JPH1131643A - Spinner - Google Patents
SpinnerInfo
- Publication number
- JPH1131643A JPH1131643A JP18507597A JP18507597A JPH1131643A JP H1131643 A JPH1131643 A JP H1131643A JP 18507597 A JP18507597 A JP 18507597A JP 18507597 A JP18507597 A JP 18507597A JP H1131643 A JPH1131643 A JP H1131643A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- gripping
- supply nozzle
- cleaning water
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims abstract description 59
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000001035 drying Methods 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 238000005406 washing Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 75
- 238000005498 polishing Methods 0.000 description 30
- 239000000356 contaminant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ウェーハを洗浄す
るためのスピンナー装置に関する。[0001] The present invention relates to a spinner apparatus for cleaning a wafer.
【０００２】[0002]
【従来の技術】半導体製造工程で研磨されたウェーハ
は、表面にコンタミ（切削屑）等が付着しているため、
研磨後に洗浄が行われている。このウェーハの洗浄は、
通常洗浄装置のテーブルにウェーハを吸着させ、そのテ
ーブルを回転させながらウェーハの表面を洗浄し、洗浄
後に乾燥している。2. Description of the Related Art Wafers polished in a semiconductor manufacturing process have contaminants (cut chips) or the like attached to the surface thereof.
Cleaning is performed after polishing. Cleaning this wafer
Usually, a wafer is adsorbed on a table of a cleaning apparatus, and the surface of the wafer is cleaned while rotating the table, and dried after cleaning.
【０００３】[0003]
【発明が解決しようとする課題】前記従来の洗浄装置に
よると、ウェーハの表面は綺麗に洗浄できるが、テーブ
ルに吸着されたウェーハの裏面は洗浄できないという問
題がある。研磨時にコンタミ等がウェーハの裏面側に回
り込んで汚染することがあり、ウェーハの裏面も洗浄す
ることが要求される。この要求を満たすためには、ウェ
ーハの表面を洗浄・乾燥した後に、ウェーハをひっくり
返して裏面の洗浄・乾燥を行わねばならないが、手間が
掛かると共に作業能率を低下させることになる。According to the conventional cleaning apparatus, the front surface of the wafer can be cleaned cleanly, but the back surface of the wafer adsorbed on the table cannot be cleaned. During polishing, contaminants and the like may come around and contaminate the back surface of the wafer, and it is required to clean the back surface of the wafer. In order to satisfy this requirement, after cleaning and drying the front surface of the wafer, the wafer must be turned upside down to clean and dry the rear surface, but this requires much time and reduces the work efficiency.
【０００４】本発明は、このような従来の問題を解決す
るためになされ、研磨後にウェーハの表裏面を同時に洗
浄し、且つ乾燥できるようにしたスピンナー装置を提供
することを目的とする。An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a spinner device which can simultaneously clean and dry the front and back surfaces of a wafer after polishing.
【０００５】[0005]
【課題を解決するための手段】前記の目的を達成するた
めの手段として、本発明は、半導体ウェーハの外周の少
なくとも３箇所を把持するクランプと、このクランプを
支持し回転する回転体と、ウェーハの裏面を洗浄する裏
面洗浄水供給ノズルと、ウェーハの表面を洗浄する表面
洗浄水供給ノズルと、から少なくとも構成されるスピン
ナー装置を要旨とする。又、クランプは、ウェーハ把持
部と、回転部と、把持作用部とを含み、この把持作用部
の作用、非作用によってウェーハを把持又は開放するこ
と、クランプのウェーハ把持部は、バネで適宜の力で内
側に付勢されウェーハを把持し、この把持作用部の作用
によってバネの付勢に抗してウェーハを開放すること、
クランプの把持作用部は、回転部を中心にしてウェーハ
把持部と反対側に設けられ、回転体の回転の際、把持作
用部に生じる遠心力によって回転部の反対側にあるウェ
ーハ把持部に内向力を与え、バネの付勢と相俟ってウェ
ーハの把持力を増しウェーハの飛散を防止したこと、裏
面洗浄水供給ノズルと、表面洗浄水供給ノズルとの一方
又は両方が揺動してウェーハの全面を洗浄すること、裏
面洗浄水供給ノズルと、表面洗浄水供給ノズルとの一方
又は両方に超音波発生手段を配設したこと、ウェーハの
表裏面を乾燥させるための表面乾燥用エアー供給ノズル
と、裏面乾燥用エアー供給ノズルとが含まれること、ウ
ェーハを洗浄する際は、表面及び裏面洗浄水供給ノズル
から洗浄水が供給され、ウェーハを把持した回転体は比
較的低速で回転し、洗浄が終了した後は、洗浄水の供給
が停止されウェーハを把持した回転体は比較的高速で回
転してウェーハをスピン乾燥させること、ウェーハをス
ピン乾燥させる際に、表面及び裏面乾燥用エアー供給ノ
ズルからエアーが供給されウェーハの表面と裏面とをエ
アーブローすること、洗浄水の飛散を防止するために、
上部カバーと側部カバーとが配設されており、側部カバ
ーはウェーハの搬出入の際は少なくとも開状態になり、
ウェーハの洗浄、スピン乾燥の際は閉状態になること、
を要旨とするものである。As a means for achieving the above object, the present invention provides a clamp for gripping at least three locations on the outer periphery of a semiconductor wafer, a rotating body for supporting and rotating the clamp, and a wafer. The gist of the present invention is a spinner device including at least a back surface cleaning water supply nozzle for cleaning the back surface and a front surface cleaning water supply nozzle for cleaning the front surface of the wafer. In addition, the clamp includes a wafer gripping portion, a rotating portion, and a gripping portion, and grips or releases the wafer by the action or non-action of the gripping portion. Holding the wafer urged inward by force, and opening the wafer against the urging of the spring by the action of this gripping action part,
The gripping action part of the clamp is provided on the opposite side of the wafer gripping part with the rotating part as a center, and when the rotating body rotates, the centrifugal force generated in the gripping action part inwards the wafer gripping part on the opposite side of the rotating part. Force, combined with the bias of the spring, increased the gripping force of the wafer to prevent the wafer from scattering, and one or both of the back surface cleaning water supply nozzle and the front surface cleaning water supply nozzle oscillated, Cleaning the entire surface of the wafer, the back surface cleaning water supply nozzle, and the ultrasonic cleaning means disposed on one or both of the front surface cleaning water supply nozzle, the front surface drying air supply nozzle for drying the front and back surfaces of the wafer When cleaning the wafer, cleaning water is supplied from the front and back surface cleaning water supply nozzles, and the rotating body holding the wafer rotates at a relatively low speed. After cleaning is completed, the supply of cleaning water is stopped and the rotating body holding the wafer rotates at a relatively high speed to spin dry the wafer. When spin drying the wafer, supply air for front and back surface drying. Air is supplied from the nozzle to blow air on the front and back surfaces of the wafer, and to prevent scattering of cleaning water,
An upper cover and a side cover are provided, and the side cover is at least opened when loading / unloading the wafer,
Closed during wafer cleaning and spin drying,
It is the gist.
【０００６】[0006]
【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づいて詳説する。図１は、本発明に係るスピン
ナー装置１を示すもので、上部カバー１ａと、昇降自在
に形成された側部カバー１ｂとを有し、この側部カバー
１ｂはウェーハの出し入れの際は下降して開状態とな
り、ウェーハを洗浄・乾燥する際は上昇して閉状態とな
り、洗浄水等の飛散を防止できるようにしてある。Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a spinner device 1 according to the present invention, which has an upper cover 1a and a side cover 1b formed so as to be able to move up and down, and the side cover 1b is lowered when a wafer is taken in and out. When the wafer is cleaned and dried, it rises to a closed state, so that scattering of cleaning water and the like can be prevented.
【０００７】スピンナー装置１内のほぼ中央部には、略
円筒状の回転体２が装備され、この回転体２は図２に示
すように、下端に形成した縮径円筒部２ａの上下部がベ
アリング３によりそれぞれ支持され、駆動用モータ４及
び伝動ベルト５を介して低速から高速まで自在に軸回転
する。At a substantially central portion in the spinner device 1, a substantially cylindrical rotating body 2 is provided. As shown in FIG. 2, the rotating body 2 has upper and lower portions of a reduced diameter cylindrical portion 2a formed at the lower end. Each is supported by a bearing 3, and rotates freely from a low speed to a high speed via a driving motor 4 and a transmission belt 5.
【０００８】前記回転体２の上部には、図３のようにウ
ェーハＷの外周部を把持するクランプ６が複数個（図例
では４個であるが３個でも良い）設けられている。この
クランプ６は、回転体２の上縁部に形成された切欠部２
ｂに取り付けられたウェーハ把持部６ａと、回転部６ｂ
と、被把持作用部６ｃと、回転体２の内部に取り付けら
れた把持作用部６ｆとを含む構成になっている。As shown in FIG. 3, a plurality of clamps 6 (four in the illustrated example, but may be three) are provided on the rotating body 2 as shown in FIG. The clamp 6 has a notch 2 formed at the upper edge of the rotating body 2.
b, a wafer gripper 6a attached to the
, A gripping action part 6c, and a gripping action part 6f attached inside the rotating body 2.
【０００９】前記ウェーハ把持部６ａは、回転部６ｂに
バネ６ｄが装着されて内側に付勢され、前記被把持作用
部６ｃは、図２に示すようにシリンダ６ｅにより昇降可
能に形成された把持作用部６ｆの作用を受ける。そし
て、この把持作用部６ｆの作用、非作用によってクラン
プ６を動かし、ウェーハ把持部６ａの把持又は開放操作
を行う。The wafer gripping portion 6a is urged inward by a spring 6d mounted on a rotating portion 6b, and the gripping action portion 6c is lifted and lowered by a cylinder 6e as shown in FIG. The action of the action section 6f is received. Then, the clamp 6 is moved by the operation and non-operation of the gripping action part 6f to perform the gripping or releasing operation of the wafer gripping part 6a.
【００１０】即ち、図３に実線で示すように、把持作用
部６ｆでクランプ６の下端部である被把持作用部６ｃを
突き上げている時には、バネ６ｄの付勢に抗してウェー
ハ把持部６ａが外側に逃がされてウェーハＷを開放状態
にするが、把持作用部６ｆを下げて突き上げを解除した
時には、仮想線で示すようにバネ６ｄの付勢力によりウ
ェーハ把持部６ａが内側に回転してウェーハＷを把持状
態にする。That is, as shown by the solid line in FIG. 3, when the gripping action portion 6f is pushing up the gripping action portion 6c, which is the lower end of the clamp 6, the wafer gripping portion 6a is pressed against the bias of the spring 6d. Is released to open the wafer W, but when the gripping action portion 6f is lowered and the thrust is released, the wafer gripping portion 6a is rotated inward by the urging force of the spring 6d as shown by a virtual line. To bring the wafer W into a gripping state.
【００１１】７は表面洗浄水供給ノズル、８は表面乾燥
用エアー供給ノズルであり、前記回転体２の外側に沿っ
てスピンナー装置１内に隣接配置され、これらの先端部
はいずれも揺動可能に形成され、前記クランプ６により
把持されるウェーハＷの上面に臨ませてある。Reference numeral 7 denotes a surface cleaning water supply nozzle, and 8 denotes a surface drying air supply nozzle, which is disposed adjacent to the inside of the spinner device 1 along the outside of the rotating body 2, and both of their tips can swing. And faces the upper surface of the wafer W gripped by the clamp 6.
【００１２】９は裏面洗浄水供給ノズル、１０は裏面乾
燥用エアー供給ノズルであり、回転体２の中央部に沿っ
て隣接配置され、これらの先端部はいずれも揺動可能に
形成され、前記クランプ６により把持されるウェーハＷ
の下面に臨ませてある。Reference numeral 9 denotes a back surface cleaning water supply nozzle, and 10 denotes a back surface drying air supply nozzle, which is disposed adjacent to the center of the rotating body 2 and whose tip portions are formed to be swingable. Wafer W held by clamp 6
It faces the lower surface of.
【００１３】前記各ノズルの揺動速度は調整できるよう
に構成し、表面洗浄水供給ノズル７と裏面洗浄水供給ノ
ズル９との一方又は両方に超音波発生手段（図略）を設
けて洗浄効果を上げることもある。尚、図１において、
１１は側部カバー１ｂを昇降させるためのシリンダであ
り、そのロッド１１ａの上端部が側部カバー１ｂに連結
されている。The oscillating speed of each of the nozzles is configured to be adjustable, and one or both of the front surface cleaning water supply nozzle 7 and the back surface cleaning water supply nozzle 9 is provided with an ultrasonic wave generating means (not shown) to provide a cleaning effect. May be raised. In FIG. 1,
Reference numeral 11 denotes a cylinder for raising and lowering the side cover 1b, and an upper end of a rod 11a thereof is connected to the side cover 1b.
【００１４】このように構成されたスピンナー装置１
は、例えば図４に示すウェーハ研磨装置Ａに組み込まれ
て使用される。このウェーハ研磨装置Ａにおいては、先
ずカセットＣ内に収容されたウェーハＷが搬出入手段Ｂ
によって搬出されると共に、スピンナー装置１の隣に配
設されたスポンジロール部Ｄに位置付けられ、ここでウ
ェーハＷの裏面が洗浄される。The spinner device 1 configured as described above
Is used by being incorporated in, for example, a wafer polishing apparatus A shown in FIG. In this wafer polishing apparatus A, first, the wafer W stored in the cassette C is loaded and unloaded by the loading / unloading means B.
And is positioned at a sponge roll D disposed next to the spinner device 1, where the back surface of the wafer W is cleaned.
【００１５】洗浄後に、ウェーハＷは搬送手段Ｅによっ
てチャックテーブルＴ上に搬送され、吸引保持される。
この際、ウェーハＷの裏面は既に洗浄済みであるから、
ウェーハの裏面とチャックテーブルＴの上面との間にゴ
ミ等が挾み込まれることはない。従って、研磨時でのマ
イクロクラックの発生や面内厚さのバラツキ等を未然に
防止することができる。After the cleaning, the wafer W is transferred onto the chuck table T by the transfer means E, and is held by suction.
At this time, since the back surface of the wafer W has already been cleaned,
No dust is trapped between the back surface of the wafer and the upper surface of the chuck table T. Therefore, it is possible to prevent the occurrence of microcracks during polishing and the variation in in-plane thickness.
【００１６】チャックテーブルＴに保持されたウェーハ
Ｗは、ターンテーブルＦを回転することで研磨機Ｇに位
置付けられ、表面が研磨される。研磨機Ｇは、隣接して
２台配設されており、一方を粗研磨用、他方を仕上げ研
磨用とした場合には、粗研磨用の研磨機で研磨した後、
ターンテーブルＦを回転させて仕上げ研磨用の研磨機に
位置付け、仕上げ研磨がなされる。The wafer W held on the chuck table T is positioned on the polishing machine G by rotating the turntable F, and its surface is polished. Two polishers G are provided adjacent to each other. When one is used for rough polishing and the other is used for finish polishing, after polishing with a polishing machine for rough polishing,
The turntable F is rotated and positioned on a polishing machine for finish polishing, and finish polishing is performed.
【００１７】研磨後に、ターンテーブルＦを回転させて
チャックテーブルＴを前記搬送手段Ｅに位置付け、この
搬送手段ＥでウェーハＷを吸着して前記スピンナー装置
１に搬送する。この時、スピンナー装置１の側部カバー
１ｂは開状態にされている。After the polishing, the turntable F is rotated to position the chuck table T on the transfer means E. The wafer W is sucked by the transfer means E and transferred to the spinner device 1. At this time, the side cover 1b of the spinner device 1 is open.
【００１８】この後、前記クランプ６によりウェーハＷ
の外周部が把持されると搬送手段Ｅが退避し、側部カバ
ー１ｂが上昇して閉状態となり、ウェーハＷの洗浄が開
始される。Thereafter, the wafer W is clamped by the clamp 6.
When the outer peripheral portion is grasped, the transfer means E is retracted, the side cover 1b is raised and closed, and the cleaning of the wafer W is started.
【００１９】このウェーハＷの洗浄は、前記クランプ６
によりウェーハＷを把持したままで回転体２を比較的低
速で回転させ、前記表面洗浄水供給ノズル７及び裏面洗
浄水供給ノズル９から洗浄水を噴射させ、且つ一方又は
両方のノズルを揺動させてウェーハＷの表裏面を同時に
洗浄する。The cleaning of the wafer W is performed by the clamp 6
By rotating the rotating body 2 at a relatively low speed while holding the wafer W, the cleaning water is sprayed from the front surface cleaning water supply nozzle 7 and the back surface cleaning water supply nozzle 9 and one or both nozzles are swung. Then, the front and back surfaces of the wafer W are simultaneously cleaned.
【００２０】洗浄後は、ウェーハＷを把持したまま回転
体２を比較的高速で回転させ、前記表面乾燥用エアー供
給ノズル８及び裏面乾燥用エアー供給ノズル１０からエ
アーを噴射させ、ウェーハＷの表裏面をエアーブローし
ながらスピン乾燥させる。After cleaning, the rotating body 2 is rotated at a relatively high speed while holding the wafer W, and air is jetted from the front surface drying air supply nozzle 8 and the back surface drying air supply nozzle 10 so that the front surface of the wafer W is Spin dry while air blowing the back side.
【００２１】ウェーハＷの洗浄時及び乾燥時において、
回転体２の回転の際、ウェーハ把持部６ａの下端にある
被把持作用部６ｃに遠心力が生じ、回転部６ｂの反対側
にあるウェーハ把持部６ａに内力を与え、バネ６ｄの付
勢と相俟ってウェーハＷの把持力を増強し、ウェーハＷ
の飛散を防止することができる。At the time of cleaning and drying the wafer W,
When the rotating body 2 rotates, a centrifugal force is generated in the gripping action portion 6c at the lower end of the wafer gripping portion 6a, and an internal force is applied to the wafer gripping portion 6a on the opposite side of the rotating portion 6b, and the spring 6d is biased. Together, the gripping force of the wafer W is enhanced and the wafer W
Can be prevented from scattering.
【００２２】スピン乾燥後、側部カバー１ｂが下降して
開状態となり、前記搬出入手段ＢがウェーハＷに位置付
けられる。この搬出入手段ＢがウェーハＷを把持すると
クランプ６が開放状態となり、ウェーハＷは搬出入手段
Ｂによって前記カセットＣ内に収容される。After the spin drying, the side cover 1b is lowered to be in an open state, and the carrying-in / out means B is positioned on the wafer W. When the loading / unloading means B grips the wafer W, the clamp 6 is opened, and the wafer W is stored in the cassette C by the loading / unloading means B.
【００２３】このような一連の工程は、タイミングを取
りながら連続的且つ効率的に行われる。前記スピナー装
置１、スポンジロール部Ｄ、搬送手段１１は図４に示す
ようにそれぞれ左右一対配設され、つまり２系列となっ
ており、配設された２台の研磨機Ｇと関連させて、ウェ
ーハに応じた種々のルートを設定することができる。Such a series of steps is performed continuously and efficiently while taking timing. As shown in FIG. 4, the spinner device 1, the sponge roll unit D, and the conveying means 11 are arranged in a pair on the left and right, that is, in two lines, and in association with the two polishing machines G arranged, Various routes can be set according to the wafer.
【００２４】即ち、前記研磨ルートでは１系列を利用し
たのみであるが、例えば２台の研磨機Ｇをいずれも仕上
げ研磨用に設定して２系列を同時に使用すれば、ウェー
ハの仕上げ研磨作業を２倍の効率で行うことができる。
又、一方の研磨機を粗研磨用、他方を仕上げ研磨用に設
定して２系列を選択使用すれば、一方のカセットＣから
搬出したウェーハを粗研磨及び仕上げ研磨した後、他方
のカセットＣ′に収容するといった一連のＵ字型ルート
で研磨作業を行うこともできる。ウェーハの研磨目的に
合わせてルートを設定することで、高能率の研磨作業が
可能となる。That is, in the above-mentioned polishing route, only one line is used. For example, if two polishing machines G are both set for finish polishing and two lines are used at the same time, the finish polishing operation of the wafer can be performed. It can be performed with twice the efficiency.
In addition, if one polishing machine is set for rough polishing and the other is set for finish polishing and two series are selectively used, after the wafer carried out from one cassette C is roughly polished and finished polished, the other cassette C ' The polishing operation can be performed by a series of U-shaped routes such as accommodating in a polishing machine. By setting a route according to the purpose of polishing a wafer, highly efficient polishing can be performed.
【００２５】[0025]
【発明の効果】以上説明したように、本発明によるスピ
ンナー装置は、ウェーハの表裏面を同時に洗浄し、且つ
乾燥できるようにしたので、研磨後に行うウェーハの洗
浄・乾燥工程を簡略化すると共に、その作業能率を著し
く向上させることができる等の優れた効果を奏する。As described above, the spinner apparatus according to the present invention can simultaneously clean and dry the front and back surfaces of the wafer, thereby simplifying the steps of cleaning and drying the wafer after polishing. An excellent effect is obtained such that the work efficiency can be remarkably improved.
【図１】本発明に係るスピンナー装置を示す斜視図であ
る。FIG. 1 is a perspective view showing a spinner device according to the present invention.
【図２】スピンナー装置要部の断面図である。FIG. 2 is a sectional view of a main part of the spinner device.
【図３】クリップを示す拡大図である。FIG. 3 is an enlarged view showing a clip.
【図４】スピンナー装置を組み込んだウェーハ研磨装置
の一例を示す斜視図である。FIG. 4 is a perspective view showing an example of a wafer polishing apparatus incorporating a spinner device.
１…スピンナー装置 ２…回転体 ３…ベアリング ４…駆動用モータ ５…伝動ベルト ６…クランプ ６ａ…ウェーハ把持部 ６ｂ…回転部 ６ｃ…把持
作用部 ７…表面洗浄水供給ノズル ８…表面乾燥用エアー供給ノズル ９…裏面洗浄水供給ノズル １０…裏面乾燥用エアー供給ノズル １１…シリンダDESCRIPTION OF SYMBOLS 1 ... Spinner device 2 ... Rotating body 3 ... Bearing 4 ... Driving motor 5 ... Driving belt 6 ... Clamp 6a ... Wafer gripping part 6b ... Rotating part 6c ... Gripping action part 7 ... Surface cleaning water supply nozzle 8 ... Surface drying air Supply nozzle 9 ... Backside cleaning water supply nozzle 10 ... Backside drying air supply nozzle 11 ... Cylinder
Claims (10)
を把持するクランプと、このクランプを支持し回転する
回転体と、ウェーハの裏面を洗浄する裏面洗浄水供給ノ
ズルと、ウェーハの表面を洗浄する表面洗浄水供給ノズ
ルと、から少なくとも構成されるスピンナー装置。1. A clamp for gripping at least three locations on the outer periphery of a semiconductor wafer, a rotating body supporting and rotating the clamp, a back surface cleaning water supply nozzle for cleaning the back surface of the wafer, and a front surface for cleaning the front surface of the wafer. A washing water supply nozzle.
と、把持作用部とを含み、この把持作用部の作用、非作
用によってウェーハを把持又は開放する請求項１記載の
スピンナー装置。2. The spinner device according to claim 1, wherein the clamp includes a wafer gripping section, a rotating section, and a gripping section, and grips or releases the wafer by the operation or non-operation of the gripping section.
の力で内側に付勢されウェーハを把持し、この把持作用
部の作用によってバネの付勢に抗してウェーハを開放す
る請求項２記載のスピンナー装置。3. The wafer gripping portion of the clamp is biased inward by an appropriate force by a spring to grip the wafer, and the wafer is released against the bias of the spring by the action of the gripping portion. The spinner device as described.
してウェーハ把持部と反対側に設けられ、回転体の回転
の際、把持作用部に生じる遠心力によって回転部の反対
側にあるウェーハ把持部に内向力を与え、バネの付勢と
相俟ってウェーハの把持力を増しウェーハの飛散を防止
した請求項２、３記載のスピンナー装置。4. The gripping action portion of the clamp is provided on the opposite side of the rotating portion from the wafer gripping portion, and is located on the opposite side of the rotating portion due to centrifugal force generated in the gripping action portion when the rotating body rotates. 4. The spinner device according to claim 2, wherein an inward force is applied to the wafer gripping portion to increase the gripping force of the wafer in combination with the bias of the spring to prevent the wafer from scattering.
ノズルとの一方又は両方が揺動してウェーハの全面を洗
浄する請求項１、２、３、４記載のスピンナー装置。5. The spinner device according to claim 1, wherein one or both of the back surface cleaning water supply nozzle and the front surface cleaning water supply nozzle oscillate to clean the entire surface of the wafer.
ノズルとの一方又は両方に超音波発生手段を配設した請
求項１、２、３、４、５記載のスピンナー装置。6. The spinner device according to claim 1, wherein one or both of the back surface cleaning water supply nozzle and the front surface cleaning water supply nozzle is provided with an ultrasonic wave generating means.
乾燥用エアー供給ノズルと、裏面乾燥用エアー供給ノズ
ルとが含まれる請求項１、２、３、４、５、６記載のス
ピンナー装置。7. The spinner device according to claim 1, further comprising an air supply nozzle for drying the front and back surfaces of the wafer and an air supply nozzle for drying the back surface.
浄水供給ノズルから洗浄水が供給され、ウェーハを把持
した回転体は比較的低速で回転し、洗浄が終了した後
は、洗浄水の供給が停止されウェーハを把持した回転体
は比較的高速で回転してウェーハをスピン乾燥させる請
求項１、２、３、４、５、６、７記載のスピンナー装
置。8. When cleaning the wafer, cleaning water is supplied from the front and back surface cleaning water supply nozzles, the rotating body holding the wafer rotates at a relatively low speed, and after the cleaning is completed, the cleaning water is supplied. 8. The spinner device according to claim 1, wherein the supply is stopped and the rotating body holding the wafer rotates at a relatively high speed to spin dry the wafer.
び裏面乾燥用エアー供給ノズルからエアーが供給されウ
ェーハの表面と裏面とをエアーブローする請求項８記載
のスピンナー装置。9. The spinner device according to claim 8, wherein when spin-drying the wafer, air is supplied from an air supply nozzle for drying the front and rear surfaces to blow air on the front and rear surfaces of the wafer.
バーと側部カバーとが配設されており、側部カバーはウ
ェーハの搬出入の際は少なくとも開状態になり、ウェー
ハの洗浄、スピン乾燥の際は閉状態になる請求項１、
２、３、４、５、６、７、８、９記載のスピンナー装
置。10. An upper cover and a side cover are provided to prevent scattering of cleaning water, and the side cover is at least opened when a wafer is carried in and out, so that cleaning and cleaning of the wafer can be performed. Claim 1, which is in a closed state during spin drying.
2. The spinner device according to 2, 3, 4, 5, 6, 7, 8, or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18507597A JP4089837B2 (en) | 1997-07-10 | 1997-07-10 | Spinner device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18507597A JP4089837B2 (en) | 1997-07-10 | 1997-07-10 | Spinner device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1131643A true JPH1131643A (en) | 1999-02-02 |
| JP4089837B2 JP4089837B2 (en) | 2008-05-28 |
Family
ID=16164388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18507597A Expired - Lifetime JP4089837B2 (en) | 1997-07-10 | 1997-07-10 | Spinner device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4089837B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100333362B1 (en) * | 1999-09-16 | 2002-04-18 | 박종섭 | Wafer fixing equipment |
| JP2002367947A (en) * | 2001-06-08 | 2002-12-20 | Rix Corp | Method and equipment for cleaning flux and foreign matter of wafer |
| JP2003059875A (en) * | 2001-08-09 | 2003-02-28 | Disco Abrasive Syst Ltd | Polishing apparatus |
| JP2011018802A (en) * | 2009-07-09 | 2011-01-27 | Disco Abrasive Syst Ltd | Grinding apparatus |
| US8261758B2 (en) * | 2006-08-17 | 2012-09-11 | Novellus Systems, Inc. | Apparatus and method for cleaning and removing liquids from front and back sides of a rotating workpiece |
| JP2015204322A (en) * | 2014-04-11 | 2015-11-16 | 株式会社ディスコ | Cleaning device |
| KR20170120024A (en) | 2016-04-20 | 2017-10-30 | 가부시기가이샤 디스코 | Cleaning apparatus |
| KR20190135592A (en) * | 2018-05-29 | 2019-12-09 | 주식회사 케이씨텍 | Substrate processing apparatus |
| DE102021211536A1 (en) | 2020-10-22 | 2022-04-28 | Disco Corporation | CLEANING DEVICE |
-
1997
- 1997-07-10 JP JP18507597A patent/JP4089837B2/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100333362B1 (en) * | 1999-09-16 | 2002-04-18 | 박종섭 | Wafer fixing equipment |
| JP2002367947A (en) * | 2001-06-08 | 2002-12-20 | Rix Corp | Method and equipment for cleaning flux and foreign matter of wafer |
| JP2003059875A (en) * | 2001-08-09 | 2003-02-28 | Disco Abrasive Syst Ltd | Polishing apparatus |
| US8261758B2 (en) * | 2006-08-17 | 2012-09-11 | Novellus Systems, Inc. | Apparatus and method for cleaning and removing liquids from front and back sides of a rotating workpiece |
| JP2011018802A (en) * | 2009-07-09 | 2011-01-27 | Disco Abrasive Syst Ltd | Grinding apparatus |
| JP2015204322A (en) * | 2014-04-11 | 2015-11-16 | 株式会社ディスコ | Cleaning device |
| KR20170120024A (en) | 2016-04-20 | 2017-10-30 | 가부시기가이샤 디스코 | Cleaning apparatus |
| KR20190135592A (en) * | 2018-05-29 | 2019-12-09 | 주식회사 케이씨텍 | Substrate processing apparatus |
| DE102021211536A1 (en) | 2020-10-22 | 2022-04-28 | Disco Corporation | CLEANING DEVICE |
| KR20220053473A (en) | 2020-10-22 | 2022-04-29 | 가부시기가이샤 디스코 | Cleaning apparatus |
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| Publication number | Publication date |
|---|---|
| JP4089837B2 (en) | 2008-05-28 |
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