JPH11329864A - Winding component and manufacture thereof - Google Patents
Winding component and manufacture thereofInfo
- Publication number
- JPH11329864A JPH11329864A JP13158498A JP13158498A JPH11329864A JP H11329864 A JPH11329864 A JP H11329864A JP 13158498 A JP13158498 A JP 13158498A JP 13158498 A JP13158498 A JP 13158498A JP H11329864 A JPH11329864 A JP H11329864A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- bobbin
- wire
- winding component
- binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coils Of Transformers For General Uses (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、冷陰極管点灯用の
インバータトランス等に適用するに好適な巻線部品およ
びその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a winding component suitable for application to an inverter transformer for lighting a cold-cathode tube and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来この種の巻線部品としては、ボビン
の胴部に線材を巻き、その線材の端部を端子に絡げて半
田付けし、ボビンの胴部の周囲および内部にコアを設け
て磁路を形成したものが多用されていた。2. Description of the Related Art Conventionally, as a winding component of this type, a wire is wound around the body of a bobbin, the end of the wire is tied to a terminal and soldered, and a core is provided around and inside the body of the bobbin. Those provided to form a magnetic path have been frequently used.
【０００３】[0003]
【発明が解決しようとする課題】しかし、これでは次の
ような不都合があった。However, this has the following disadvantages.
【０００４】第１に、すべての端子はボビンの端子埋設
部に並んで突出しているので、特に自動巻線機を用いて
線材を端子に絡げるためには、隣接する２個の端子間に
一定の間隔をおく必要があり、そのためボビンの幅が広
くなってしまう。[0004] First, since all the terminals protrude side by side in the terminal buried portion of the bobbin, in particular, in order to entangle the wire with the terminal using an automatic winding machine, it is necessary to set a distance between two adjacent terminals. In this case, it is necessary to keep a certain interval between the bobbins, so that the width of the bobbin is increased.
【０００５】第２に、端子に絡げた線材を半田付けする
際に、半田の熱によるストレスで線材が細くなり、断線
しやすくなる。Second, when a wire entangled with a terminal is soldered, the wire becomes thinner due to stress caused by the heat of the solder, and the wire is easily broken.
【０００６】第３に、巻線部品を基板に落とし込んで薄
型化を図る場合、ボビンの幅が広いと、当然それだけ幅
広の基板が必要となる。Third, when the winding parts are dropped into a substrate to reduce the thickness, if the bobbin is wide, it is natural that a wide substrate is required.
【０００７】本発明は、上記事情に鑑み、線材の絡げ作
業に支障を来すことなくボビンの幅を狭めることが可能
で、半田の熱に起因する線材の断線を回避でき、しかも
細い基板にも落とし込むことが可能な巻線部品およびそ
の製造方法を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above circumstances, the present invention makes it possible to reduce the width of a bobbin without interfering with the work of entanglement of a wire, to avoid breakage of the wire caused by the heat of solder, and to achieve a thin substrate. It is an object of the present invention to provide a winding component that can be dropped into a device and a method for manufacturing the same.
【０００８】[0008]
【課題を解決するための手段】すなわち、本発明のうち
巻線部品の発明は、胴部（２ａ）と端子埋設部（２ｂ、
２ｃ）とが連設されたボビン（２）を有し、このボビン
の端子埋設部に端子（４）をその絡げ側端部（４ｂ）が
当該端子埋設部の側面から突出するように埋設し、前記
ボビンの胴部に線材（３）を巻き、この線材の端部を前
記端子の絡げ側端部に絡げて半田付けし、前記ボビンに
コア（５、６）を組み付けて磁路を形成して構成され
る。That is, among the present invention, the invention of the winding part comprises a body (2a) and a terminal burying part (2b,
2c) and a bobbin (2) connected in series, and a terminal (4) is buried in a terminal buried portion of the bobbin such that a binding side end (4b) protrudes from a side surface of the terminal buried portion. Then, a wire (3) is wound around the body of the bobbin, the end of the wire is tied to the tangled end of the terminal and soldered, and the cores (5, 6) are assembled to the bobbin and magnetized. It is configured by forming a road.
【０００９】また、上記端子（４）の絡げ側端部（４
ｂ）より熱伝導度の大きい放熱部材（７）を当該絡げ側
端部に添設して構成される。Further, the end (4)
b) A heat dissipating member (7) having a higher thermal conductivity is provided at the end of the binding side.
【００１０】さらに、上記ボビン（２）の端子埋設部
（２ｂ、２ｃ）の底面に基板落込部（２ｄ、２ｅ）を当
該ボビンの胴部（２ａ）の幅に合わせて形成して構成さ
れる。[0010] Further, the substrate recessed portions (2d, 2e) are formed on the bottom surface of the terminal embedding portions (2b, 2c) of the bobbin (2) according to the width of the body (2a) of the bobbin. .
【００１１】一方、本発明のうち巻線部品の製造方法の
発明は、上述した巻線部品（１）の製造方法であって、
線材（３）の端部を端子（４）の絡げ側端部（４ｂ）に
絡げて半田付けする際に、前記線材の端部を前記端子の
絡げ側端部に絡げ、その後、半田液（９）の上方で前記
端子が当該半田液に対向するようにボビン（２）をその
長さ方向が当該半田液の液面に直交する形で保持し、こ
の状態で、前記ボビンを下降させて前記端子の絡げ側端
部を前記半田液に浸漬するようにして構成される。On the other hand, among the present invention, the invention of a method of manufacturing a winding component is a method of manufacturing the above-described winding component (1),
When the end of the wire (3) is entangled with the entangled end (4b) of the terminal (4) and soldered, the end of the wire is entangled with the entangled end of the terminal, and thereafter The bobbin (2) is held so that its length direction is orthogonal to the surface of the solder liquid so that the terminal faces the solder liquid above the solder liquid (9). Is lowered to immerse the binding-side end of the terminal in the solder liquid.
【００１２】なお、括弧内の番号等は図面において対応
する要素を表わす便宜的なものであり、従って、本発明
は図面上の記載に限定拘束されるものではない。このこ
とは「特許請求の範囲」の欄についても同様である。It should be noted that the numbers and the like in parentheses are for convenience showing the corresponding elements in the drawings, and therefore, the present invention is not limited to the description on the drawings. The same applies to the column of “Claims”.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１４】図１は本発明に係る巻線部品の一実施形態
を示す分解斜視図、図２は図１に示す巻線部品を基板に
落とし込んだ状態を示す図であり、（ａ）はその側面
図、（ｂ）はその正面図、図３は本発明に係る巻線部品
の製造方法の一実施形態を示す図であり、（ａ）は端子
を半田液に浸漬する前の状態を示す正面図、（ｂ）は
（ａ）の右側面図、（ｃ）は端子を半田液に浸漬した状
態を示す拡大正面図である。FIG. 1 is an exploded perspective view showing an embodiment of a winding part according to the present invention, FIG. 2 is a view showing a state where the winding part shown in FIG. 1 is dropped on a substrate, and FIG. FIG. 3B is a side view, FIG. 3B is a front view thereof, and FIG. 3 is a view showing one embodiment of a method of manufacturing a winding component according to the present invention, and FIG. 3A shows a state before the terminals are immersed in a solder solution. FIG. 2B is a front view, FIG. 2B is a right side view of FIG. 1A, and FIG. 1C is an enlarged front view showing a state where the terminal is immersed in a solder liquid.
【００１５】本発明に係る巻線部品１は、図１に示すよ
うに、ボビン２、線材３、端子４、ロ形のコア５および
Ｉ形のコア６から構成されている。ボビン２は胴部２ａ
を有しており、胴部２ａの両側にはそれぞれ端子埋設部
２ｂ、２ｃが形成されている。各端子埋設部２ｂ、２ｃ
には複数本の端子４がその基板側端部４ａをボビン２の
長さ方向に突出させた形で埋設されており、各端子４の
絡げ側端部４ｂは端子埋設部２ｂ、２ｃの側面からボビ
ン２の幅方向に突出している。この絡げ側端部４ｂに
は、図３に示すように、合成樹脂製の放熱部材７が添設
されている。そして、ボビン２の胴部２ａには線材３が
巻設されており、線材３の両端部は端子４の絡げ側端部
４ｂおよび放熱部材７に絡げられて半田付けされてい
る。また、ボビン２の各端子埋設部２ｂ、２ｃの底面に
はそれぞれ基板落込部２ｄ、２ｅが、ボビン２の胴部２
ａの幅に合わせて形成されている。さらに、ボビン２の
胴部２ａには、その周囲にロ形のコア５が、その内部に
Ｉ形のコア６が組み付けられている。As shown in FIG. 1, the winding component 1 according to the present invention comprises a bobbin 2, a wire 3, terminals 4, a core 5 in a square shape, and a core 6 in an I shape. The bobbin 2 is a trunk 2a
And terminal embedding portions 2b, 2c are formed on both sides of the body portion 2a, respectively. Each terminal burying part 2b, 2c
A plurality of terminals 4 are buried in such a manner that the board side end 4a is protruded in the length direction of the bobbin 2, and the binding side end 4b of each terminal 4 is formed by the terminal buried portion 2b, 2c. It protrudes from the side in the width direction of the bobbin 2. As shown in FIG. 3, a heat radiating member 7 made of synthetic resin is attached to the binding side end 4b. A wire 3 is wound around the body 2 a of the bobbin 2, and both ends of the wire 3 are entangled with the entanglement end 4 b of the terminal 4 and the heat radiation member 7 and soldered. Further, board drop portions 2d and 2e are respectively provided on the bottom surfaces of the terminal embedded portions 2b and 2c of the bobbin 2, and the body portion 2b of the bobbin 2.
It is formed according to the width of a. Further, the body 2a of the bobbin 2 is provided with a hollow core 5 around the periphery thereof and an I-shaped core 6 therein.
【００１６】本発明に係る巻線部品１は以上のような構
成を有するので、この巻線部品１を製造する際には次の
手順による。Since the winding component 1 according to the present invention has the above-described configuration, the following procedure is used when manufacturing the winding component 1.
【００１７】まず、自動巻線機（図示せず）を用いて、
ボビン２の胴部２ａに線材３を巻き、この線材３の両端
部を端子４の絡げ側端部４ｂおよび放熱部材７に絡げ
る。この際、端子４の絡げ側端部４ｂは端子埋設部２
ｂ、２ｃの側面からボビン２の幅方向に突出しているの
で、端子４の基板側端部４ａが邪魔になって線材３を円
滑に絡げることができないという状況は生じない。First, using an automatic winding machine (not shown),
The wire 3 is wound around the body 2 a of the bobbin 2, and both ends of the wire 3 are tied to the entanglement end 4 b of the terminal 4 and the heat radiation member 7. At this time, the binding side end 4b of the terminal 4 is
Since the protrusions protrude in the width direction of the bobbin 2 from the side surfaces of the terminals 2b and 2c, the situation that the wire 3 cannot be smoothly entangled by the substrate-side end 4a of the terminal 4 does not occur.
【００１８】次に、こうして絡げた線材３の両端部を端
子４の絡げ側端部４ｂに半田付けする。それには、図３
（ａ）に示すように、半田液９の上方で、端子４が半田
液９に対向するようにボビン２をその長さ方向が半田液
９の液面に直交する形で保持し、この状態でボビン２を
下降させる。すると、図３（ｃ）に示すように、端子４
の絡げ側端部４ｂが半田液９に浸漬され、半田付けが行
われる。この際、端子４の絡げ側端部４ｂおよび放熱部
材７に絡げられた線材３の両端部をすべて半田液９に浸
漬するのではなく、その一部が半田液９の液面より上に
残るようにする。すると、半田の熱によるストレスが低
減され、線材３が断線しにくくなる。その上、端子４の
絡げ側端部４ｂには放熱部材７が添設されているので、
半田の熱の一部が放熱部材７に移動することから、半田
の熱によるストレスを一層低減し、線材３が断線する事
態を抑制することができる。Next, both ends of the wire 3 thus tied are soldered to the tangled end 4b of the terminal 4. Figure 3
As shown in (a), the bobbin 2 is held above the solder liquid 9 such that the terminal 4 faces the solder liquid 9 so that the length direction thereof is orthogonal to the liquid surface of the solder liquid 9. To lower the bobbin 2. Then, as shown in FIG.
Is immersed in the solder liquid 9 and soldering is performed. At this time, not all the ends of the wire 4 entangled with the entanglement side 4b of the terminal 4 and the wire 3 entangled with the heat radiating member 7 are immersed in the solder liquid 9, but a part of the end is higher than the liquid level of the solder liquid 9. To remain. Then, the stress due to the heat of the solder is reduced, and the wire 3 is hardly broken. In addition, since the radiating member 7 is attached to the binding side end 4b of the terminal 4,
Since a part of the heat of the solder moves to the heat radiating member 7, the stress due to the heat of the solder can be further reduced, and the situation where the wire 3 is broken can be suppressed.
【００１９】最後に、ボビン２にロ形のコア５およびＩ
形のコア６を組み付けて磁路を形成する。すると、巻線
部品１が出来上がり、ここで巻線部品１の製造が終了す
る。Finally, the bobbin 2 has the cores 5 and I
A magnetic path is formed by assembling the shaped core 6. Then, the winding component 1 is completed, and the manufacture of the winding component 1 ends here.
【００２０】また、図１に示すように、この巻線部品１
を基板１０に装着する際には、図２に示すように、基板
１０に長方形状の貫通孔１０ａを形成し、この貫通孔１
０ａにボビン２を落とし込むようにして巻線部品１を基
板１０に搭載する。すると、巻線部品１のボビン２の胴
部２ａと基板落込部２ｄ、２ｅが貫通孔１０ａに落ち込
み、その分だけ基板１０上の巻線部品１の高さが低くな
り、薄型化に寄与する。しかも、基板１０の貫通孔１０
ａに落ち込むのは、巻線部品１のボビン２の胴部２ａと
基板落込部２ｄ、２ｅのみであるので、ボビン２の幅Ｗ
１と同程度の幅Ｗ２を有する基板１０を採用することが
できる。Further, as shown in FIG.
When the substrate 10 is mounted on the substrate 10, a rectangular through hole 10a is formed in the substrate 10 as shown in FIG.
The winding component 1 is mounted on the board 10 such that the bobbin 2 is dropped into the substrate 0a. Then, the body 2a of the bobbin 2 of the winding component 1 and the board drop portions 2d, 2e fall into the through holes 10a, and the height of the winding component 1 on the board 10 is reduced accordingly, contributing to a reduction in thickness. . Moreover, the through hole 10 of the substrate 10
a, only the body 2a of the bobbin 2 of the winding component 1 and the board droppings 2d, 2e fall into the width W of the bobbin 2.
The substrate 10 having a width W2 similar to that of the substrate 1 can be employed.
【００２１】なお、上述の実施形態においては、端子４
の絡げ側端部４ｂより熱伝導度の大きい放熱部材として
合成樹脂製の放熱部材７を用いた場合について説明した
が、端子４の絡げ側端部４ｂより熱伝導度の大きいもの
である限り、合成樹脂以外の材質からなる放熱部材を採
用することも可能である。In the above embodiment, the terminal 4
The case where the heat radiating member 7 made of synthetic resin is used as the heat radiating member having higher thermal conductivity than the entangled side end 4b of the terminal 4 has been described. However, the terminal 4 has higher thermal conductivity than the entangled side end 4b. As long as it is possible, a heat dissipating member made of a material other than the synthetic resin can be adopted.
【００２２】[0022]
【発明の効果】以上説明したように、本発明のうち巻線
部品の発明によれば、胴部２ａと端子埋設部２ｂ、２ｃ
とが連設されたボビン２を有し、このボビン２の端子埋
設部２ｂ、２ｃに端子４をその絡げ側端部４ｂが当該端
子埋設部２ｂ、２ｃの側面から突出するように埋設し、
前記ボビン２の胴部２ａに線材３を巻き、この線材３の
端部を前記端子４の絡げ側端部４ｂに絡げて半田付け
し、前記ボビン２にコア５、６を組み付けて磁路を形成
して構成したので、端子４の基板側端部４ａが線材３の
円滑な絡げ作業を妨げることがないことから、線材３の
絡げ作業に支障を来すことなくボビン２の幅を狭めるこ
とが可能となる。As described above, according to the invention of the winding component of the present invention, the trunk portion 2a and the terminal burying portions 2b, 2c are provided.
And the terminal 4 is embedded in the terminal embedding portions 2b and 2c of the bobbin 2 so that the binding end 4b projects from the side surface of the terminal embedding portions 2b and 2c. ,
A wire 3 is wound around the body 2 a of the bobbin 2, an end of the wire 3 is tied to a tangled end 4 b of the terminal 4 and soldered, and cores 5 and 6 are assembled to the bobbin 2 and magnetized. Since the path is formed, the substrate-side end 4a of the terminal 4 does not hinder the smooth tying work of the wire 3, so that the bobbin 2 is not hindered in the tying work of the wire 3. The width can be reduced.
【００２３】また、上記端子４の絡げ側端部４ｂより熱
伝導度の大きい放熱部材７を当該絡げ側端部４ｂに添設
して構成したので、線材３の端部を端子４の絡げ側端部
４ｂに半田付けする際に、半田の熱の一部が放熱部材７
に移動することから、半田の熱に起因する線材３の断線
を回避することができる。Further, since the heat radiating member 7 having a higher thermal conductivity than the binding side end 4b of the terminal 4 is attached to the binding side end 4b, the end of the wire 3 is connected to the terminal 4. When soldering to the binding side end 4b, part of the heat of the solder is
Therefore, disconnection of the wire 3 due to heat of the solder can be avoided.
【００２４】さらに、上記ボビン２の端子埋設部２ｂ、
２ｃの底面に基板落込部２ｄ、２ｅを当該ボビンの胴部
２ａの幅に合わせて形成して構成したので、薄型化を狙
って巻線部品１を基板１０に落とし込んで装着する際
に、ボビン２の胴部２ａと基板落込部２ｄ、２ｅのみを
落とし込むことにより、ボビン２の幅Ｗ１と同程度の幅
Ｗ２を有する細い基板１０を採用することができる。Further, the terminal burying portion 2b of the bobbin 2
Since the board drop portions 2d and 2e are formed on the bottom surface of the bobbin 2c so as to match the width of the body 2a of the bobbin, when the winding component 1 is dropped onto the board 10 and mounted in order to reduce the thickness, the bobbin By dropping only the body portion 2a and the substrate drop portions 2d and 2e, a thin substrate 10 having a width W2 substantially equal to the width W1 of the bobbin 2 can be employed.
【００２５】一方、本発明のうち巻線部品の製造方法の
発明によれば、上述した巻線部品１の製造方法であっ
て、線材３の端部を端子４の絡げ側端部４ｂに絡げて半
田付けする際に、前記線材３の端部を前記端子４の絡げ
側端部４ｂに絡げ、その後、半田液９の上方で前記端子
４が当該半田液９に対向するようにボビン２をその長さ
方向が当該半田液９の液面に直交する形で保持し、この
状態で、前記ボビン２を下降させて前記端子４の絡げ側
端部４ｂを前記半田液９に浸漬するようにして構成した
ので、端子４の絡げ側端部４ｂに絡げられた線材３の端
部の一部を半田液９の液面より上に残すことにより、半
田の熱に起因する線材３の断線を回避することができ
る。On the other hand, according to the invention of the method of manufacturing a winding component of the present invention, the method of manufacturing the winding component 1 described above, wherein the end of the wire 3 is connected to the binding-side end 4 b of the terminal 4. When entangled and soldered, the end of the wire 3 is entangled with the end 4b of the terminal 4 so that the terminal 4 faces the solder liquid 9 above the solder liquid 9. The bobbin 2 is held so that its length direction is perpendicular to the liquid surface of the solder liquid 9. In this state, the bobbin 2 is lowered to move the binding side end 4 b of the terminal 4 to the solder liquid 9. , So that a part of the end of the wire 3 entangled with the entanglement side end 4b of the terminal 4 is left above the level of the solder liquid 9 so as to reduce the heat of the solder. The disconnection of the wire 3 due to this can be avoided.
【図１】本発明に係る巻線部品の一実施形態を示す分解
斜視図である。FIG. 1 is an exploded perspective view showing one embodiment of a winding component according to the present invention.
【図２】図１に示す巻線部品を基板に落とし込んだ状態
を示す図であり、（ａ）はその側面図、（ｂ）はその正
面図である。FIGS. 2A and 2B are views showing a state where the winding component shown in FIG. 1 is dropped into a substrate, FIG. 2A is a side view thereof, and FIG. 2B is a front view thereof.
【図３】本発明に係る巻線部品の製造方法の一実施形態
を示す図であり、（ａ）は端子を半田液に浸漬する前の
状態を示す正面図、（ｂ）は（ａ）の右側面図、（ｃ）
は端子を半田液に浸漬した状態を示す拡大正面図であ
る。3A and 3B are views showing one embodiment of a method for manufacturing a wound component according to the present invention, wherein FIG. 3A is a front view showing a state before immersing a terminal in a solder liquid, and FIG. Right side view of (c)
FIG. 4 is an enlarged front view showing a state in which a terminal is immersed in a solder liquid.
１……巻線部品 ２……ボビン ２ａ……胴部 ２ｂ、２ｃ……端子埋設部 ２ｄ、２ｅ……基板落込部 ３……線材 ４……端子 ４ｂ……絡げ側端部 ５……コア（ロ形のコア） ６……コア（Ｉ形のコア） ７……放熱部材 ９……半田液 DESCRIPTION OF SYMBOLS 1 ... Winding part 2 ... Bobbin 2a ... Body part 2b, 2c ... Terminal embedding part 2d, 2e ... Board dropping part 3 ... Wire 4 ... Terminal 4b ... Tie-side end part 5 ... Core (b-shaped core) 6 core (I-shaped core) 7 heat dissipation member 9 solder liquid
フロントページの続き (72)発明者 重永 勉 東京都港区新橋５丁目36番11号 富士電気 化学株式会社内Continued on the front page (72) Inventor Tsutomu Shigenaga Inside Fuji Electric Chemical Co., Ltd. 5-36-11 Shimbashi, Minato-ku, Tokyo
Claims (4)
ｃ）とが連設されたボビン（２）を有し、 このボビンの端子埋設部に端子（４）をその絡げ側端部
（４ｂ）が当該端子埋設部の側面から突出するように埋
設し、 前記ボビンの胴部に線材（３）を巻き、 この線材の端部を前記端子の絡げ側端部に絡げて半田付
けし、 前記ボビンにコア（５、６）を組み付けて磁路を形成し
たことを特徴とする巻線部品。1. A body (2a) and a terminal burying part (2b, 2).
c) and a bobbin (2) connected continuously, and a terminal (4) is buried in a terminal buried portion of the bobbin such that a binding side end (4b) protrudes from a side surface of the terminal buried portion. Then, a wire (3) is wound around the body of the bobbin, the end of the wire is tied to the tang side end of the terminal and soldered, and cores (5, 6) are assembled to the bobbin and magnetized. A winding component having a path formed.
伝導度の大きい放熱部材（７）を当該絡げ側端部に添設
したことを特徴とする請求項１に記載の巻線部品。2. The terminal according to claim 1, wherein a heat radiating member having a higher thermal conductivity than the binding end of the terminal is attached to the binding end. Winding parts.
ｃ）の底面に基板落込部（２ｄ、２ｅ）を当該ボビンの
胴部（２ａ）の幅に合わせて形成したことを特徴とする
請求項１または請求項２に記載の巻線部品。3. A terminal embedded portion (2b, 2b) of a bobbin (2).
The winding part according to claim 1 or 2, wherein the board recesses (2d, 2e) are formed on the bottom surface of (c) so as to match the width of the body (2a) of the bobbin.
記載の巻線部品（１）の製造方法であって、 線材（３）の端部を端子（４）の絡げ側端部（４ｂ）に
絡げて半田付けする際に、 前記線材の端部を前記端子の絡げ側端部に絡げ、 その後、半田液（９）の上方で前記端子が当該半田液に
対向するようにボビン（２）をその長さ方向が当該半田
液の液面に直交する形で保持し、 この状態で、前記ボビンを下降させて前記端子の絡げ側
端部を前記半田液に浸漬するようにしたことを特徴とす
る巻線部品の製造方法。4. The method for manufacturing a winding component (1) according to claim 1, wherein an end of the wire (3) is connected to an end of a terminal (4) on a binding side. When entangled with (4b) and soldered, the end of the wire is entangled with the end of the entanglement side of the terminal, and then the terminal faces the solder liquid above the solder liquid (9) As described above, the bobbin (2) is held so that its length direction is orthogonal to the liquid surface of the solder liquid. In this state, the bobbin is lowered and the tied-side end of the terminal is immersed in the solder liquid. A method for manufacturing a winding component, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13158498A JP3368826B2 (en) | 1998-05-14 | 1998-05-14 | Winding component and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13158498A JP3368826B2 (en) | 1998-05-14 | 1998-05-14 | Winding component and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11329864A true JPH11329864A (en) | 1999-11-30 |
| JP3368826B2 JP3368826B2 (en) | 2003-01-20 |
Family
ID=15061482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13158498A Expired - Fee Related JP3368826B2 (en) | 1998-05-14 | 1998-05-14 | Winding component and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3368826B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7345567B2 (en) * | 2004-12-02 | 2008-03-18 | Fdk Corporation | Inverter transformer |
| JP2008166302A (en) * | 2006-12-26 | 2008-07-17 | Fdk Corp | Thin transformer |
| JP2010093107A (en) * | 2008-10-09 | 2010-04-22 | Tdk Corp | Lateral type coil component |
| JP2010153659A (en) * | 2008-12-25 | 2010-07-08 | Tdk Corp | Transformer and manufacturing method thereof |
| KR101177061B1 (en) | 2011-05-20 | 2012-08-24 | (주)에스피에스 | Transformer for adapter |
-
1998
- 1998-05-14 JP JP13158498A patent/JP3368826B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7345567B2 (en) * | 2004-12-02 | 2008-03-18 | Fdk Corporation | Inverter transformer |
| JP2008166302A (en) * | 2006-12-26 | 2008-07-17 | Fdk Corp | Thin transformer |
| JP2010093107A (en) * | 2008-10-09 | 2010-04-22 | Tdk Corp | Lateral type coil component |
| JP4716054B2 (en) * | 2008-10-09 | 2011-07-06 | Ｔｄｋ株式会社 | Horizontal coil parts |
| JP2010153659A (en) * | 2008-12-25 | 2010-07-08 | Tdk Corp | Transformer and manufacturing method thereof |
| KR101177061B1 (en) | 2011-05-20 | 2012-08-24 | (주)에스피에스 | Transformer for adapter |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3368826B2 (en) | 2003-01-20 |
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