によるオレ、シワ等による歩留の低下等
により加工工程の煩雑化、コストアップの要因に繋がる
問題がある。又遮蔽板を銅張板に挟み合わせて加工する
ため、銅張板の所定の位置に対する位置ズレ及び電気メ
ッキ時に銅張板と遮蔽板の合わせ面から液の回り込みに
より、設計したメッキ析出部の境界より１０〜１５ｍｍ
広がるため、この部分の導体回路幅及び厚さの変動を考
慮して特性インピーダンスに影響ないよう設計すること
が必要であった。[0004] These restrictions pose a problem in the design and characteristics of products that require control of characteristic impedance. When carrying out, sandwich a shielding plate made by cutting out a glass base epoxy resin laminated board etc. in a predetermined shape with clips etc. on the front and back of the copper clad board, and deposit copper electroplating only on the parts where front and back conductive connection of the circuit is required There is a shield plating method to prevent deposition on the part where conductor circuit width accuracy is required, but it is necessary to prepare a shield plate for each product shape, and to attach and remove the shield plate in the electrolytic copper plating process There is a problem in that the number of man-hours for operations and the like, and the yield decreases due to an increase in the number of product handling steps and the like due to crevices, wrinkles, etc., lead to complicated processing steps and cost increase factors. In addition, since the shielding plate is sandwiched and processed by the copper clad plate, the position of the copper clad plate with respect to the predetermined position is misaligned, and during electroplating, the liquid spills from the mating surface of the copper clad plate and the shielding plate, so that the designed plating deposition part 10-15mm from the border
Therefore, it is necessary to design the circuit so as not to affect the characteristic impedance in consideration of variations in the width and thickness of the conductor circuit in this portion.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、特性インピ
ーダンスコントロールフレキシブルプリント配線板にお
いて導体回路を形成する際に発生する問題点及び構造上
の問題点を解決するためになされたもので、その目的と
するところは煩雑な加工工程を必要とせず、高密度な回
路設計を精度良くでき、製品の特性インピーダンスのコ
ントロール精度も向上するフレキシブルプリント配線板
及びその製造方法を提供するものである。SUMMARY OF THE INVENTION The present invention has been made to solve the problems and structural problems that occur when forming a conductive circuit in a characteristic impedance control flexible printed wiring board. The object of the present invention is to provide a flexible printed wiring board which does not require complicated processing steps, enables high-density circuit design with high accuracy, and improves control accuracy of characteristic impedance of a product, and a method of manufacturing the same.
【０００６】[0006]
【課題を解決するための手段】本発明は、絶縁基材の両
面に導体回路を形成したフレキシブルプリント配線板に
おいて、該プリント配線板の表裏接続用回路パッド部及
び導通接続部のみの表面が電気銅メッキされていること
を特徴とする特性インピーダンスコントロール用フレキ
シブルプリント配線板であり、また絶縁基材の両面に銅
箔を積層した銅張板の回路パッド部に表裏接続用の導通
穴を明けた後、絶縁基材の両面の銅箔上に感光性ドライ
フィルムレジストをラミネートし、回路パッド部のみを
露光、現像し、他の部分はマスク化し、回路パッド部及
び導通穴に電気銅メッキを析出させ導通接続部を設け、
表裏の導通接続をした後、所定の導体回路を形成するこ
とを特徴とする特性インピーダンスコントロール用フレ
キシブルプリント配線板の製造方法である。According to the present invention, there is provided a flexible printed wiring board having conductive circuits formed on both surfaces of an insulating base material, wherein only the surface of the circuit pad portion for front / back connection and the conductive connection portion of the printed wiring board are electrically connected. This is a flexible printed wiring board for characteristic impedance control characterized by being copper-plated, and a conduction hole for front and back connection is made in the circuit pad part of the copper clad board with copper foil laminated on both sides of the insulating base material. After that, a photosensitive dry film resist is laminated on the copper foil on both sides of the insulating substrate, only the circuit pads are exposed and developed, and the other parts are masked, and electrolytic copper plating is deposited on the circuit pads and the conductive holes To provide a conductive connection,
A method for manufacturing a flexible printed wiring board for controlling characteristic impedance, comprising forming a predetermined conductor circuit after conducting a front-to-back connection.
【０００７】[0007]
【発明の実施の形態】以下、本発明を具体的に説明す
る。本発明に用いる絶縁基材の両面に導体回路が形成さ
れた特性インピーダンスコントロール用フレキシブルプ
リント配線板の素材は、ポリエステル樹脂フィルム、ポ
リイミド樹脂フィルム等の絶縁基材の両面に圧延銅箔等
の銅箔を加熱・加圧して一体成形されたものである。又
絶縁基材の両面の銅箔上にラミネートする感光性ドライ
フィルムレジスト（以下、ＤＦＲという）についても、
従来からこの分野で用いられているアクリル系樹脂フィ
ルムと同様のものを用いればよく特に限定されるもので
はない。このＤＦＲも従来からこの分野で用いるもので
ある。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below. The material of the flexible printed wiring board for characteristic impedance control in which conductive circuits are formed on both sides of the insulating base material used in the present invention is a copper foil such as a rolled copper foil on both sides of an insulating base material such as a polyester resin film or a polyimide resin film. Are integrally molded by heating and pressing. Also, for photosensitive dry film resist (hereinafter referred to as DFR) laminated on copper foil on both sides of insulating base material,
There is no particular limitation as long as it is the same as the acrylic resin film conventionally used in this field. This DFR has also conventionally been used in this field.
【０００８】以下、図面を用いて本発明を具体的に説明
するが、これらに限定されるものではない。図１（Ａ）
〜（Ｆ）は、両面に導体回路を有する特性インピーダン
スコントロール用フレキシブルプリント配線板の断面模
式図を示す。 図１（Ａ）：絶縁基材２に圧延銅箔１を積層し表裏一体
成形した銅張板素材である。 図１（Ｂ）：この銅張板に、ＮＣドリルにより所定の表
裏導通する導通穴３を形成する。図１（Ａ）及び図１
（Ｂ）の工程は、従来のフレキシブルプリント配線板の
製造工程と同一で特に限定されるものではない。 図１（Ｃ）：図１（Ｂ）で得られた導通穴を有する銅張
板の両面にＤＦＲをロール圧着でラミネートし、表裏導
通接続を行う部分以外を露光後現像作業を行い開口部５
を設けると共に、その他の部分は表面被覆することを目
的とするマスク４を設ける。 図１（Ｄ）：所定の箇所に電気銅メッキ６を析出させ表
裏の導通接続するための導通接続部９及び回路パッド部
１０を設ける。 図１（Ｅ）：マスク（残存ＤＦＲ）４を剥離後、導体回
路形成用のＤＦＲをラミネートし、所定の画像形成を行
い、回路及び回路パッド部以外を露光後現像し、回路及
び回路パッド部はマスク７化される。 図１（Ｆ）：エッチング作業を行った後マスク７を剥離
し、所定の導体回路８を形成し、製品化される。Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited thereto. FIG. 1 (A)
1 to (F) are schematic cross-sectional views of a flexible printed wiring board for characteristic impedance control having conductor circuits on both surfaces. FIG. 1 (A): This is a copper clad board material obtained by laminating a rolled copper foil 1 on an insulating base material 2 and integrally molding the front and back sides. FIG. 1 (B): The copper-clad plate is formed with a conduction hole 3 for conducting a predetermined front and back surface by an NC drill. 1 (A) and 1
The step (B) is the same as the conventional flexible printed wiring board manufacturing step and is not particularly limited. FIG. 1 (C): DFR is laminated on both sides of the copper-clad plate having the conduction holes obtained in FIG.
And a mask 4 intended to cover the other surface. FIG. 1 (D): A conductive connection portion 9 and a circuit pad portion 10 for depositing an electrolytic copper plating 6 at a predetermined location and electrically connecting the front and back sides are provided. FIG. 1E: After peeling off the mask (residual DFR) 4, laminating a DFR for forming a conductor circuit, forming a predetermined image, exposing and developing portions other than the circuit and the circuit pad portion, and developing the circuit and the circuit pad portion. Is turned into a mask 7. FIG. 1 (F): After performing the etching operation, the mask 7 is peeled off, and a predetermined conductor circuit 8 is formed.
【０００９】以上のように穴明けされた銅張板の両面に
ＤＦＲをラミネートし、表裏導通接続を行う部分以外を
露光後現像作業を行い開口部を設ける。銅箔の表裏導通
接続を行う際の電気銅メッキ法においては、穴明けした
内壁の絶縁基材に電気銅メッキを析出させるための前処
理が必要である。前処理は絶縁基材に化学銅メッキ、パ
ラジウム、カーボン、グラファイト等の導電体を付着さ
せることにより行われる。その後所定の表裏接続用回路
パッド部のみに電気銅メッキを析出させるため、ＤＦＲ
を用いて該当部以外をマスクした後に、電気銅メッキを
５〜１５μｍ析出させ表裏接続用回路パッド部のみに導
通接続を確保するようにすればよい。従来の遮蔽板を用
いた部分的に電気銅メッキを析出させる方法では、遮蔽
板の加工精度及び電気銅メッキ時の位置合わせ等の制約
から最小メッキ面積が１００〜１５０ｍｍ2 程度で表裏
導通用の穴との位置精度が±１０〜１５ｍｍ程度あり、
又形状も矩形状もしくは円形状となる等の制約があっ
た。DFR is laminated on both surfaces of the copper-clad plate thus drilled, and an opening is formed by performing a developing operation after exposure except for a portion where a front-to-back conductive connection is made. In the electrolytic copper plating method for making the front and back conductive connection of the copper foil, a pretreatment for depositing the electrolytic copper plating on the insulating base material of the perforated inner wall is required. The pretreatment is performed by attaching a conductor such as chemical copper plating, palladium, carbon, and graphite to the insulating base material. After that, in order to deposit electrolytic copper plating only on the predetermined circuit pad portion for front and back connection, DFR
After masking the portions other than the corresponding portions by using the method described above, 5 to 15 μm of electrolytic copper plating may be deposited to ensure a conductive connection only to the front and back connection circuit pad portions. In the method of partially depositing electrolytic copper plating using a conventional shielding plate, the minimum plating area is about 100 to 150 mm 2 due to restrictions such as processing accuracy of the shielding plate and alignment at the time of electrolytic copper plating. Position accuracy with the hole is about ± 10-15mm,
There are also restrictions such as a rectangular or circular shape.
【００１０】本発明では、ＤＦＲをマスクとして用い選
択的に電気銅メッキを析出させるため、最小メッキ面積
が０．３〜１．０ｍｍ2 の不定形形状で、かつ位置精度
も±０．０５〜０．２０ｍｍの加工が可能となる。その
結果、表裏接続用回路パッド部のみに導通接続用の電気
銅メッキを選択的に析出させることが可能となる。これ
により表裏導通接続用回路パッド部以外の導体回路部分
では電気銅メッキの析出がなく、前記したメッキによる
厚さの影響がなくなりエッチングすることができるの
で、回路幅が０．０３〜０．１０ｍｍの高密度な導体回
路形成が高歩留且つ高精度で加工することができ、導体
回路部の特性インピーダンスコントロールが容易に可能
となる。In the present invention, since the electrolytic copper plating is selectively deposited using the DFR as a mask, it has an irregular shape with a minimum plating area of 0.3 to 1.0 mm 2 and a positional accuracy of ± 0.05 to Processing of 0.20 mm becomes possible. As a result, it becomes possible to selectively deposit electrolytic copper plating for conductive connection only on the front and back connection circuit pad portions. As a result, there is no deposition of electrolytic copper plating in the conductor circuit portions other than the front and back conductive connection circuit pad portions, and the thickness can be etched without being affected by the above-described plating, so that the circuit width is 0.03 to 0.10 mm. , A high-density conductor circuit can be formed with high yield and high precision, and the characteristic impedance of the conductor circuit portion can be easily controlled.
【００１１】[0011]
【発明の効果】本発明の絶縁基材の両面に導体回路を形
成したフレキシブルプリント配線板において、プリント
配線板の表裏接続用回路パッド部及び導通接続部のみの
表面が電気銅メッキされているため、特性インピーダン
スコントロールが必要な導体回路形成が高密度で安定し
て得ることが可能である。In the flexible printed wiring board according to the present invention in which conductive circuits are formed on both sides of the insulating base material, only the surface of the circuit pad portion for front and back connection and the conductive connection portion of the printed wiring board are electroplated with copper. In addition, it is possible to stably obtain a conductive circuit requiring characteristic impedance control at a high density.
【図１】本発明の特性インピーダンスコントロール用フ
レキシブルプリント配線板の断面模式図。FIG. 1 is a schematic cross-sectional view of a flexible printed wiring board for controlling characteristic impedance according to the present invention.
【図２】従来技術の特性インピーダンスコントロール用
フレキシブルプリント配線板の断面模式図。FIG. 2 is a schematic cross-sectional view of a conventional flexible printed wiring board for controlling characteristic impedance.
Claims (2)
レキシブルプリント配線板において、該プリント配線板
の表裏接続用回路パッド部及び導通接続部のみの表面が
電気銅メッキされていることを特徴とする特性インピー
ダンスコントロール用フレキシブルプリント配線板。1. A flexible printed wiring board in which conductive circuits are formed on both sides of an insulating base material, wherein only the surface of the front and back connection circuit pads and the conductive connection portion of the printed wiring board are plated with copper. Flexible printed wiring board for controlling characteristic impedance.
の回路パッド部に表裏接続用の導通穴を明けた後、絶縁
基材の両面の銅箔上に感光性ドライフィルムレジストを
ラミネートし、回路パッド部のみを露光、現像し、他の
部分はマスク化し、回路パッド部及び導通穴に電気銅メ
ッキを析出させ導通接続部を設け、表裏の導通接続をし
た後、所定の導体回路を形成することを特徴とする特性
インピーダンスコントロール用フレキシブルプリント配
線板の製造方法。2. A conductive dry film resist is formed on the copper foil on both sides of the insulating base material after forming conductive holes for front and back connection in the circuit pad portion of the copper clad board in which copper foil is laminated on both surfaces of the insulating base material. After laminating, only the circuit pad portion is exposed and developed, the other portions are masked, electrolytic copper plating is deposited on the circuit pad portion and the conductive hole, a conductive connection portion is provided, and the front and back conductive connection is made, and then a predetermined A method for producing a flexible printed wiring board for controlling characteristic impedance, comprising forming a conductor circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15088398A JPH11346039A (en) | 1998-06-01 | 1998-06-01 | Flexible printed wiring board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15088398A JPH11346039A (en) | 1998-06-01 | 1998-06-01 | Flexible printed wiring board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11346039A true JPH11346039A (en) | 1999-12-14 |
Family
ID=15506473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15088398A Pending JPH11346039A (en) | 1998-06-01 | 1998-06-01 | Flexible printed wiring board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11346039A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344921A (en) * | 2005-05-12 | 2006-12-21 | Maruwa Seisakusho:Kk | Manufacturing method for printed circuit board |
-
1998
- 1998-06-01 JP JP15088398A patent/JPH11346039A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344921A (en) * | 2005-05-12 | 2006-12-21 | Maruwa Seisakusho:Kk | Manufacturing method for printed circuit board |
| JP4520392B2 (en) * | 2005-05-12 | 2010-08-04 | 株式会社丸和製作所 | Printed circuit board manufacturing method |
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