JPH11328339A - Communication module - Google Patents
Communication moduleInfo
- Publication number
- JPH11328339A JPH11328339A JP10136264A JP13626498A JPH11328339A JP H11328339 A JPH11328339 A JP H11328339A JP 10136264 A JP10136264 A JP 10136264A JP 13626498 A JP13626498 A JP 13626498A JP H11328339 A JPH11328339 A JP H11328339A
- Authority
- JP
- Japan
- Prior art keywords
- slit
- coil
- communication module
- circuit board
- bent portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＣＰＵ、メモリー、
データー送受信部を集積回路に内蔵し、アンテナコイル
により各種のデーターの授受を行う、主に通信ＩＣカー
ド用の通信モジュールに関する。The present invention relates to a CPU, a memory,
The present invention relates to a communication module mainly for a communication IC card, in which a data transmission / reception unit is built in an integrated circuit and various kinds of data are transmitted and received by an antenna coil.
【０００２】[0002]
【従来の技術】通信ＩＣカードに用いられる通信モジュ
ールはＣＰＵ、メモリー、データー送受信部を集積回路
に内蔵したＩＣチップと、ＩＣチップ及び他の電装部品
を実装するプリント基板、電磁波として電源を受け取り
且つデーターの送受信を行うアンテナコイルよりなる。
近年通信ＩＣカードの電磁波に短波帯域が使用されるこ
とにより、アンテナのコイル巻き数が２〜１０と少なく
なった。そのためアンテナコイルとしてプリントコイル
が使用される事となり、プリント基板とコイルの一体化
がなされてきた。この一体化された従来の通信モジュー
ルは図５に示される形状をしている。従来の通信モジュ
ールは、アンテナコイルを構成するコイルパターン１３
の形成されたフレキシブル回路基板１０上にＩＣチップ
３、共振用コンデンサー４が実装され、絶縁封止剤１１
にて封止されている。2. Description of the Related Art A communication module used in a communication IC card includes an IC chip having a CPU, a memory, and a data transmission / reception unit built in an integrated circuit, a printed circuit board on which the IC chip and other electric parts are mounted, a power supply for receiving electromagnetic waves, and the like. It consists of an antenna coil for transmitting and receiving data.
2. Description of the Related Art In recent years, the use of a short-wave band for an electromagnetic wave of a communication IC card has reduced the number of coil turns of an antenna to 2 to 10. Therefore, a printed coil is used as the antenna coil, and the printed board and the coil have been integrated. This integrated conventional communication module has the shape shown in FIG. A conventional communication module includes a coil pattern 13 that forms an antenna coil.
The IC chip 3 and the resonance capacitor 4 are mounted on the flexible circuit board 10 on which
Sealed.
【０００３】[0003]
【発明が解決しようとする課題】高効率のアンテナ機能
を有するアンテナコイルは、コイルで囲まれた内面積が
より広く真円である事が理想とされ、プリント基板１０
はコイルパターン１３の内外にパターンの形成されない
部分１２（斜線部分）を持つ不経済な物であった。更に
通信モジュールを１枚のフレキシブル回路基板に複数個
分形成して、後で単個に分割する製造工程を考えると、
１枚のフレキシブル回路基板が大型な物となり、また電
装部品の実装に於ける搬送距離が長くなって効率が悪
く、コストアップの原因の１つとなっていた。It is ideal that an antenna coil having a highly efficient antenna function has a larger inner area surrounded by the coil and a perfect circle.
Is an uneconomical material having a portion 12 (shaded portion) where no pattern is formed inside and outside the coil pattern 13. Further, considering a manufacturing process in which a plurality of communication modules are formed on one flexible circuit board and then divided into single units,
One flexible circuit board has a large size, and the transport distance in mounting the electrical components has been long, resulting in poor efficiency and one of the causes of cost increase.
【０００４】本発明の目的は、より経済的なコイル構造
により、低コストな通信モジュールを提供することであ
る。An object of the present invention is to provide a low-cost communication module with a more economical coil structure.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
の本発明の通信カード用モジュールは、ほぼ長方形のフ
レキシブル回路基板と、基板の略中央部に長辺に平行な
スリットと、前記スリットを取り囲むように形成したコ
イルと、スリット両側のコイル形成部を略環状に広げて
環状のコイル体を形成するための折曲部とを有する。該
コイル体はスリットの端部を頂点にして、該スリットの
両側に形成したコイルを２方向に広げるための第１折曲
部と、該コイル形成部を平坦に保つための第２折曲部を
有して、該コイル体は略亀甲形状に形成される。第１折
曲部と第２折曲部は山折り側にコイル線が位置するの
で、コイル線間の短絡が無い。電装部品はフレキシブル
回路基板のスリットの延長方向にを配置実装される。To achieve the above object, a communication card module according to the present invention comprises a substantially rectangular flexible circuit board, a slit substantially parallel to a long side at a substantially central portion of the board, and the slit. It has a coil formed so as to surround it, and a bent portion for forming a circular coil body by expanding the coil forming portions on both sides of the slit in a substantially annular shape. The coil body has a first bent portion for extending the coil formed on both sides of the slit in two directions, and a second bent portion for keeping the coil forming portion flat, with the end of the slit as the apex. And the coil body is formed in a substantially tortoiseshell shape. Since the coil wire is located on the mountain-fold side of the first bent portion and the second bent portion, there is no short circuit between the coil wires. The electrical components are arranged and mounted in the extending direction of the slit of the flexible circuit board.
【０００６】[0006]
【発明の実施の形態】以下本発明の実施の形態を図面に
基づいて説明する。なお、図５に示した従来技術と同一
構成には同一番号を付けてその説明を省略する。図１は
亀甲形状に形成した本発明の通信モジュールを示す平面
図、図２は亀甲形状に折り曲げる前の通信モジュールを
示す平面図、図３は本発明よりなる通信モジュールの為
の集合フレキシブル回路基板の平面図である。図におい
てアンテナコイル１の形成されたフレキシブル回路基板
２上にＩＣチップ３、共振用コンデンサー４が実装さ
れ、アンテナコイル１の各端末と電気結合がなされてい
る。６は後述するスリット５の端部を頂点にして折り曲
げた第１折曲部であり、７は第２折曲部である。Embodiments of the present invention will be described below with reference to the drawings. The same components as those of the prior art shown in FIG. 5 are denoted by the same reference numerals, and description thereof is omitted. FIG. 1 is a plan view showing a communication module of the present invention formed in a turtle shape, FIG. 2 is a plan view showing a communication module before being bent into a turtle shape, and FIG. 3 is a collective flexible circuit board for a communication module according to the present invention. FIG. In the figure, an IC chip 3 and a resonance capacitor 4 are mounted on a flexible circuit board 2 on which an antenna coil 1 is formed, and are electrically coupled to each terminal of the antenna coil 1. Reference numeral 6 denotes a first bent portion which is bent with an end of a slit 5 described later as an apex, and 7 denotes a second bent portion.
【０００７】次に、本実施形態に示した通信モジュール
の製造方法を示す。フレキシブル回路基板２は、図２に
示される如く長方形を成し、且つフレキシブル回路基板
２の略中央部には、フレキシブル回路基板２の長辺に平
行なスリット５が設けられ、スリット５を取り囲むよう
にコイルが形成されている。更にフレキシブル回路基板
２は、スリット５の延長方向に、ＩＣチップ３を接続す
るためのパターンを有し、該パターンにはＩＣチップ３
と共振用コンデンサー４が実装される。次にスリット５
の両端部を頂点にしてフレキシブル回路基板２のスリッ
ト両側コイル形成部９を４箇所の第１屈曲指示線６ａに
沿って折り曲げる。この状態ではコイル形成部９が湾曲
した状態になる。次に、該コイル形成部分９を平坦に保
つため４箇所の第２屈曲指示線７ａに沿って折り曲げる
ことにより、該コイル形成部分９を図１に示した略亀甲
形状に形成する。この時、第１折曲部６と第２折曲部７
は山折り側にコイル線が位置するので、コイル線間の短
絡は発生しない。Next, a method of manufacturing the communication module shown in this embodiment will be described. The flexible circuit board 2 has a rectangular shape as shown in FIG. 2, and a slit 5 parallel to the long side of the flexible circuit board 2 is provided substantially in the center of the flexible circuit board 2 so as to surround the slit 5. The coil is formed in the. Further, the flexible circuit board 2 has a pattern for connecting the IC chip 3 in the extension direction of the slit 5, and the pattern includes the IC chip 3
And the resonance capacitor 4 are mounted. Next, slit 5
The coil forming portions 9 on both sides of the slit of the flexible circuit board 2 are bent along the four first bending instruction lines 6a with the both end portions as vertices. In this state, the coil forming section 9 is in a curved state. Next, the coil forming portion 9 is bent along the four second bending instruction lines 7a in order to keep the coil forming portion 9 flat, thereby forming the coil forming portion 9 into a substantially tortoiseshell shape shown in FIG. At this time, the first bent portion 6 and the second bent portion 7
Since the coil wire is located on the mountain fold side, no short circuit occurs between the coil wires.
【０００８】折り曲げる前のフレキシブル回路基板２は
図２に示される長方形のフレキシブル回路基板２で有る
ため、同面積のフレキシブル回路基板素材からの取り個
数が従来のコイルに対し５倍から１０倍となり材料コス
トの削減に寄与する。又、図３に示される多数個の集合
フレキシブル回路基板８に対し電装部品の実装を行い、
その後のスリット付け、単個分離により図２に示した単
個の形状となし、その後前述の折り曲げ処理により完成
体とする。これにより、電装部品の実装作業速度も向上
でき実装コストの削減に寄与する。又、他の実施例とし
て第１、第２の折曲指示線のスリットに対する角度及び
位置を変更することにより、ＩＳＯ７８１１規格のカー
ド形状への使用に合わせた図５に示すような長方形状と
することも可能である。Since the flexible circuit board 2 before bending is a rectangular flexible circuit board 2 as shown in FIG. 2, the number of pieces taken from a flexible circuit board material having the same area is 5 to 10 times that of a conventional coil. Contribute to cost reduction. Also, electrical components are mounted on a large number of flexible circuit boards 8 shown in FIG.
Thereafter, slitting and separation are performed to form the single shape shown in FIG. 2, and then the completed bending process is performed. As a result, the mounting work speed of the electrical components can be improved, which contributes to a reduction in mounting cost. Further, as another embodiment, by changing the angles and positions of the first and second bending indicating lines with respect to the slit, a rectangular shape as shown in FIG. 5 adapted to use in a card shape conforming to the ISO7811 standard is obtained. It is also possible.
【０００９】[0009]
【発明の効果】以上、本発明に依れば、同面積のフレキ
シブル回路基板素材からの取り個数が従来のコイルに対
し５倍から１０倍に増えるため、材料コストの大幅な削
減となるのみならず、コイルの形成された基板上への電
装部品の実装工程に於いて治具セット、搬送、保管等の
作業面積が小さくなる事により実装工程の合理化に寄与
し、通信ＩＣモジュールのコスト削減になる。As described above, according to the present invention, the number of pieces taken from a flexible circuit board material having the same area is increased from 5 times to 10 times that of a conventional coil. In the process of mounting electrical components on the board on which the coil is formed, the work area for jig setting, transport, storage, etc. is reduced, contributing to streamlining of the mounting process and reducing the cost of communication IC modules. Become.
【図１】亀甲形状に形成した本発明の通信モジュールを
示す平面図である。FIG. 1 is a plan view showing a communication module of the present invention formed in a tortoiseshell shape.
【図２】亀甲形状に折り曲げる前の通信モジュールを示
す平面図である。FIG. 2 is a plan view showing the communication module before being bent into a tortoiseshell shape.
【図３】本発明よりなる通信モジュールの為の集合フレ
キシブル回路基板の平面図である。FIG. 3 is a plan view of a collective flexible circuit board for a communication module according to the present invention.
【図４】本発明よりなる通信モジュールの他の実施形態
の平面図である。FIG. 4 is a plan view of another embodiment of the communication module according to the present invention.
【図５】従来形状の通信モジュールの平面図である。FIG. 5 is a plan view of a communication module having a conventional shape.
１ アンテナコイル ２ フレキシブル回路基板 ３ ＩＣチップ ４ 共振用コンデンサー ５ スリット ６ 第１屈曲指示線 ７ 第２屈曲指示線 ８ 集合フレキシブル回路基板 ９ スリット側コイル形成部分 DESCRIPTION OF SYMBOLS 1 Antenna coil 2 Flexible circuit board 3 IC chip 4 Resonance capacitor 5 Slit 6 First bending instruction line 7 Second bending instruction line 8 Collective flexible circuit board 9 Slit side coil forming part
Claims (4)
板上に電装部品を実装して成る通信カード用モジュール
に於いて、ほぼ長方形のフレキシブル回路基板と、基板
の略中央部に長辺に平行なスリットと、前記スリットを
取り囲むように形成したコイルと、スリット両側のコイ
ル形成部を略環状に広げて環状のコイル体を形成するた
めの折曲部とを有することを特徴とする通信モジュー
ル。1. A communication card module in which electrical components are mounted on a flexible circuit board on which a coil is formed, a substantially rectangular flexible circuit board, and a slit parallel to a long side substantially at a center of the board. And a coil formed so as to surround the slit, and a bent portion for forming a circular coil body by expanding a coil forming portion on both sides of the slit in a substantially annular shape.
該スリットの両側に形成したコイル形成部を２方向に広
げるための第１折曲部と、該コイル形成部を平坦に保つ
ための第２折曲部を有し、該コイル形成部を略亀甲形状
に形成したことを特徴とする請求項１記載の通信モジュ
ール。2. The bent portion has the end of the slit as a vertex,
It has a first bent portion for expanding the coil forming portion formed on both sides of the slit in two directions, and a second bent portion for keeping the coil forming portion flat. The communication module according to claim 1, wherein the communication module is formed in a shape.
イル線が位置することを特徴とする請求項２記載の通信
モジュール。3. The communication module according to claim 2, wherein the first bent portion and the second bent portion have a coil wire located on the mountain fold side.
方向に配置したことを特徴とする請求項１記載の通信モ
ジュール。4. The communication module according to claim 1, wherein the electrical component is arranged in a direction in which the slit of the circuit board extends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13626498A JP3819147B2 (en) | 1998-05-19 | 1998-05-19 | Communication module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13626498A JP3819147B2 (en) | 1998-05-19 | 1998-05-19 | Communication module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11328339A true JPH11328339A (en) | 1999-11-30 |
| JP3819147B2 JP3819147B2 (en) | 2006-09-06 |
Family
ID=15171133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13626498A Expired - Fee Related JP3819147B2 (en) | 1998-05-19 | 1998-05-19 | Communication module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3819147B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003085516A (en) * | 2001-09-07 | 2003-03-20 | Nec Tokin Corp | Non-contact communication medium, and manufacturing method for same |
| JP2004527864A (en) * | 2001-05-31 | 2004-09-09 | ラフセック オサケ ユキチュア | Smart Label and Smart Label Web |
| JP2007305656A (en) * | 2006-05-09 | 2007-11-22 | Sumitomo Bakelite Co Ltd | Coil member |
| JP2014011796A (en) * | 2012-06-29 | 2014-01-20 | Lg Innotek Co Ltd | Antenna and manufacturing method thereof |
| JP2015046705A (en) * | 2013-08-27 | 2015-03-12 | デクセリアルズ株式会社 | Antenna device and communication device |
-
1998
- 1998-05-19 JP JP13626498A patent/JP3819147B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004527864A (en) * | 2001-05-31 | 2004-09-09 | ラフセック オサケ ユキチュア | Smart Label and Smart Label Web |
| JP2003085516A (en) * | 2001-09-07 | 2003-03-20 | Nec Tokin Corp | Non-contact communication medium, and manufacturing method for same |
| JP2007305656A (en) * | 2006-05-09 | 2007-11-22 | Sumitomo Bakelite Co Ltd | Coil member |
| JP2014011796A (en) * | 2012-06-29 | 2014-01-20 | Lg Innotek Co Ltd | Antenna and manufacturing method thereof |
| JP2015046705A (en) * | 2013-08-27 | 2015-03-12 | デクセリアルズ株式会社 | Antenna device and communication device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3819147B2 (en) | 2006-09-06 |
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