JPH11329639A - Mounting method for controller - Google Patents
Mounting method for controllerInfo
- Publication number
- JPH11329639A JPH11329639A JP10140791A JP14079198A JPH11329639A JP H11329639 A JPH11329639 A JP H11329639A JP 10140791 A JP10140791 A JP 10140791A JP 14079198 A JP14079198 A JP 14079198A JP H11329639 A JPH11329639 A JP H11329639A
- Authority
- JP
- Japan
- Prior art keywords
- communication
- connector
- components
- board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はコントローラのプリ
ント基板実装方法に係り、特に複数のプリント基板から
なる小型コントローラのプリント基板実装方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a printed circuit board on a controller, and more particularly, to a method for mounting a printed circuit board on a small controller including a plurality of printed circuit boards.
【０００２】[0002]
【従来の技術】従来、コントローラ，汎用計算機などの
プリント基板実装においては、バックボードと呼ばれる
１枚の基板にシステムバスを設け、このバックボードに
対して垂直にメインＣＰＵ基板や拡張基板を複数枚実装
することにより種々のネットワークインタフェース（イ
ーサネットやＦＤＤＩなど）や、アナログ・デジタルＩ
／Ｏをサポートしてシステムの拡張性を図る形態が主流
である。また、ＰＣ，ワークステーション（ＷＳ）のプ
リント基板実装においては、１枚の大きなメイン基板上
に標準でサポートする通信機能を全て実装していた。2. Description of the Related Art Conventionally, in mounting a printed circuit board such as a controller or a general-purpose computer, a system bus is provided on one board called a backboard, and a plurality of main CPU boards and expansion boards are provided perpendicularly to the backboard. Various network interfaces (Ethernet, FDDI, etc.) and analog / digital I
The mainstream is a form that supports / O and expands the system. In the case of mounting a printed circuit board on a PC or a workstation (WS), all the communication functions that are supported as standard are mounted on one large main board.
【０００３】[0003]
【発明が解決しようとする課題】従来の、コントロー
ラ，汎用計算機などのプリント基板実装におけるバック
ボードを用いる方式では、バックボードに実装する全て
の基板がバックボード上のシステムバスに接続するため
のシステムバスコネクタを持たねばならない。システム
バスコネクタは通常１個又は２個であり、バックボード
に接続するため、耐振動性や接触性の観点からリード挿
入タイプの部品を使用することが多い。しかし、リード
挿入タイプのコネクタは実装面積を多くとるため、基板
サイズが大きくならざるを得ないというデメリットがあ
る。また、高密度実装で主流となっている面付部品とリ
ード挿入部品が混在した場合、製造ラインでの工程は面
付ラインを通った後、挿入部品ラインを通さなくてはな
らないため、製作工程が複雑になっていた。また、Ｐ
Ｃ，ＷＳのプリント基板実装において採用されているワ
ンボード方式では、標準でサポートする通信機能をすべ
て１枚基板上に実装することから、基板サイズが大きく
ならざるをえないうえ、通信用のコネクタは一般的にリ
ード挿入部品であり、面付部品とリード挿入部品の混在
は避けられない。In the conventional system using a back board for mounting a printed circuit board such as a controller or a general-purpose computer, a system in which all the boards mounted on the back board are connected to a system bus on the back board. Must have a bus connector. Usually, one or two system bus connectors are used. In order to connect to the backboard, a lead insertion type component is often used from the viewpoint of vibration resistance and contact properties. However, since the lead insertion type connector requires a large mounting area, there is a demerit that the board size must be increased. In addition, when surface-mounted components and lead insertion components, which are the mainstream in high-density mounting, are mixed, the production line process must pass through the surface-mounting line and then through the insertion component line. Was complicated. Also, P
In the one-board method adopted for C and WS printed circuit board mounting, all of the standard supported communication functions are mounted on one board, so the board size must be large and the communication connector must be used. Are generally lead insertion components, and it is inevitable that surface-mounted components and lead insertion components coexist.
【０００４】[0004]
【課題を解決するための手段】本発明は、上記課題を解
決するために、ＣＰＵ機能と通信機能に関わる回路は全
て表面実装部品のみを搭載した基板にまとめ、通信用の
挿入型コネクタを含む基板は挿入部品のみを搭載した基
板にまとめ、これらの基板間を、表面実装部品のみを搭
載した基板の側は表面実装型コネクタ，挿入部品のみを
搭載した基板側は挿入型のコネクタで互いに接続する。
これら基板間のインタフェースの分離は、通信機能の回
路と通信用のコネクタとの間で分け、コネクタにはイン
ピーダンス整合をとるための手段を付加する。通信機能
の回路と通信用のコネクタとの間の信号線は１対１接続
であり、コネクタ部分でインピーダンス整合をとること
により、信号線を途中で分離した際にバスのように複雑
な反射が発生して波形が乱れる現象が発生しないためで
ある。このように各々の基板を表面実装部品のみを搭載
した基板と、挿入部品のみを搭載した基板に分けること
により、基板サイズの縮小化を実現するとともに、基板
の製造工程は、表面実装部品のみを搭載した基板は表面
実装プロセスのみ、挿入部品のみを搭載した基板は挿入
プロセスのみとすることができるため、製造工数低減を
実現できる。According to the present invention, in order to solve the above-mentioned problems, all circuits relating to the CPU function and the communication function are integrated on a board on which only surface mount components are mounted, and include an insertion connector for communication. The boards are assembled on a board with only insert components, and these boards are connected to each other with a surface-mount connector on the side of the board with only surface-mount components and an insert-type connector on the board with only insert components. I do.
Separation of the interface between these boards is divided between a circuit having a communication function and a connector for communication, and a means for impedance matching is added to the connector. The signal line between the communication function circuit and the communication connector is connected one-to-one, and by performing impedance matching at the connector part, a complicated reflection like a bus occurs when the signal line is separated in the middle. This is because the phenomenon that the generated waveform is disturbed does not occur. In this way, by dividing each board into a board with only surface-mounted components and a board with only inserted components, it is possible to reduce the size of the board, and the board manufacturing process requires only surface-mounted components. Since only the surface mounting process can be performed on the mounted substrate, and only the insertion process can be performed on the substrate mounted with only the inserted components, the number of manufacturing steps can be reduced.
【０００５】[0005]
【発明の実施の形態】以下、本発明の実施例を図面を用
いて説明する。Embodiments of the present invention will be described below with reference to the drawings.
【０００６】図１に、本発明を適用する小型コントロー
ラの実装構成を示す。このコントローラは電源モジュー
ル１０８と、電源モジュール１０８からの電源を各基板
に供給するためのバックボード１０９と、バックボード
１０９から挿入型コネクタ１１０を介して電源を受け、
他の基板に電源を給電し、挿入型の各種通信用コネクタ
１０２を搭載した挿入部品のみからなる基板１０１と、
ＣＰＵ機能，通信機能を備えた表面実装タイプのＩＣを
搭載する表面実装部品のみからなる基板105と、これら
の挿入部品のみからなる基板１０１と表面実装部品のみ
からなる基板１０５との間を接続する、基板接続用の挿
入型コネクタ１０３，１０４と基板接続用の表面実装コ
ネクタ１０６，１０７からなる。FIG. 1 shows a mounting configuration of a small controller to which the present invention is applied. The controller receives a power supply module 108, a back board 109 for supplying power from the power supply module 108 to each substrate, and a power supply from the back board 109 via an insertion connector 110.
A board 101 composed of only insert components on which power is supplied to other boards and on which various insert-type communication connectors 102 are mounted;
A connection is made between a substrate 105 composed of only surface-mounted components on which a surface-mounted type IC having a CPU function and a communication function is mounted, and a substrate 101 composed of only these inserted components and a substrate 105 composed of only surface-mounted components. And insertion-type connectors 103 and 104 for board connection and surface-mount connectors 106 and 107 for board connection.
【０００７】図２に、挿入部品のみからなる基板１０１
の詳細実装について示す。本基板には、挿入型の通信用
コネクタ１０２とバックボード１０９からの電源受電用
の挿入型コネクタ１１０を搭載し、従来ワンボード方式
の実装では１枚のメイン基板上に面付部品と共に混在し
ていた挿入部品をＣＰＵ機能を備えた基板から独立さ
せ、挿入部品のみからなる基板１０１のみに実装してい
る。挿入型コネクタ104はバックボード１０９からの電
源をＣＰＵ基板１０５に給電するためのコネクタであ
る。挿入型コネクタ１０３はＣＰＵ基板１０５とこの挿
入部品のみからなる基板１０１の間で通信制御・データ
信号を受け渡すためのコネクタである。挿入型コネクタ
１０３，１０４には、通信用コネクタ１０２からの受信
信号がＣＰＵ基板１０５へわたる際に、コネクタでの反
射によって受信信号波形が乱れることを防ぐためにイン
ピーダンスの整合をとるための整合手段としてインピー
ダンスマッチング抵抗を付加している。ただし、通信イ
ンタフェースの種類によっては、インピーダンス整合を
考慮しなくてもよいものもあるため、受信用の各信号線
毎にインピーダンス整合をとるか否かを選択するように
なっている。通信用の回路である通信回路２１，通信回
路２２，通信回路２３は全て挿入部品のみからなる。FIG. 2 shows a substrate 101 composed of only insert components.
Here is a detailed implementation of. On this board, an insertion type communication connector 102 and an insertion type connector 110 for receiving power from the back board 109 are mounted. In a conventional one-board type mounting, the components are mixed together with surface-mounted components on one main board. The inserted component is separated from the board having the CPU function, and is mounted only on the board 101 including only the inserted component. The insertion connector 104 is a connector for supplying power from the back board 109 to the CPU board 105. The insert connector 103 is a connector for transferring communication control and data signals between the CPU board 105 and the board 101 including only the insert components. The insertion-type connectors 103 and 104 serve as matching means for matching impedance to prevent the reception signal waveform from being disturbed by reflection at the connector when the reception signal from the communication connector 102 is transmitted to the CPU board 105. An impedance matching resistor is added. However, depending on the type of the communication interface, impedance matching need not be considered, and therefore, whether or not to perform impedance matching is selected for each signal line for reception. The communication circuits 21, 22, and 23, which are communication circuits, are all composed of only inserted components.
【０００８】面付部品を他の基板に移したことにより、
挿入部品のみからなる基板１０１に搭載された部品は全
て挿入部品から構成されるため、この挿入部品のみから
なる基板１０１の製造工程は、挿入プロセスのみを通せ
ばよいため、挿入・面付部品混在基板の場合と比べて製
造工数が約半分となる。[0008] By transferring the imposed component to another substrate,
Since all components mounted on the board 101 composed of only inserted components are composed of inserted components, the manufacturing process of the board 101 composed of only inserted components only needs to pass through the insertion process. The number of manufacturing steps is reduced to about half as compared with the case of a substrate.
【０００９】図３にＣＰＵ機能を備えた表面実装部品の
みからなる基板１０５の詳細実装について示す。本基板
はＣＰＵ機能と通信機能を有する各種の表面実装のＩＣ
を搭載し、挿入部品のみからなる基板１０１との接続用
に表面実装コネクタ１０６，１０７を用い、全て表面実
装部品からなる。表面実装コネクタ１０６は挿入型コネ
クタ１０４と接続し、バックボード１０９からの電源を
うけるためのコネクタである。表面実装コネクタ１０７
は挿入型コネクタ１０３と接続し、挿入部品のみからな
る基板１０１へ通信制御・データ信号を受け渡すための
コネクタである。表面実装コネクタ１０６，１０７に
は、通信機能をもつＩＣ／ＬＳＩからの送信信号が基板
１０１へわたる際に、コネクタでの反射によって送信信
号波形が乱れることを防ぐためにインピーダンスの整合
をとるための整合手段を付加している。通信インタフェ
ースによっては、インピーダンス整合を考慮しなくても
よいものもあるため、挿入部品のみからなる基板１０１
に搭載される挿入型コネクタ１０３，１０４の受信用信
号線に設けた整合手段と同様に、送信用の各信号線毎に
インピーダンス整合をとるかとらないかが選択できるよ
うになっている。CPU機能をもつＬＳＩ、メモリ３１，
３２，３３、通信機能を持つ通信回路１，２，３は全て
表面実装部品からなる。表面実装部品のみからなる基板
１０５では、通信用コネクタ１０２を分離し、表面実装
用のＩＣのみを搭載したことにより、全て表面実装部品
からなっているため、製造工程は面付プロセスのみを通
せばよく、挿入・面付部品混在の製造工程と比べて工数
が約半分となる。FIG. 3 shows a detailed mounting of the substrate 105 consisting only of surface mounting components having a CPU function. This board is a variety of surface mount ICs with CPU and communication functions
Are mounted, and the surface mount connectors 106 and 107 are used for connection to the board 101 composed of only insert components, and all of the components are surface mount components. The surface mount connector 106 is a connector that is connected to the insertion type connector 104 and receives power from the back board 109. Surface mount connector 107
Is a connector that is connected to the insertion type connector 103 and transfers communication control and data signals to the board 101 including only insertion parts. The surface mount connectors 106 and 107 have matching for impedance matching in order to prevent a transmission signal waveform from being disturbed by reflection at the connector when a transmission signal from an IC / LSI having a communication function is transmitted to the substrate 101. Means are added. Some communication interfaces do not need to consider impedance matching.
As with the matching means provided for the signal lines for reception of the insertion connectors 103 and 104 mounted on the communication device, it is possible to select whether or not to perform impedance matching for each signal line for transmission. LSI with CPU function, memory 31,
The communication circuits 32, 33 and the communication circuits 1, 2, 3 having a communication function are all made of surface mount components. Since the communication connector 102 is separated from the substrate 105 made of only surface-mounted components and only the surface-mounting IC is mounted, all the components are made of surface-mounted components. In many cases, the man-hour is about half as compared with the manufacturing process in which the insertion and the surface-mounted parts are mixed.
【００１０】[0010]
【発明の効果】以上、本発明によれば、コントローラの
プリント基板実装方法において、送受信の波形を乱すこ
と無く表面実装部品のみからなる基板と前記挿入実装部
品のみからなる基板に分割してプリント基板を実装する
ことが可能となり、小型で製造工数の低減化を図ったプ
リント基板を実装することができる。As described above, according to the present invention, in the method of mounting a printed board on a controller, the printed board is divided into a board consisting only of the surface mounted components and a board consisting only of the inserted mounting components without disturbing the transmission / reception waveform. Can be mounted, and a small-sized printed circuit board with reduced man-hours can be mounted.
【図１】本発明のコントローラの構成を示す図である。FIG. 1 is a diagram showing a configuration of a controller of the present invention.
【図２】通信用コネクタを含む挿入部品のみからなる基
板の実装構成を示す図である。FIG. 2 is a diagram illustrating a mounting configuration of a board including only insertion components including a communication connector.
【図３】表面実装部品のみからなるＣＰＵ基板の実装構
成を示す図である。FIG. 3 is a diagram illustrating a mounting configuration of a CPU board including only surface mount components.
１０１…挿入部品のみからなる基板、１０２…通信用コ
ネクタ、１０３，104…挿入型コネクタ、１０５…表面
実装部品のみからなる基板、１０６，１０７…表面実装
コネクタ。101: a board composed of only insert components, 102: a connector for communication, 103, 104: an insert type connector, 105: a board composed of only surface mount components, 106, 107: a surface mount connector.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 白戸 健史 茨城県日立市大みか町五丁目２番１号 株 式会社日立製作所大みか工場内 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Takeshi Shirato 5-2-1 Omika-cho, Hitachi City, Ibaraki Prefecture Inside the Hitachi, Ltd. Omika Plant
Claims (1)
ーラにおいて、 前記ＣＰＵ機能と、通信機能に関わる表面実装部品を含
む表面実装部品のみからなる基板と、通信用の挿入型コ
ネクタを含む挿入実装部品のみからなる基板とを、前記
表面実装部品のみからなる基板側に設けた表面実装型の
コネクタと、前記挿入実装部品のみからなる基板側に設
けた挿入型のコネクタとで接続し、前記表面実装部品の
みからなる基板と前記挿入実装部品のみからなる基板と
の間の接続は、前記通信機能に関わる回路と前記通信用
の挿入型コネクタとの間で分けられ、前記表面実装型の
コネクタと前記挿入型のコネクタは、信号線毎に選択的
にインピーダンスの整合をとるための整合手段を備える
ことを特徴とするコントローラの実装方法。1. A controller having a CPU function and a communication function, wherein: a board made of only a surface mounting component including a surface mounting component relating to the CPU function and the communication function; and an insertion mounting component including an insertion connector for communication. A surface-mounting connector provided on the substrate side comprising only the surface-mounted components, and an insertion-type connector provided on the substrate side comprising only the insertion-mounting components. The connection between the board consisting only of the component and the board consisting only of the insert mounting component is divided between the circuit related to the communication function and the insertion connector for communication, and the surface mount type connector and the A method of mounting a controller, wherein the insertion type connector includes a matching unit for selectively matching impedance for each signal line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10140791A JPH11329639A (en) | 1998-05-22 | 1998-05-22 | Mounting method for controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10140791A JPH11329639A (en) | 1998-05-22 | 1998-05-22 | Mounting method for controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11329639A true JPH11329639A (en) | 1999-11-30 |
Family
ID=15276835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10140791A Pending JPH11329639A (en) | 1998-05-22 | 1998-05-22 | Mounting method for controller |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11329639A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6950304B2 (en) | 2002-06-14 | 2005-09-27 | Hitachi, Ltd. | Disk array device |
| JP2006323574A (en) * | 2005-05-18 | 2006-11-30 | Hitachi Ltd | Disk array system |
| GB2458809A (en) * | 2008-04-01 | 2009-10-07 | Thales Sa | Computer with boards that attach to the edge of the backplane |
-
1998
- 1998-05-22 JP JP10140791A patent/JPH11329639A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6950304B2 (en) | 2002-06-14 | 2005-09-27 | Hitachi, Ltd. | Disk array device |
| US7120016B2 (en) | 2002-06-14 | 2006-10-10 | Hitachi, Ltd. | Disk array device |
| US7558056B2 (en) | 2002-06-14 | 2009-07-07 | Hitachi, Ltd. | Disk array device |
| US7876557B2 (en) | 2002-06-14 | 2011-01-25 | Hitachi, Ltd. | Disk array device |
| JP2006323574A (en) * | 2005-05-18 | 2006-11-30 | Hitachi Ltd | Disk array system |
| GB2458809A (en) * | 2008-04-01 | 2009-10-07 | Thales Sa | Computer with boards that attach to the edge of the backplane |
| GB2458809B (en) * | 2008-04-01 | 2012-10-31 | Thales Sa | Computer with simplified layout, designed for aviation |
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