JPH11298113A - Manufacture of flexible printed wiring board - Google Patents
Manufacture of flexible printed wiring boardInfo
- Publication number
- JPH11298113A JPH11298113A JP10104906A JP10490698A JPH11298113A JP H11298113 A JPH11298113 A JP H11298113A JP 10104906 A JP10104906 A JP 10104906A JP 10490698 A JP10490698 A JP 10490698A JP H11298113 A JPH11298113 A JP H11298113A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- laser irradiation
- potassium permanganate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laser Beam Processing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線板の部品接続用開口部の形成方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming an opening for connecting parts of a flexible printed wiring board.
【０００２】[0002]
【従来の技術】フレキシブルプリント配線板において、
部品接続用のため直径０．５ｍｍ以下の開口部形成には
レーザ照射による加工がなされているが、特に炭酸ガス
レーザにおいて、回路作成後に被覆される片面に接着剤
層を有するポリイミドフィルム等からなる絶縁樹脂を開
口する場合、レーザ照射によりポリイミドフィルムとエ
ポキシ樹脂等からなる接着剤の炭化物が開口部周辺に生
じる。この炭化物及びレーザ照射でも除去できない接着
剤薄膜を除去するためには、アルカリ性の過マンガン酸
カリウム水溶液等でエッチング処理する方法が知られて
いる。しかし過マンガン酸カリウム水溶液でエッチング
する方法は、ポリイミドフィルムや接着剤の成分である
エポキシ樹脂等も溶解されるが、完全に溶解するために
は長い時間が必要となり、余分な部分まで溶解される場
合もあり、フレキシブルプリント配線板の特徴である屈
曲性、耐折性等の諸特性を劣化させる恐れがあった。2. Description of the Related Art In a flexible printed wiring board,
The opening with a diameter of 0.5 mm or less is formed by laser irradiation for the purpose of connecting parts. In particular, in the case of a carbon dioxide laser, insulation made of a polyimide film or the like having an adhesive layer on one side to be coated after circuit creation When the resin is opened, carbides of an adhesive composed of a polyimide film and an epoxy resin are generated around the opening by laser irradiation. In order to remove the carbide and the adhesive thin film that cannot be removed even by laser irradiation, a method of etching with an alkaline potassium permanganate aqueous solution or the like is known. However, in the method of etching with an aqueous solution of potassium permanganate, a polyimide film or an epoxy resin which is a component of an adhesive is also dissolved, but a long time is required for complete dissolution, and an excess portion is dissolved. In some cases, there is a possibility that various characteristics such as flexibility and folding resistance, which are characteristics of the flexible printed wiring board, may be degraded.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、部品接続用
開口部に付着している不要な炭化物及び接着剤薄膜の除
去を上記のような従来の方法の過マンガン酸カリウム水
溶液によるエッチング処理のみでの影響を緩和させるた
めに種々の検討の結果なされたもので、その目的とする
ところは、品質の劣化を極力抑えたフレキシブルプリン
ト配線板の製造方法を提供することにある。SUMMARY OF THE INVENTION According to the present invention, an unnecessary carbide and an adhesive thin film adhered to an opening for connecting a component are removed only by etching with a potassium permanganate aqueous solution according to the conventional method as described above. The purpose of the present invention is to provide a method of manufacturing a flexible printed wiring board in which quality deterioration is suppressed as much as possible.
【０００４】[0004]
【課題を解決するための手段】本発明は、部品接続用の
レーザ加工による開口部を形成する際に発生する問題点
を、超音波水洗工程を加えることで、その後の過マンガ
ン酸カリウム水溶液によるエッチング処理を緩和させる
ことを特徴とするフレキシブルプリント配線板の製造方
法である。即ち本発明は、熱可塑性樹脂フィルムを基材
とし、回路が形成され回路の上が、接着剤層を有する絶
縁樹脂フィルムにより被覆されたフレキシブルプリント
配線板の部品接続用開口部をレーザ照射により形成し、
レーザ照射後に生じる炭化物及び接着剤薄膜を超音波に
より水洗し、次いで過マンガン酸カリウム水溶液による
エッチング処理により除去することを特徴とするフレキ
シブルプリント配線板の製造方法であり、好ましくはレ
ーザ照射が、炭酸ガスレーザ照射であるフレキシブルプ
リント配線板の製造方法である。SUMMARY OF THE INVENTION The present invention solves a problem that occurs when an opening is formed by laser processing for connecting parts, by adding an ultrasonic water washing step to a subsequent process using an aqueous potassium permanganate solution. A method of manufacturing a flexible printed wiring board, wherein an etching process is moderated. That is, the present invention uses a thermoplastic resin film as a base material, a circuit is formed thereon, and a circuit connection is formed by laser irradiation on a component connection opening of a flexible printed wiring board covered with an insulating resin film having an adhesive layer. And
A method for manufacturing a flexible printed wiring board, comprising washing a carbide and an adhesive thin film generated after laser irradiation with ultrasonic waves, and then removing the thin film by etching with a potassium permanganate aqueous solution. This is a method for manufacturing a flexible printed wiring board by gas laser irradiation.
【０００５】[0005]
【発明の実施の形態】以下、本発明を具体的に説明す
る。本発明に用いるフレキシブルプリント配線板の素材
は、ポリエステル樹脂フィルム、ポリイミド樹脂フィル
ム等の熱可塑性樹脂フィルムからなる絶縁基材の片面も
しくは両面に銅箔を張り合わせたものである。また、回
路パッド上を被覆し絶縁樹脂被覆層となる絶縁樹脂フィ
ルムについても、接着剤が塗布されたポリイミド樹脂等
のフィルムのものでよい。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below. The material of the flexible printed wiring board used in the present invention is obtained by laminating a copper foil on one or both surfaces of an insulating base made of a thermoplastic resin film such as a polyester resin film or a polyimide resin film. Also, the insulating resin film that covers the circuit pads and becomes the insulating resin coating layer may be a film of a polyimide resin or the like to which an adhesive is applied.
【０００６】更に詳細に説明すると、フレキシブルプリ
ント配線板の部品接続用の開口部は、炭酸ガスレーザの
照射により、ポリイミド樹脂等のフィルムの絶縁樹脂被
覆層とエポキシ樹脂等からなる接着剤層を除去し、形成
する。炭酸ガスレーザ照射後に生じる絶縁樹脂と接着剤
の炭化物を超音波水洗により除去し、次いで接着剤薄膜
の残渣をアルカリ性溶剤等で膨潤させ、過マンガン酸カ
リウム水溶液によりその薄膜を除去し、その後硫酸等で
還元し、水洗により完了する。More specifically, the opening for connecting components of the flexible printed wiring board is irradiated with carbon dioxide laser to remove the insulating resin coating layer of a film of polyimide resin or the like and the adhesive layer of epoxy resin or the like. ,Form. The carbonization of the insulating resin and the adhesive generated after the carbon dioxide laser irradiation is removed by ultrasonic water washing, the residue of the adhesive thin film is swollen with an alkaline solvent or the like, the thin film is removed with an aqueous potassium permanganate solution, and then sulfuric acid or the like is used. Reduce and complete by washing with water.
【０００７】本発明で用いる過マンガン酸カリウム溶液
の濃度は３５〜７０ｇ／Ｌであり、好ましくは４５〜５
５ｇ／Ｌである。また、温度は３５〜８０℃であり、好
ましくは４５〜６０℃である。４０℃未満ではエッチン
グ効果が乏しく、また８０℃を越えると、ポリイミド樹
脂等のフィルム表面と、接着剤層までが溶解されあまり
好ましくない。The concentration of the potassium permanganate solution used in the present invention is 35 to 70 g / L, preferably 45 to 5 g / L.
It is 5 g / L. Further, the temperature is 35 to 80C, preferably 45 to 60C. If the temperature is lower than 40 ° C., the etching effect is poor. If the temperature exceeds 80 ° C., the surface of the film such as a polyimide resin and the adhesive layer are dissolved, which is not preferable.
【０００８】また、従来技術では、レーザ開口部の直
径、加工するポリイミド樹脂等のフィルム厚さ等の条件
によって異なるが、過マンガン酸カリウム水溶液は１８
０〜６００秒程度の処理時間が必要であったが、本発明
に従うと、過マンガン酸カリウム水溶液の処理時間は５
〜９０秒程度にまで短縮可能となり、ポリイミド樹脂等
のフィルム表面や接着剤層が溶解されるエッチング量は
従来技術と比較して４０％以上軽減可能となる。これに
より、フレキシブルプリント配線板の特徴である屈曲性
や耐折性等の諸特性が、試験条件によっても異なるが、
５〜１０％向上する。Further, in the prior art, although it varies depending on conditions such as the diameter of the laser opening and the film thickness of the polyimide resin or the like to be processed, the aqueous solution of potassium permanganate is 18
Although a treatment time of about 0 to 600 seconds was required, according to the present invention, the treatment time of the aqueous potassium permanganate solution was 5 to 5 seconds.
This can be reduced to about 90 seconds, and the amount of etching that dissolves the film surface of the polyimide resin or the like and the adhesive layer can be reduced by 40% or more compared to the prior art. As a result, the characteristics of the flexible printed wiring board, such as flexibility and folding resistance, vary depending on the test conditions.
5-10% improvement.
【０００９】従来技術では、炭化物と接着剤薄膜の除去
を過マンガン酸カリウム水溶液によるエッチングで同時
に行うため、長時間の処理が必要となり、素材に与える
影響が大きかった。本発明では、炭化物の除去を超音波
水洗によって行うことにより、過マンガン酸カリウム水
溶液によるエッチングは接着剤薄膜除去だけを行えばよ
いことになり、処理時間を短縮し、素材に与える影響を
極力抑えることが可能となった。In the prior art, since the carbide and the adhesive thin film are simultaneously removed by etching with an aqueous solution of potassium permanganate, a long time treatment is required, and the influence on the material is great. In the present invention, by removing the carbides by ultrasonic water washing, etching with an aqueous potassium permanganate solution only needs to remove the adhesive thin film, shortening the processing time and minimizing the effect on the material. It became possible.
【００１０】[0010]
【発明の効果】本発明の方法に従うと、絶縁基材の片面
もしくは両面に回路を形成し、回路パッド上を絶縁樹脂
フィルムで被覆したフレキシブルプリント配線板の部品
接続用開口部を形成する際に、炭酸ガスレーザ照射後に
生じる炭化物を超音波水洗によって除去することによ
り、過マンガン酸カリウム水溶液のエッチング処理時間
を短縮し、品質の劣化を抑えることが可能である。According to the method of the present invention, a circuit is formed on one or both surfaces of an insulating base material, and when forming an opening for component connection of a flexible printed wiring board in which circuit pads are covered with an insulating resin film. By removing the carbide generated after the carbon dioxide laser irradiation by ultrasonic water washing, it is possible to shorten the etching time of the aqueous solution of potassium permanganate and to suppress deterioration in quality.
Claims (2)
が形成され回路の上が、接着剤層を有する絶縁樹脂フィ
ルムにより被覆されたフレキシブルプリント配線板の部
品接続用開口部をレーザ照射により形成し、レーザ照射
後に生じる炭化物及び接着剤薄膜を超音波により水洗
し、次いで過マンガン酸カリウム水溶液によるエッチン
グ処理により除去することを特徴とするフレキシブルプ
リント配線板の製造方法。1. A circuit is formed using a thermoplastic resin film as a base material, and an opening for component connection of a flexible printed wiring board is formed by laser irradiation on the circuit, which is covered with an insulating resin film having an adhesive layer. A method for manufacturing a flexible printed wiring board, comprising: washing a carbide and an adhesive thin film generated after laser irradiation with ultrasonic waves; and removing the thin film by etching with an aqueous solution of potassium permanganate.
る請求項１記載のフレキシブルプリント配線板の製造方
法。2. The method for manufacturing a flexible printed wiring board according to claim 1, wherein the laser irradiation is carbon dioxide laser irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10104906A JPH11298113A (en) | 1998-04-15 | 1998-04-15 | Manufacture of flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10104906A JPH11298113A (en) | 1998-04-15 | 1998-04-15 | Manufacture of flexible printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11298113A true JPH11298113A (en) | 1999-10-29 |
Family
ID=14393175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10104906A Pending JPH11298113A (en) | 1998-04-15 | 1998-04-15 | Manufacture of flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11298113A (en) |
-
1998
- 1998-04-15 JP JP10104906A patent/JPH11298113A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040602 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20041102 |